CH492381A - Verfahren zur Herstellung von gedruckten Schaltungen - Google Patents

Verfahren zur Herstellung von gedruckten Schaltungen

Info

Publication number
CH492381A
CH492381A CH1277668A CH1277668A CH492381A CH 492381 A CH492381 A CH 492381A CH 1277668 A CH1277668 A CH 1277668A CH 1277668 A CH1277668 A CH 1277668A CH 492381 A CH492381 A CH 492381A
Authority
CH
Switzerland
Prior art keywords
production
printed circuits
printed
circuits
Prior art date
Application number
CH1277668A
Other languages
English (en)
Inventor
Rademacher Klaus
Fey Karin
Original Assignee
Int Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Standard Electric Corp filed Critical Int Standard Electric Corp
Publication of CH492381A publication Critical patent/CH492381A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CH1277668A 1967-08-29 1968-08-26 Verfahren zur Herstellung von gedruckten Schaltungen CH492381A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19671690224 DE1690224B1 (de) 1967-08-29 1967-08-29 Bad fuer die stromlose verkupferung von kunststoffplatten

Publications (1)

Publication Number Publication Date
CH492381A true CH492381A (de) 1970-06-15

Family

ID=5687555

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1277668A CH492381A (de) 1967-08-29 1968-08-26 Verfahren zur Herstellung von gedruckten Schaltungen

Country Status (6)

Country Link
BE (1) BE720093A (de)
CH (1) CH492381A (de)
DE (1) DE1690224B1 (de)
FR (1) FR1597506A (de)
GB (1) GB1208337A (de)
IE (1) IE32240B1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2932536A1 (de) * 1979-08-09 1981-02-26 Schering Ag Verfahren zur herstellung von gedruckten schaltungen
KR100861619B1 (ko) * 2007-05-07 2008-10-07 삼성전기주식회사 방열 인쇄회로기판 및 그 제조방법
US10573610B2 (en) 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US9398703B2 (en) * 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination
CN113755838B (zh) * 2021-09-10 2024-03-15 大富科技(安徽)股份有限公司 金属铜表面蚀刻工艺及自动化生产线

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143484A (en) * 1959-12-29 1964-08-04 Gen Electric Method of making plated circuit boards
DE1206976B (de) * 1963-09-19 1965-12-16 Siemens Ag Verfahren zum Herstellen gedruckter Schaltungen nach der Aufbaumethode
FR1449945A (fr) * 1964-08-19 1966-05-06 Photocircuits Corp Perfectionnements aux dispositifs multicouches de circuits imprimés

Also Published As

Publication number Publication date
FR1597506A (de) 1970-06-29
IE32240B1 (en) 1973-05-30
BE720093A (de) 1969-02-28
GB1208337A (en) 1970-10-14
DE1690224B1 (de) 1971-03-25
IE32240L (en) 1969-02-28

Similar Documents

Publication Publication Date Title
CH498825A (de) Verfahren zur Herstellung von 2-C-Methyl-nukleosiden
CH526600A (de) Verfahren zur Herstellung von Polyimiden
AT275491B (de) Verfahren zur Herstellung von Cabonsäuren
AT306765B (de) Verfahren zur Herstellung von Ferrovanadin
CH511568A (de) Verfahren zur Herstellung von Sussware
CH500512A (de) Verfahren zur Herstellung von Druckformen
CH494416A (de) Verfahren zur Herstellung von Metallisierungsmustern
CH508281A (de) Verfahren zur Herstellung von integrierten Schaltungen
CH556355A (de) Verfahren zur herstellung von 5-chromenolaethern.
CH553156A (de) Verfahren zur herstellung von alkanolaminderivaten.
CH507326A (de) Verfahren zur Herstellung von Poly-e-caproamid
CH492381A (de) Verfahren zur Herstellung von gedruckten Schaltungen
CH484523A (de) Verfahren zur Herstellung von monolithischen Schaltungen
CH452062A (de) Verfahren zur Herstellung von integrierten Schaltungen
AT284338B (de) Verfahren zur Herstellung von Rifamycinen
AT329721B (de) Verfahren zur herstellung von wasch- und reinigungsmitteln
CH555800A (de) Verfahren zur herstellung von naphthylisopropylaminen.
CH506602A (de) Verfahren zur Herstellung von Farbstoffen
CH494228A (de) Verfahren zur Herstellung von Lactamen
AT294955B (de) Verfahren zur Herstellung von gedruckten Leiterplatten
AT283373B (de) Verfahren zur Herstellung von N-Methylpiperazin
CH503784A (de) Verfahren zur Herstellung von Kupferphthalocyanin
CH524841A (de) Verfahren zur Herstellung von Flachdruckformen
CH485002A (de) Verfahren zur Herstellung von Farbstoffen
CH504784A (de) Vorrichtung zur Herstellung von integrierten Schaltungen