GB1305605A - - Google Patents

Info

Publication number
GB1305605A
GB1305605A GB937870A GB937870A GB1305605A GB 1305605 A GB1305605 A GB 1305605A GB 937870 A GB937870 A GB 937870A GB 937870 A GB937870 A GB 937870A GB 1305605 A GB1305605 A GB 1305605A
Authority
GB
United Kingdom
Prior art keywords
workpiece
laser
multiplier
patterns
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB937870A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691910546 external-priority patent/DE1910546C/de
Application filed filed Critical
Publication of GB1305605A publication Critical patent/GB1305605A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polarising Elements (AREA)
GB937870A 1969-03-01 1970-02-26 Expired GB1305605A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910546 DE1910546C (de) 1969-03-01 Elektro oder magneto optische Anord nung zur Herstellung und Bearbeitung von integrierten Schaltungen und ahnlichen Ob jekten

Publications (1)

Publication Number Publication Date
GB1305605A true GB1305605A (enrdf_load_stackoverflow) 1973-02-07

Family

ID=5726854

Family Applications (1)

Application Number Title Priority Date Filing Date
GB937870A Expired GB1305605A (enrdf_load_stackoverflow) 1969-03-01 1970-02-26

Country Status (7)

Country Link
BE (1) BE746704A (enrdf_load_stackoverflow)
BR (1) BR7017138D0 (enrdf_load_stackoverflow)
CH (1) CH504784A (enrdf_load_stackoverflow)
ES (1) ES376993A1 (enrdf_load_stackoverflow)
FR (1) FR2041059B1 (enrdf_load_stackoverflow)
GB (1) GB1305605A (enrdf_load_stackoverflow)
NL (1) NL7002789A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441472A1 (de) * 1974-08-29 1976-03-11 Siemens Ag Anordnung zum lichtoptischen rechnergesteuerten zeichnen von masken fuer halbleiter-bauelemente
JPS57198631A (en) * 1981-05-29 1982-12-06 Ibm Exposing method and device
FR2615635B1 (fr) * 1987-05-19 1991-10-11 Thomson Csf Dispositif de controle d'un faisceau lumineux dans un grand champ angulaire et application a un dispositif de detection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565007A1 (de) * 1965-05-25 1970-05-21 Philips Patentverwaltung Verfahren und Geraet zur thermischen Materialbearbeitung mittels Laserstrahlen

Also Published As

Publication number Publication date
BR7017138D0 (pt) 1973-01-16
NL7002789A (enrdf_load_stackoverflow) 1970-09-03
ES376993A1 (es) 1972-05-16
FR2041059B1 (enrdf_load_stackoverflow) 1974-05-24
DE1910546A1 (de) 1970-09-17
FR2041059A1 (enrdf_load_stackoverflow) 1971-01-29
DE1910546B2 (de) 1972-04-06
BE746704A (nl) 1970-08-27
CH504784A (de) 1971-03-15

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee