GB1316030A - Etchant for chemical dissolution of copper - Google Patents
Etchant for chemical dissolution of copperInfo
- Publication number
- GB1316030A GB1316030A GB5939371A GB5939371A GB1316030A GB 1316030 A GB1316030 A GB 1316030A GB 5939371 A GB5939371 A GB 5939371A GB 5939371 A GB5939371 A GB 5939371A GB 1316030 A GB1316030 A GB 1316030A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- persulphate
- etching
- dec
- ammonium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 2
- 238000004090 dissolution Methods 0.000 title 1
- 238000005530 etching Methods 0.000 abstract 3
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 abstract 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 abstract 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 abstract 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 2
- 229910052708 sodium Inorganic materials 0.000 abstract 2
- 239000011734 sodium Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- 150000001299 aldehydes Chemical class 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 229910021529 ammonia Inorganic materials 0.000 abstract 1
- 125000000129 anionic group Chemical group 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000004653 carbonic acids Chemical class 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 150000002170 ethers Chemical class 0.000 abstract 1
- 150000002576 ketones Chemical class 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11900570A JPS5010698B1 (enrdf_load_stackoverflow) | 1970-12-26 | 1970-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1316030A true GB1316030A (en) | 1973-05-09 |
Family
ID=14750622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5939371A Expired GB1316030A (en) | 1970-12-26 | 1971-12-21 | Etchant for chemical dissolution of copper |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5010698B1 (enrdf_load_stackoverflow) |
| DE (1) | DE2163985A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1316030A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2823068A1 (de) * | 1977-05-27 | 1978-12-14 | Alfachimici Spa | Saure loesung fuer den selektiven angriff von kupfer |
| US5855805A (en) * | 1996-08-08 | 1999-01-05 | Fmc Corporation | Microetching and cleaning of printed wiring boards |
| WO2006124693A3 (en) * | 2005-05-16 | 2006-12-28 | 3M Innovative Properties Co | Method and composition for improving adhesion of organic polymer coatings with copper surface |
| CN115613032A (zh) * | 2022-10-11 | 2023-01-17 | 苏州华星光电技术有限公司 | 蚀刻液 |
| CN117328066A (zh) * | 2023-10-07 | 2024-01-02 | 江苏贺鸿电子有限公司 | 一种线路板用粗化微蚀剂及其制备方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS526853B2 (enrdf_load_stackoverflow) * | 1972-12-22 | 1977-02-25 | ||
| DE4024909A1 (de) * | 1990-08-06 | 1992-02-13 | Kernforschungsz Karlsruhe | Selektive alkalische aetzloesung fuer kupfer oder kupferlegierungen |
| WO2019013160A1 (ja) * | 2017-07-14 | 2019-01-17 | メルテックス株式会社 | 銅エッチング液 |
-
1970
- 1970-12-26 JP JP11900570A patent/JPS5010698B1/ja active Pending
-
1971
- 1971-12-21 GB GB5939371A patent/GB1316030A/en not_active Expired
- 1971-12-22 DE DE19712163985 patent/DE2163985A1/de active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2823068A1 (de) * | 1977-05-27 | 1978-12-14 | Alfachimici Spa | Saure loesung fuer den selektiven angriff von kupfer |
| US5855805A (en) * | 1996-08-08 | 1999-01-05 | Fmc Corporation | Microetching and cleaning of printed wiring boards |
| WO2006124693A3 (en) * | 2005-05-16 | 2006-12-28 | 3M Innovative Properties Co | Method and composition for improving adhesion of organic polymer coatings with copper surface |
| CN1865366B (zh) * | 2005-05-16 | 2010-12-15 | 3M创新有限公司 | 提高有机聚合物涂层对铜表面附着力的方法和组合物 |
| CN115613032A (zh) * | 2022-10-11 | 2023-01-17 | 苏州华星光电技术有限公司 | 蚀刻液 |
| CN115613032B (zh) * | 2022-10-11 | 2024-09-20 | 苏州华星光电技术有限公司 | 蚀刻液 |
| CN117328066A (zh) * | 2023-10-07 | 2024-01-02 | 江苏贺鸿电子有限公司 | 一种线路板用粗化微蚀剂及其制备方法 |
| CN117328066B (zh) * | 2023-10-07 | 2024-03-22 | 江苏贺鸿电子有限公司 | 一种线路板用粗化微蚀剂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2163985A1 (de) | 1972-07-13 |
| JPS5010698B1 (enrdf_load_stackoverflow) | 1975-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |