CH494416A - Verfahren zur Herstellung von Metallisierungsmustern - Google Patents
Verfahren zur Herstellung von MetallisierungsmusternInfo
- Publication number
- CH494416A CH494416A CH1175568A CH1175568A CH494416A CH 494416 A CH494416 A CH 494416A CH 1175568 A CH1175568 A CH 1175568A CH 1175568 A CH1175568 A CH 1175568A CH 494416 A CH494416 A CH 494416A
- Authority
- CH
- Switzerland
- Prior art keywords
- production
- metallization patterns
- metallization
- patterns
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/52—Compositions containing diazo compounds as photosensitive substances
- G03C1/62—Metal compounds reducible to metal
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR6008645A FR1548401A (de) | 1967-08-16 | 1967-08-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH494416A true CH494416A (de) | 1970-07-31 |
Family
ID=8970608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1175568A CH494416A (de) | 1967-08-16 | 1968-08-07 | Verfahren zur Herstellung von Metallisierungsmustern |
Country Status (7)
Country | Link |
---|---|
US (1) | US3615471A (de) |
BE (1) | BE718674A (de) |
CH (1) | CH494416A (de) |
DE (1) | DE1765942A1 (de) |
FR (1) | FR1548401A (de) |
GB (1) | GB1232883A (de) |
NL (1) | NL6810219A (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3839039A (en) * | 1969-11-18 | 1974-10-01 | Fuji Photo Optical Co Ltd | Process for producing color stripe filter |
US3900320A (en) * | 1971-09-30 | 1975-08-19 | Bell & Howell Co | Activation method for electroless plating |
DE2635457C2 (de) * | 1976-08-04 | 1985-06-05 | Schering AG, 1000 Berlin und 4709 Bergkamen | Katalytischer Lack und seine Verwendung zur Herstellung von gedruckten Schaltungen |
US4107351A (en) * | 1976-10-15 | 1978-08-15 | Rca Corporation | Method of depositing or repairing a patterned metal layer on a substrate |
US4054479A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additive process for producing printed circuit elements using a self-supported photosensitive sheet |
DE2728465C2 (de) * | 1977-06-24 | 1982-04-22 | Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt | Gedruckte Schaltung |
US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
JPS6318692A (ja) * | 1986-07-11 | 1988-01-26 | 日立化成工業株式会社 | 印刷配線板の製造方法 |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US5075037A (en) * | 1986-11-07 | 1991-12-24 | Monsanto Company | Selective catalytic activation of polymeric films |
US5631753A (en) * | 1991-06-28 | 1997-05-20 | Dai Nippon Printing Co., Ltd. | Black matrix base board and manufacturing method therefor, and liquid crystal display panel and manufacturing method therefor |
US5382483A (en) * | 1992-01-13 | 1995-01-17 | International Business Machines Corporation | Self-aligned phase-shifting mask |
US5424009A (en) * | 1994-05-24 | 1995-06-13 | Monsanto Company | Catalytic, crosslinked polymeric films for electroless deposition of metal |
DE602004009595T2 (de) * | 2003-08-19 | 2008-07-24 | Mallinckrodt Baker, Inc. | Ablös- und reinigungszusammensetzungen für die mikroelektronik |
US7833695B2 (en) | 2007-05-31 | 2010-11-16 | Corning Incorporated | Methods of fabricating metal contact structures for laser diodes using backside UV exposure |
WO2016159974A1 (en) * | 2015-03-31 | 2016-10-06 | Uni-Pixel Displays, Inc. | Catalytic photoresist for photolithographic metal mesh touch sensor fabrication |
-
1967
- 1967-08-16 FR FR6008645A patent/FR1548401A/fr not_active Expired
-
1968
- 1968-07-19 NL NL6810219A patent/NL6810219A/xx unknown
- 1968-07-26 BE BE718674D patent/BE718674A/xx unknown
- 1968-07-29 GB GB1232883D patent/GB1232883A/en not_active Expired
- 1968-08-07 CH CH1175568A patent/CH494416A/de not_active IP Right Cessation
- 1968-08-12 US US751908A patent/US3615471A/en not_active Expired - Lifetime
- 1968-08-14 DE DE19681765942 patent/DE1765942A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1765942A1 (de) | 1972-01-13 |
BE718674A (de) | 1968-12-31 |
US3615471A (en) | 1971-10-26 |
FR1548401A (de) | 1968-12-06 |
GB1232883A (de) | 1971-05-19 |
NL6810219A (de) | 1969-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |