ES376993A1 - Aparato para la fabricacion y tratamiento de circuitos in- tegrados. - Google Patents

Aparato para la fabricacion y tratamiento de circuitos in- tegrados.

Info

Publication number
ES376993A1
ES376993A1 ES376993A ES376993A ES376993A1 ES 376993 A1 ES376993 A1 ES 376993A1 ES 376993 A ES376993 A ES 376993A ES 376993 A ES376993 A ES 376993A ES 376993 A1 ES376993 A1 ES 376993A1
Authority
ES
Spain
Prior art keywords
translation
manufacture
machine
integrated circuits
legally binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES376993A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691910546 external-priority patent/DE1910546C/de
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES376993A1 publication Critical patent/ES376993A1/es
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • H01L21/0275Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polarising Elements (AREA)
ES376993A 1969-03-01 1970-02-27 Aparato para la fabricacion y tratamiento de circuitos in- tegrados. Expired ES376993A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910546 DE1910546C (de) 1969-03-01 Elektro oder magneto optische Anord nung zur Herstellung und Bearbeitung von integrierten Schaltungen und ahnlichen Ob jekten

Publications (1)

Publication Number Publication Date
ES376993A1 true ES376993A1 (es) 1972-05-16

Family

ID=5726854

Family Applications (1)

Application Number Title Priority Date Filing Date
ES376993A Expired ES376993A1 (es) 1969-03-01 1970-02-27 Aparato para la fabricacion y tratamiento de circuitos in- tegrados.

Country Status (7)

Country Link
BE (1) BE746704A (enrdf_load_stackoverflow)
BR (1) BR7017138D0 (enrdf_load_stackoverflow)
CH (1) CH504784A (enrdf_load_stackoverflow)
ES (1) ES376993A1 (enrdf_load_stackoverflow)
FR (1) FR2041059B1 (enrdf_load_stackoverflow)
GB (1) GB1305605A (enrdf_load_stackoverflow)
NL (1) NL7002789A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441472A1 (de) * 1974-08-29 1976-03-11 Siemens Ag Anordnung zum lichtoptischen rechnergesteuerten zeichnen von masken fuer halbleiter-bauelemente
JPS57198631A (en) * 1981-05-29 1982-12-06 Ibm Exposing method and device
FR2615635B1 (fr) * 1987-05-19 1991-10-11 Thomson Csf Dispositif de controle d'un faisceau lumineux dans un grand champ angulaire et application a un dispositif de detection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565007A1 (de) * 1965-05-25 1970-05-21 Philips Patentverwaltung Verfahren und Geraet zur thermischen Materialbearbeitung mittels Laserstrahlen

Also Published As

Publication number Publication date
BR7017138D0 (pt) 1973-01-16
NL7002789A (enrdf_load_stackoverflow) 1970-09-03
FR2041059B1 (enrdf_load_stackoverflow) 1974-05-24
DE1910546A1 (de) 1970-09-17
FR2041059A1 (enrdf_load_stackoverflow) 1971-01-29
DE1910546B2 (de) 1972-04-06
BE746704A (nl) 1970-08-27
GB1305605A (enrdf_load_stackoverflow) 1973-02-07
CH504784A (de) 1971-03-15

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