FR2177106B1 - - Google Patents

Info

Publication number
FR2177106B1
FR2177106B1 FR7310642A FR7310642A FR2177106B1 FR 2177106 B1 FR2177106 B1 FR 2177106B1 FR 7310642 A FR7310642 A FR 7310642A FR 7310642 A FR7310642 A FR 7310642A FR 2177106 B1 FR2177106 B1 FR 2177106B1
Authority
FR
France
Prior art keywords
circuit
circuit board
board
semi
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7310642A
Other languages
English (en)
French (fr)
Other versions
FR2177106A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2214163A external-priority patent/DE2214163A1/de
Priority claimed from DE2226395A external-priority patent/DE2226395A1/de
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2177106A1 publication Critical patent/FR2177106A1/fr
Application granted granted Critical
Publication of FR2177106B1 publication Critical patent/FR2177106B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W70/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W40/611—
    • H10W70/611—
    • H10W74/114—
    • H10W76/47—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H10W40/231—
    • H10W40/233—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR7310642A 1972-03-23 1973-03-23 Expired FR2177106B1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2214163A DE2214163A1 (de) 1972-03-23 1972-03-23 Elektrische schaltungsanordnung
DE2226395A DE2226395A1 (de) 1972-05-31 1972-05-31 Elektrische schaltungsanordnung

Publications (2)

Publication Number Publication Date
FR2177106A1 FR2177106A1 (enExample) 1973-11-02
FR2177106B1 true FR2177106B1 (enExample) 1976-09-10

Family

ID=25762938

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7310642A Expired FR2177106B1 (enExample) 1972-03-23 1973-03-23

Country Status (7)

Country Link
US (1) US3919602A (enExample)
JP (1) JPS4913666A (enExample)
FR (1) FR2177106B1 (enExample)
GB (1) GB1428701A (enExample)
IT (1) IT987041B (enExample)
NL (1) NL166362C (enExample)
SE (1) SE395200B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5634432B2 (enExample) * 1974-04-25 1981-08-10
JPS51139355U (enExample) * 1975-05-01 1976-11-10
JPS5330095A (en) * 1976-09-01 1978-03-20 Toyoda Mach Works Ltd Method of producing resinoid grinding wheel
JPS5389564U (enExample) * 1976-12-24 1978-07-22
JPS5441467A (en) * 1977-09-06 1979-04-02 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS5472463A (en) * 1977-11-22 1979-06-09 Fujitsu Ltd Method of trimming function of hybrid integrated circuit
JPS54128161U (enExample) * 1978-02-28 1979-09-06
JPS557380U (enExample) * 1978-06-29 1980-01-18
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
US4573105A (en) * 1983-02-16 1986-02-25 Rca Corporation Printed circuit board assembly and method for the manufacture thereof
DE3833146A1 (de) * 1988-09-29 1989-03-02 Siemens Ag Verfahren zur herstellung eines steuergeraetes
WO1993006705A1 (de) 1991-09-21 1993-04-01 Robert Bosch Gmbh Elektrisches gerät, insbesondere schalt- und steuergerät für kraftfahrzeuge
DE4329083A1 (de) * 1993-08-30 1995-03-02 Telefunken Microelectron Baugruppe zur Aufnahme elektronischer Bauelemente
DE4416403C2 (de) * 1994-05-09 2000-07-13 Schweizer Electronic Ag Kühlvorrichtung für eine Leiterplatte und Verfahren zum Herstellen einer solchen Kühlvorrichtung
US5596178A (en) * 1995-10-12 1997-01-21 Christian; Suzanne single replacement pad with perforated shaft for the repair of printed circuit boards
EP0778616A3 (en) * 1995-12-05 1999-03-31 Lucent Technologies Inc. Method of packaging devices with a gel medium confined by a rim member
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
US6377462B1 (en) 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
DE102010038294A1 (de) * 2010-07-22 2012-01-26 Endress + Hauser Gmbh + Co. Kg Elektronische Baugruppe mit einem von einer Vergussmasse umschlossenen Bauteil und Verfahren zu deren Herstellung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2890395A (en) * 1957-10-31 1959-06-09 Jay W Lathrop Semiconductor construction
LU38605A1 (enExample) * 1959-05-06
GB1065156A (en) * 1964-08-28 1967-04-12 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3423638A (en) * 1964-09-02 1969-01-21 Gti Corp Micromodular package with compression means holding contacts engaged
US3381071A (en) * 1965-04-12 1968-04-30 Nat Semiconductor Corp Electrical circuit insulation method
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
US3495133A (en) * 1965-06-18 1970-02-10 Ibm Circuit structure including semiconductive chip devices joined to a substrate by solder contacts
JPS459249Y1 (enExample) * 1966-10-29 1970-04-30
US3489952A (en) * 1967-05-15 1970-01-13 Singer Co Encapsulated microelectronic devices
JPS4512536Y1 (enExample) * 1967-07-19 1970-06-01
GB1255334A (en) * 1967-12-01 1971-12-01 Gen Electric Integrated circuits
US3549782A (en) * 1968-04-11 1970-12-22 Unitrode Corp Subassembly package
US3691289A (en) * 1970-10-22 1972-09-12 Minnesota Mining & Mfg Packaging of semiconductor devices

Also Published As

Publication number Publication date
JPS4913666A (enExample) 1974-02-06
FR2177106A1 (enExample) 1973-11-02
NL7304025A (enExample) 1973-09-25
SE395200B (sv) 1977-08-01
GB1428701A (en) 1976-03-17
NL166362C (nl) 1981-07-15
US3919602A (en) 1975-11-11
NL166362B (nl) 1981-02-16
IT987041B (it) 1975-02-20

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Legal Events

Date Code Title Description
ST Notification of lapse