DE2022717A1 - Halbleiterbauelement - Google Patents

Halbleiterbauelement

Info

Publication number
DE2022717A1
DE2022717A1 DE19702022717 DE2022717A DE2022717A1 DE 2022717 A1 DE2022717 A1 DE 2022717A1 DE 19702022717 DE19702022717 DE 19702022717 DE 2022717 A DE2022717 A DE 2022717A DE 2022717 A1 DE2022717 A1 DE 2022717A1
Authority
DE
Germany
Prior art keywords
semiconductor body
metallic
contact pin
connecting wire
end section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702022717
Other languages
German (de)
English (en)
Inventor
Johannes Dipl-Phys Dr Nier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19702022717 priority Critical patent/DE2022717A1/de
Priority to JP11526270A priority patent/JPS4914786B1/ja
Priority to US3720999D priority patent/US3720999A/en
Priority to GB1315771A priority patent/GB1348521A/en
Priority to FR7116382A priority patent/FR2088459B2/fr
Priority to IT2424271A priority patent/IT982341B/it
Priority to NL7106298A priority patent/NL7106298A/xx
Publication of DE2022717A1 publication Critical patent/DE2022717A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Wire Bonding (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
DE19702022717 1970-05-09 1970-05-09 Halbleiterbauelement Pending DE2022717A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement
JP11526270A JPS4914786B1 (cg-RX-API-DMAC7.html) 1970-05-09 1970-12-22
US3720999D US3720999A (en) 1970-05-09 1971-04-29 Method of assembling transistors
GB1315771A GB1348521A (en) 1970-05-09 1971-05-05 Methods of making semiconductor components
FR7116382A FR2088459B2 (cg-RX-API-DMAC7.html) 1970-05-09 1971-05-06
IT2424271A IT982341B (it) 1970-05-09 1971-05-07 Componente a semiconduttori
NL7106298A NL7106298A (cg-RX-API-DMAC7.html) 1970-05-09 1971-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022717 DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Publications (1)

Publication Number Publication Date
DE2022717A1 true DE2022717A1 (de) 1971-12-02

Family

ID=5770671

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702022717 Pending DE2022717A1 (de) 1970-05-09 1970-05-09 Halbleiterbauelement

Country Status (7)

Country Link
US (1) US3720999A (cg-RX-API-DMAC7.html)
JP (1) JPS4914786B1 (cg-RX-API-DMAC7.html)
DE (1) DE2022717A1 (cg-RX-API-DMAC7.html)
FR (1) FR2088459B2 (cg-RX-API-DMAC7.html)
GB (1) GB1348521A (cg-RX-API-DMAC7.html)
IT (1) IT982341B (cg-RX-API-DMAC7.html)
NL (1) NL7106298A (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245176Y2 (cg-RX-API-DMAC7.html) * 1973-09-19 1977-10-14
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
DE3513530A1 (de) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau
US4674166A (en) * 1984-12-18 1987-06-23 At&T Technologies, Inc. Spring clip transfer apparatus
US4582245A (en) * 1984-12-18 1986-04-15 At&T Technologies, Inc. Method and apparatus for automated spring clip insertion and removal
US4689866A (en) * 1984-12-18 1987-09-01 American Telephone And Telegraph Company, At&T Technologies, Inc. Methods for transferring spring clips
US4948375A (en) * 1987-08-25 1990-08-14 Howard Lawrence Adaptor assembly for circuit boards
US20210398936A1 (en) * 2020-06-23 2021-12-23 Amkor Technology Singapore Holding Pte. Ltd. Laser bonded devices, laser bonding tools, and related methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2371754A (en) * 1942-04-22 1945-03-20 North American Aviation Inc Stiffened material
US2666874A (en) * 1950-08-25 1954-01-19 Rca Corp Construction of semiconductor devices
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US3065525A (en) * 1957-09-13 1962-11-27 Sylvania Electric Prod Method and device for making connections in transistors
US3005257A (en) * 1958-08-28 1961-10-24 Bell Telephone Labor Inc Fabrication of semiconductor devices
US3161811A (en) * 1960-02-15 1964-12-15 Clevite Corp Semiconductor device mount
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3267409A (en) * 1963-12-30 1966-08-16 Gen Instrument Corp Terminal for electronic component
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices

Also Published As

Publication number Publication date
NL7106298A (cg-RX-API-DMAC7.html) 1971-11-11
GB1348521A (en) 1974-03-20
US3720999A (en) 1973-03-20
FR2088459B2 (cg-RX-API-DMAC7.html) 1974-03-08
FR2088459A2 (cg-RX-API-DMAC7.html) 1972-01-07
JPS4914786B1 (cg-RX-API-DMAC7.html) 1974-04-10
IT982341B (it) 1974-10-21

Similar Documents

Publication Publication Date Title
DE10297011T5 (de) Elektrisch leitende Kontakteinheit
DE112006000095T5 (de) Presssitzanschluss, Verfahren zur Herstellung hiervon, sowie Verbindungsanordnung zwischen einem Presssitzanschluss und einer Platine
EP1266975A1 (de) Bleifreies Lötmittel
DE2041497B2 (de) Verfahren zum Herstellen eines Halbleiterbauelementes
CH619073A5 (cg-RX-API-DMAC7.html)
DE1514055C2 (de) Kühlvorrichtung mit mindestens zwei zueinander parallel verlaufenden Kühlkörpern, insbesondere für Diodenlaser
DE3401404A1 (de) Halbleiterbauelement
DE2257650C3 (de) Prüftaster
DE3340939A1 (de) Thermische sicherung
DE112010005383B4 (de) Halbleitervorrichtung
DE1627762A1 (de) Verfahren zum Herstellen von Halbleiterbauelementen
DE1151578B (de) Loetfreier Verbinder
DE10236986A1 (de) Piezoaktor
DE3421672A1 (de) Wechsellastbestaendiges, schaltbares halbleiterbauelement
DE1614668B2 (de) Halbleiter-Anordnung mit Großflächigen, gut lötbaren Kontaktelektroden und Verfahren zu ihrer Herstellung
DE1465450B1 (de) Elektronisches Festk¦rperbauelement zum Schalten
DE2004776A1 (de) Halbleiterbauelement
DE102024124816A1 (de) Verfahren und vorrichtung zum drahtbonden
DE102006058694A1 (de) Leistungshalbleitermodul mit Kontaktfedern
DE2409395C3 (de) Halbleiterbauelement
DE1262388B (de) Verfahren zur Erzeugung eines nicht-gleichrichtenden UEbergangs zwischen einer Elektrode und einem dotierten thermoelelktrischen Halbleiter fuer ein thermoelektrisches Geraet
CH676885A5 (en) Contact element for test adaptor
DE4130390C2 (de) Widerstandselement
DE10259320B4 (de) Druckkontaktiertes elektrisches Bauelement
DE1614653C3 (de) Halbleiteranordnung hoher Strombelastbarkeit