GB1343490A - Insulating of electronic components - Google Patents

Insulating of electronic components

Info

Publication number
GB1343490A
GB1343490A GB2251371A GB2251371A GB1343490A GB 1343490 A GB1343490 A GB 1343490A GB 2251371 A GB2251371 A GB 2251371A GB 2251371 A GB2251371 A GB 2251371A GB 1343490 A GB1343490 A GB 1343490A
Authority
GB
United Kingdom
Prior art keywords
plate
mould
cavity
condenser
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2251371A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Union Carbide Corp
Original Assignee
Union Carbide Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Union Carbide Corp filed Critical Union Carbide Corp
Publication of GB1343490A publication Critical patent/GB1343490A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/008—Handling preformed parts, e.g. inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Robotics (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB2251371A 1970-02-25 1971-04-19 Insulating of electronic components Expired GB1343490A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1395670A 1970-02-25 1970-02-25

Publications (1)

Publication Number Publication Date
GB1343490A true GB1343490A (en) 1974-01-10

Family

ID=21762729

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2251371A Expired GB1343490A (en) 1970-02-25 1971-04-19 Insulating of electronic components

Country Status (5)

Country Link
US (1) US3650648A (enExample)
JP (1) JPS5620685B1 (enExample)
CA (1) CA941566A (enExample)
DE (2) DE2167079C2 (enExample)
GB (1) GB1343490A (enExample)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3779506A (en) * 1971-08-25 1973-12-18 Motorola Inc Apparatus for equalizing the flow rate of molding compound into each of a series of mold cavities
US4003544A (en) * 1973-06-11 1977-01-18 Motorola, Inc. Gateless injection mold for encapsulating semiconductor devices
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
US4480975A (en) * 1981-07-01 1984-11-06 Kras Corporation Apparatus for encapsulating electronic components
US4513942A (en) * 1983-05-25 1985-04-30 Bourns, Inc. Plate molding apparatus with interlocking cavity plates
SE467570B (sv) * 1990-12-14 1992-08-10 Sunnex Ab Saett vid fastvulkning eller fastgjutning av ett objekt
DE4114756C2 (de) * 1991-05-06 1994-11-24 Reiner Hoehne Verfahren zur Herstellung von Naß-Elektrolytkondensatoren, insb. in Chip-Bauweise
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5405255A (en) * 1992-11-24 1995-04-11 Neu Dynamics Corp. Encapsulaton molding equipment
US5833903A (en) * 1996-12-10 1998-11-10 Great American Gumball Corporation Injection molding encapsulation for an electronic device directly onto a substrate
SG64985A1 (en) * 1997-05-06 1999-05-25 Advanced Systems Automation Li Method and apparatus for moulding plastic packages
US7481637B2 (en) * 2004-05-12 2009-01-27 Woodbridge Foam Corporation Vented mold and method for producing molded article
KR100621154B1 (ko) * 2005-08-26 2006-09-07 서울반도체 주식회사 발광 다이오드 제조방법
JP5622347B2 (ja) * 2006-08-09 2014-11-12 セイコーエプソン株式会社 慣性センサ装置
US7701073B2 (en) * 2006-09-19 2010-04-20 Texas Instruments Incorporated Locking feature and method for manufacturing transfer molded IC packages
WO2008081660A1 (ja) * 2006-12-28 2008-07-10 Konica Minolta Opto, Inc. 光学素子の製造方法、中間部材及び光学素子
JP4766264B2 (ja) * 2006-12-28 2011-09-07 コニカミノルタオプト株式会社 光学素子の製造方法、インサート部材及び光学素子
FI121909B (fi) * 2008-04-18 2011-05-31 Imbera Electronics Oy Piirilevy ja menetelmä sen valmistamiseksi
FI125526B (fi) * 2008-08-25 2015-11-13 Ge Embedded Electronics Oy Sähköisiä komponentteja sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisiä komponentteja sisältävän paketoidun piirilevyrakenteen valmistamiseksi
JP5204185B2 (ja) * 2010-09-24 2013-06-05 株式会社東芝 制御モジュール製造方法
CN102832295A (zh) * 2011-06-14 2012-12-19 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
TWM450828U (zh) 2012-12-14 2013-04-11 點量科技股份有限公司 熱電分離的發光二極體模組和相關的散熱載板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266099A (en) * 1966-08-16 Harry R Bucy Mold parting line venting means
US2197465A (en) * 1938-01-03 1940-04-16 Columbia Protektosite Co Inc Method and apparatus for making wire core temples
US2794211A (en) * 1953-01-12 1957-06-04 Western Electric Co Apparatus for molding articles
DE1811837U (de) 1960-02-27 1960-05-25 Mabeg Maschb G M B H Nachf Hen Vorrichtung zum ausrichten von bogen.
US3389461A (en) * 1965-04-08 1968-06-25 Ibm Molded insulator base having embedded terminals and method of forming the same
US3550228A (en) * 1967-11-29 1970-12-29 Jean Claude Asscher Method of assembling leads to an electrical component and potting same

Also Published As

Publication number Publication date
DE2167079C2 (de) 1985-09-26
CA941566A (en) 1974-02-12
JPS5620685B1 (enExample) 1981-05-15
DE2108792C3 (enExample) 1979-02-15
DE2108792B2 (de) 1978-06-15
US3650648A (en) 1972-03-21
DE2108792A1 (de) 1971-09-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee