GB1207504A - Diode assemblies - Google Patents
Diode assembliesInfo
- Publication number
- GB1207504A GB1207504A GB2789567A GB2789567A GB1207504A GB 1207504 A GB1207504 A GB 1207504A GB 2789567 A GB2789567 A GB 2789567A GB 2789567 A GB2789567 A GB 2789567A GB 1207504 A GB1207504 A GB 1207504A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cap
- lead
- plated
- cylinder
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
1,207,504. Semi-conductor devices. JOSEPH LUCAS /INDUSTRIES) Ltd. 24 May, 1968 [16 June, 1967], No. 27895/67. Heading H1K. [Also in Division C7] A semi-conductor diode wafer 19 is enclosed in a container comprising a conductive baseplate 12 carrying the wafer 19, an insulating cylinder 11 secured thereto, and a washer 14 and conductive cap 24 sealing the top of the cylinder 11. A lead 22 extends through the cap 24 in sealing engagement therewith. In the embodiment the Ni-plated Cu base-plate 12 and Ni-plated mild steel washer 14 are first brazed to the alumina cylinder 11 using a 35% Pb, 18% Cu, 42% Ag, 5 % Ti alloy or a eutectic Ag/Cu mixture on a Ti core, in an atmosphere of argan cracked ammonia or forming gas. After cooling, the remainder of the device is assembled by soldering in cracked ammonia or forming gas using shims 18, 21, 26 of Sn/Pb/Ag alloy and a solder ring 27 which sits initially in a conical recess 28 at the outer end of a bore through the cap 24 accomodating the lead 22. The cap 24 and lead 22 both comprise Ni-plated Cu.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2789567A GB1207504A (en) | 1967-06-16 | 1967-06-16 | Diode assemblies |
FR1582114D FR1582114A (en) | 1967-06-16 | 1968-06-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2789567A GB1207504A (en) | 1967-06-16 | 1967-06-16 | Diode assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1207504A true GB1207504A (en) | 1970-10-07 |
Family
ID=10267015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2789567A Expired GB1207504A (en) | 1967-06-16 | 1967-06-16 | Diode assemblies |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1582114A (en) |
GB (1) | GB1207504A (en) |
-
1967
- 1967-06-16 GB GB2789567A patent/GB1207504A/en not_active Expired
-
1968
- 1968-06-13 FR FR1582114D patent/FR1582114A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR1582114A (en) | 1969-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |