GB1207504A - Diode assemblies - Google Patents

Diode assemblies

Info

Publication number
GB1207504A
GB1207504A GB2789567A GB2789567A GB1207504A GB 1207504 A GB1207504 A GB 1207504A GB 2789567 A GB2789567 A GB 2789567A GB 2789567 A GB2789567 A GB 2789567A GB 1207504 A GB1207504 A GB 1207504A
Authority
GB
United Kingdom
Prior art keywords
cap
lead
plated
cylinder
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2789567A
Inventor
Philip William Allso
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB2789567A priority Critical patent/GB1207504A/en
Priority to FR1582114D priority patent/FR1582114A/fr
Publication of GB1207504A publication Critical patent/GB1207504A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

1,207,504. Semi-conductor devices. JOSEPH LUCAS /INDUSTRIES) Ltd. 24 May, 1968 [16 June, 1967], No. 27895/67. Heading H1K. [Also in Division C7] A semi-conductor diode wafer 19 is enclosed in a container comprising a conductive baseplate 12 carrying the wafer 19, an insulating cylinder 11 secured thereto, and a washer 14 and conductive cap 24 sealing the top of the cylinder 11. A lead 22 extends through the cap 24 in sealing engagement therewith. In the embodiment the Ni-plated Cu base-plate 12 and Ni-plated mild steel washer 14 are first brazed to the alumina cylinder 11 using a 35% Pb, 18% Cu, 42% Ag, 5 % Ti alloy or a eutectic Ag/Cu mixture on a Ti core, in an atmosphere of argan cracked ammonia or forming gas. After cooling, the remainder of the device is assembled by soldering in cracked ammonia or forming gas using shims 18, 21, 26 of Sn/Pb/Ag alloy and a solder ring 27 which sits initially in a conical recess 28 at the outer end of a bore through the cap 24 accomodating the lead 22. The cap 24 and lead 22 both comprise Ni-plated Cu.
GB2789567A 1967-06-16 1967-06-16 Diode assemblies Expired GB1207504A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2789567A GB1207504A (en) 1967-06-16 1967-06-16 Diode assemblies
FR1582114D FR1582114A (en) 1967-06-16 1968-06-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2789567A GB1207504A (en) 1967-06-16 1967-06-16 Diode assemblies

Publications (1)

Publication Number Publication Date
GB1207504A true GB1207504A (en) 1970-10-07

Family

ID=10267015

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2789567A Expired GB1207504A (en) 1967-06-16 1967-06-16 Diode assemblies

Country Status (2)

Country Link
FR (1) FR1582114A (en)
GB (1) GB1207504A (en)

Also Published As

Publication number Publication date
FR1582114A (en) 1969-09-26

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees