GB1300410A - Electrodeposition of copper foil - Google Patents

Electrodeposition of copper foil

Info

Publication number
GB1300410A
GB1300410A GB4120069A GB4120069A GB1300410A GB 1300410 A GB1300410 A GB 1300410A GB 4120069 A GB4120069 A GB 4120069A GB 4120069 A GB4120069 A GB 4120069A GB 1300410 A GB1300410 A GB 1300410A
Authority
GB
United Kingdom
Prior art keywords
polyoxyethylene
cuso
copper foil
foil
amps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4120069A
Inventor
Sydney Harper
Alan Arthur Marks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Non Ferrous Metals Research Association
Original Assignee
British Non Ferrous Metals Research Association
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Non Ferrous Metals Research Association filed Critical British Non Ferrous Metals Research Association
Publication of GB1300410A publication Critical patent/GB1300410A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils

Abstract

1300410 Electro-deposition of copper foil BRITISH NON-FERROUS METALS RESEARCH ASSOCIATION 18 Aug.1970 [18 Aug 1969] 41209/69 Heading C7B Copper foil is electro-deposited from an electrolyte comprising an aqueous solution of CuSO 4 together with a non-ionic surface-active agent selected from polyoxyalkylene glycols and their terminal derivatives. Thereby pinhole-free foil as thin as one thousandth of an inch can be produced. The foil is deposited on, and then removed from an inert cathode which may have a matt or polished surface. Specified agents based on polyoxyethylene glycol are polyoxyethylene (50) tributyl phenol ether, polyethylene glycol 1000 laurate, polyoxyethylene (10) lanolate, polyglycol 600 distearate and polyoxyethylene (6) coconut alkylotamide. Alternatively, agents based on polyoxypropylene glycol can be used. Specified baths to which the surface-active agent can be added and the electrolysis conditions are:- (a) an aqueous bath containing 120-200 g/l CuSO 4 SH 2 O at 50-60‹C with an impure Cu anode and a current density of 15-20 amps/ sq ft giving a cell voltage of 0À25v and (b) an aqueous bath containing 30-60 g/l CuSO 4 5H 2 O at 50‹C with an inert anode and a current density of 15-20 amps/sq ft giving a cell voltage of 2À5 V.
GB4120069A 1969-08-18 1969-08-18 Electrodeposition of copper foil Expired GB1300410A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4120969 1969-08-18

Publications (1)

Publication Number Publication Date
GB1300410A true GB1300410A (en) 1972-12-20

Family

ID=10418624

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4120069A Expired GB1300410A (en) 1969-08-18 1969-08-18 Electrodeposition of copper foil

Country Status (1)

Country Link
GB (1) GB1300410A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI683930B (en) * 2014-10-04 2020-02-01 日商三菱綜合材料股份有限公司 High purity copper electrolytic refining additive and high purity copper manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI683930B (en) * 2014-10-04 2020-02-01 日商三菱綜合材料股份有限公司 High purity copper electrolytic refining additive and high purity copper manufacturing method

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees