CH504784A - Vorrichtung zur Herstellung von integrierten Schaltungen - Google Patents

Vorrichtung zur Herstellung von integrierten Schaltungen

Info

Publication number
CH504784A
CH504784A CH284270A CH284270A CH504784A CH 504784 A CH504784 A CH 504784A CH 284270 A CH284270 A CH 284270A CH 284270 A CH284270 A CH 284270A CH 504784 A CH504784 A CH 504784A
Authority
CH
Switzerland
Prior art keywords
production
integrated circuits
circuits
integrated
Prior art date
Application number
CH284270A
Other languages
English (en)
Inventor
Schmidt Uwe
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691910546 external-priority patent/DE1910546C/de
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH504784A publication Critical patent/CH504784A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polarising Elements (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
CH284270A 1969-03-01 1970-02-26 Vorrichtung zur Herstellung von integrierten Schaltungen CH504784A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910546 DE1910546C (de) 1969-03-01 Elektro oder magneto optische Anord nung zur Herstellung und Bearbeitung von integrierten Schaltungen und ahnlichen Ob jekten

Publications (1)

Publication Number Publication Date
CH504784A true CH504784A (de) 1971-03-15

Family

ID=5726854

Family Applications (1)

Application Number Title Priority Date Filing Date
CH284270A CH504784A (de) 1969-03-01 1970-02-26 Vorrichtung zur Herstellung von integrierten Schaltungen

Country Status (7)

Country Link
BE (1) BE746704A (de)
BR (1) BR7017138D0 (de)
CH (1) CH504784A (de)
ES (1) ES376993A1 (de)
FR (1) FR2041059B1 (de)
GB (1) GB1305605A (de)
NL (1) NL7002789A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066053A1 (de) * 1981-05-29 1982-12-08 International Business Machines Corporation Vorrichtung und Verfahren zur Belichtung eines lichtempfindlichen Mediums

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441472A1 (de) * 1974-08-29 1976-03-11 Siemens Ag Anordnung zum lichtoptischen rechnergesteuerten zeichnen von masken fuer halbleiter-bauelemente
FR2615635B1 (fr) * 1987-05-19 1991-10-11 Thomson Csf Dispositif de controle d'un faisceau lumineux dans un grand champ angulaire et application a un dispositif de detection

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565007A1 (de) * 1965-05-25 1970-05-21 Philips Patentverwaltung Verfahren und Geraet zur thermischen Materialbearbeitung mittels Laserstrahlen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066053A1 (de) * 1981-05-29 1982-12-08 International Business Machines Corporation Vorrichtung und Verfahren zur Belichtung eines lichtempfindlichen Mediums

Also Published As

Publication number Publication date
FR2041059A1 (de) 1971-01-29
DE1910546A1 (de) 1970-09-17
DE1910546B2 (de) 1972-04-06
ES376993A1 (es) 1972-05-16
NL7002789A (de) 1970-09-03
GB1305605A (de) 1973-02-07
BE746704A (nl) 1970-08-27
BR7017138D0 (pt) 1973-01-16
FR2041059B1 (de) 1974-05-24

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Legal Events

Date Code Title Description
PL Patent ceased