ES376993A1 - Apparatus for the manufacture and processing of integrated circuits. (Machine-translation by Google Translate, not legally binding) - Google Patents

Apparatus for the manufacture and processing of integrated circuits. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES376993A1
ES376993A1 ES376993A ES376993A ES376993A1 ES 376993 A1 ES376993 A1 ES 376993A1 ES 376993 A ES376993 A ES 376993A ES 376993 A ES376993 A ES 376993A ES 376993 A1 ES376993 A1 ES 376993A1
Authority
ES
Spain
Prior art keywords
translation
manufacture
machine
integrated circuits
legally binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES376993A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691910546 external-priority patent/DE1910546C/en
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES376993A1 publication Critical patent/ES376993A1/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Polarising Elements (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

Apparatus for the manufacture and treatment of integrated circuits and similar articles, characterized in that a laser source is followed by an electro-optical or magneto-optical deflection device, which can be electronically controlled according to a selected program, and by which this device Deflection is followed by an optical multiplication system that divides the laser beam, whose direction is controlled, and ensures that the component beams collide simultaneously at various points on one or more articles. (Machine-translation by Google Translate, not legally binding)
ES376993A 1969-03-01 1970-02-27 Apparatus for the manufacture and processing of integrated circuits. (Machine-translation by Google Translate, not legally binding) Expired ES376993A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691910546 DE1910546C (en) 1969-03-01 Electro or magneto-optical arrangement for the production and processing of integrated circuits and similar objects

Publications (1)

Publication Number Publication Date
ES376993A1 true ES376993A1 (en) 1972-05-16

Family

ID=5726854

Family Applications (1)

Application Number Title Priority Date Filing Date
ES376993A Expired ES376993A1 (en) 1969-03-01 1970-02-27 Apparatus for the manufacture and processing of integrated circuits. (Machine-translation by Google Translate, not legally binding)

Country Status (7)

Country Link
BE (1) BE746704A (en)
BR (1) BR7017138D0 (en)
CH (1) CH504784A (en)
ES (1) ES376993A1 (en)
FR (1) FR2041059B1 (en)
GB (1) GB1305605A (en)
NL (1) NL7002789A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2441472A1 (en) * 1974-08-29 1976-03-11 Siemens Ag ARRANGEMENT FOR LIGHT-OPTICAL COMPUTER-CONTROLLED DRAWING OF MASKS FOR SEMICONDUCTOR COMPONENTS
JPS57198631A (en) * 1981-05-29 1982-12-06 Ibm Exposing method and device
FR2615635B1 (en) * 1987-05-19 1991-10-11 Thomson Csf DEVICE FOR CONTROLLING A LIGHT BEAM IN A LARGE ANGULAR FIELD AND APPLICATION TO A DETECTION DEVICE

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1565007A1 (en) * 1965-05-25 1970-05-21 Philips Patentverwaltung Process and device for thermal material processing by means of laser beams

Also Published As

Publication number Publication date
FR2041059A1 (en) 1971-01-29
BE746704A (en) 1970-08-27
BR7017138D0 (en) 1973-01-16
GB1305605A (en) 1973-02-07
DE1910546B2 (en) 1972-04-06
NL7002789A (en) 1970-09-03
FR2041059B1 (en) 1974-05-24
DE1910546A1 (en) 1970-09-17
CH504784A (en) 1971-03-15

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