NL7106298A - - Google Patents
Info
- Publication number
- NL7106298A NL7106298A NL7106298A NL7106298A NL7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A NL 7106298 A NL7106298 A NL 7106298A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702022717 DE2022717A1 (de) | 1970-05-09 | 1970-05-09 | Halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7106298A true NL7106298A (cg-RX-API-DMAC7.html) | 1971-11-11 |
Family
ID=5770671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7106298A NL7106298A (cg-RX-API-DMAC7.html) | 1970-05-09 | 1971-05-07 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3720999A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS4914786B1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE2022717A1 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2088459B2 (cg-RX-API-DMAC7.html) |
| GB (1) | GB1348521A (cg-RX-API-DMAC7.html) |
| IT (1) | IT982341B (cg-RX-API-DMAC7.html) |
| NL (1) | NL7106298A (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5245176Y2 (cg-RX-API-DMAC7.html) * | 1973-09-19 | 1977-10-14 | ||
| DE3401404A1 (de) * | 1984-01-17 | 1985-07-25 | Robert Bosch Gmbh, 7000 Stuttgart | Halbleiterbauelement |
| DE3513530A1 (de) * | 1984-06-01 | 1985-12-05 | Bbc Brown Boveri & Cie | Verfahren zur herstellung von leistungshalbleitermodulen mit isoliertem aufbau |
| US4674166A (en) * | 1984-12-18 | 1987-06-23 | At&T Technologies, Inc. | Spring clip transfer apparatus |
| US4582245A (en) * | 1984-12-18 | 1986-04-15 | At&T Technologies, Inc. | Method and apparatus for automated spring clip insertion and removal |
| US4689866A (en) * | 1984-12-18 | 1987-09-01 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Methods for transferring spring clips |
| US4948375A (en) * | 1987-08-25 | 1990-08-14 | Howard Lawrence | Adaptor assembly for circuit boards |
| US20210398936A1 (en) * | 2020-06-23 | 2021-12-23 | Amkor Technology Singapore Holding Pte. Ltd. | Laser bonded devices, laser bonding tools, and related methods |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2371754A (en) * | 1942-04-22 | 1945-03-20 | North American Aviation Inc | Stiffened material |
| US2666874A (en) * | 1950-08-25 | 1954-01-19 | Rca Corp | Construction of semiconductor devices |
| GB818464A (en) * | 1956-03-12 | 1959-08-19 | Gen Electric Co Ltd | Improvements in or relating to semiconductor devices |
| US3065525A (en) * | 1957-09-13 | 1962-11-27 | Sylvania Electric Prod | Method and device for making connections in transistors |
| US3005257A (en) * | 1958-08-28 | 1961-10-24 | Bell Telephone Labor Inc | Fabrication of semiconductor devices |
| US3161811A (en) * | 1960-02-15 | 1964-12-15 | Clevite Corp | Semiconductor device mount |
| US3209450A (en) * | 1962-07-03 | 1965-10-05 | Bell Telephone Labor Inc | Method of fabricating semiconductor contacts |
| US3267409A (en) * | 1963-12-30 | 1966-08-16 | Gen Instrument Corp | Terminal for electronic component |
| US3390450A (en) * | 1966-06-09 | 1968-07-02 | Rca Corp | Method of fabricating semiconductor devices |
-
1970
- 1970-05-09 DE DE19702022717 patent/DE2022717A1/de active Pending
- 1970-12-22 JP JP11526270A patent/JPS4914786B1/ja active Pending
-
1971
- 1971-04-29 US US3720999D patent/US3720999A/en not_active Expired - Lifetime
- 1971-05-05 GB GB1315771A patent/GB1348521A/en not_active Expired
- 1971-05-06 FR FR7116382A patent/FR2088459B2/fr not_active Expired
- 1971-05-07 IT IT2424271A patent/IT982341B/it active
- 1971-05-07 NL NL7106298A patent/NL7106298A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB1348521A (en) | 1974-03-20 |
| US3720999A (en) | 1973-03-20 |
| FR2088459B2 (cg-RX-API-DMAC7.html) | 1974-03-08 |
| DE2022717A1 (de) | 1971-12-02 |
| FR2088459A2 (cg-RX-API-DMAC7.html) | 1972-01-07 |
| JPS4914786B1 (cg-RX-API-DMAC7.html) | 1974-04-10 |
| IT982341B (it) | 1974-10-21 |