JPS5511120A - Etching solution for titanium - Google Patents

Etching solution for titanium

Info

Publication number
JPS5511120A
JPS5511120A JP8268578A JP8268578A JPS5511120A JP S5511120 A JPS5511120 A JP S5511120A JP 8268578 A JP8268578 A JP 8268578A JP 8268578 A JP8268578 A JP 8268578A JP S5511120 A JPS5511120 A JP S5511120A
Authority
JP
Japan
Prior art keywords
water
action
etching
benzotriazol
aqueous ammonia
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8268578A
Other languages
Japanese (ja)
Other versions
JPS5727932B2 (en
Inventor
Tamio Saito
Yukio Takehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8268578A priority Critical patent/JPS5511120A/en
Publication of JPS5511120A publication Critical patent/JPS5511120A/en
Publication of JPS5727932B2 publication Critical patent/JPS5727932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/38—Alkaline compositions for etching refractory metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:Composite etching solution of titanium, being in no danger of attacking Cu2O in thick film paste, SiO2 in base board etc., containing water and each fixed ratio of benzotriazol, H2O2, NH4OH and/or NH4 salt against water. CONSTITUTION:Composite material for etching of Ti, containing water and 0.1- 5g, especially 0.3-3g, of benzotriazol, 30-120ml, especially 38-100ml, of H2O2, a fixed amount of NH4OH (aqueous ammonia) and/or NH4 salt against 50ml of water. On this occasion, 0.5-10ml, especially 1-5ml, or aqueous ammonia and 2-30g, especially 6-20g, of NH4 salt (for example, diammonium phosphate) against 50ml of water, are used. Water soluble Ti complex is formed by chelation action of benzotriazol in the above composite material and Ti etching action is given. Also, ehelation action is accelerated by H2O2 as catalyst and basic solution is made by aqueous ammonia and destruction of insulator is prevented and also, etching action of Ti is accelerated.
JP8268578A 1978-07-07 1978-07-07 Etching solution for titanium Granted JPS5511120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8268578A JPS5511120A (en) 1978-07-07 1978-07-07 Etching solution for titanium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8268578A JPS5511120A (en) 1978-07-07 1978-07-07 Etching solution for titanium

Publications (2)

Publication Number Publication Date
JPS5511120A true JPS5511120A (en) 1980-01-25
JPS5727932B2 JPS5727932B2 (en) 1982-06-14

Family

ID=13781266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8268578A Granted JPS5511120A (en) 1978-07-07 1978-07-07 Etching solution for titanium

Country Status (1)

Country Link
JP (1) JPS5511120A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241797U (en) * 1985-08-30 1987-03-12
EP0687751A1 (en) * 1994-06-15 1995-12-20 International Business Machines Corporation Selective etching of TiW for C4 fabrication
GB2323850A (en) * 1997-04-03 1998-10-07 Nec Corp Washing solution for a semiconductor device
JP2002155382A (en) * 2000-09-05 2002-05-31 Wako Pure Chem Ind Ltd Etchant for ti-base film and etching method
WO2023086093A1 (en) * 2021-11-11 2023-05-19 Microsoft Technology Licensing Llc Etchant and method for selectively etching titanium dioxide

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141923U (en) * 1982-03-18 1983-09-24 小松　勲 bag

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6241797U (en) * 1985-08-30 1987-03-12
JPH0537990Y2 (en) * 1985-08-30 1993-09-27
EP0687751A1 (en) * 1994-06-15 1995-12-20 International Business Machines Corporation Selective etching of TiW for C4 fabrication
GB2323850A (en) * 1997-04-03 1998-10-07 Nec Corp Washing solution for a semiconductor device
GB2323850B (en) * 1997-04-03 2000-12-20 Nec Corp A semiconductor device and method of manufacture thereof
JP2002155382A (en) * 2000-09-05 2002-05-31 Wako Pure Chem Ind Ltd Etchant for ti-base film and etching method
JP4661005B2 (en) * 2000-09-05 2011-03-30 和光純薬工業株式会社 Etching agent for Ti film and etching method
WO2023086093A1 (en) * 2021-11-11 2023-05-19 Microsoft Technology Licensing Llc Etchant and method for selectively etching titanium dioxide

Also Published As

Publication number Publication date
JPS5727932B2 (en) 1982-06-14

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