GB1299541A - Electrical components and mounting thereof - Google Patents

Electrical components and mounting thereof

Info

Publication number
GB1299541A
GB1299541A GB0998/70A GB199870A GB1299541A GB 1299541 A GB1299541 A GB 1299541A GB 0998/70 A GB0998/70 A GB 0998/70A GB 199870 A GB199870 A GB 199870A GB 1299541 A GB1299541 A GB 1299541A
Authority
GB
United Kingdom
Prior art keywords
component
circuitry
external circuitry
contacts
jan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB0998/70A
Inventor
Alexander Duane Butherus
Miles Conrad Huffstutler Jr
Harry Elroy Hughes Jr
Jack Andrew Morton
Meyer Herbert Wachs
Frederick Joseph Jannett
Jaroslav Mracek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1299541A publication Critical patent/GB1299541A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/20—Electromagnets; Actuators including electromagnets without armatures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4822—Beam leads
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10135—Alignment aids
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
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    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8113—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112—Aligning
    • H01L2224/81121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/81132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

1299541 Beam lead integrated circuits; assembing components WESTERN ELECTRIC CO Inc 15 Jan 1970 [21 Jan 1969 (2) 29 April 1969] 1998/70 Headings H1K and H1R A method of assembling an electrical component, e.g. a beam lead integrated circuit, in a predetermined position relative to external circuitry comprises providing co-operating ferromagnetic means in or affixed to the electrical component and the external circuitry such that the magnetic force exerted by the co-operating magnetic means serves to align the component in the predetermined position. The ferromagnetic means associated with the component may be in the leads or on the body of the component and may be in the form of a coating applied by, for example, sputtering, evaporating or plating or may be deposited during production of the component as an embedded layer. The ferromagnetic means associated with the external circuitry may be integral therewith or in the form of a coating. Alternatively, an electromagnet may be affixed to the circuitry in order to position the component and then removed. This method may be used to form temporary or permanent contacts between the component and the circuitry; if permanent contacts are required, the contacts are permanently bonded by, for example, laser welding. Magnetic means may be used to guide the component to its correct position by causing virtual movement of an electromagnetically generated field.
GB0998/70A 1969-01-21 1970-01-15 Electrical components and mounting thereof Expired GB1299541A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US79248769A 1969-01-21 1969-01-21
US79249069A 1969-01-21 1969-01-21
US82017969A 1969-04-29 1969-04-29

Publications (1)

Publication Number Publication Date
GB1299541A true GB1299541A (en) 1972-12-13

Family

ID=27419897

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0998/70A Expired GB1299541A (en) 1969-01-21 1970-01-15 Electrical components and mounting thereof

Country Status (8)

Country Link
BE (1) BE744656A (en)
CH (1) CH509028A (en)
DE (1) DE2002191A1 (en)
ES (1) ES375911A1 (en)
FR (1) FR2030170A1 (en)
GB (1) GB1299541A (en)
NL (1) NL7000714A (en)
SE (1) SE359219B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1335411A2 (en) * 2002-01-28 2003-08-13 Motorola, Inc. Semiconductor wafer having a thin die and tethers and method therefor
WO2007023327A1 (en) * 2005-08-24 2007-03-01 Infineon Technologies Ag Magnetically alignable semiconductor chip and rewiring substrate and a method for magnetically aligning the semiconductor chip and the rewiring substrate
WO2010121674A2 (en) * 2009-04-23 2010-10-28 Agc Glass Europe Lighting electronic structure
WO2019150001A1 (en) * 2018-02-01 2019-08-08 Teknologian Tutkimuskeskus Vtt Oy Electronic circuit

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528062C2 (en) * 1995-07-31 1998-04-09 Gerd Kohler Detachable electrical connection
DE102009006871A1 (en) * 2009-01-30 2010-08-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Component carrier for use with positioning aid for supporting placement of component of system in target area on surface of component carrier, has pole shoe which is arranged in or on component carrier at distance from surface
NL2004218C2 (en) * 2010-02-10 2011-08-11 Univ Delft Tech Micropart alignment.
CN109803489B (en) * 2019-03-07 2021-08-24 景旺电子科技(龙川)有限公司 Manufacturing method of copper block-embedded PCB capable of effectively solving copper block burrs

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1335411A2 (en) * 2002-01-28 2003-08-13 Motorola, Inc. Semiconductor wafer having a thin die and tethers and method therefor
EP1335411A3 (en) * 2002-01-28 2006-08-09 Motorola, Inc. Semiconductor wafer having a thin die and tethers and method therefor
WO2007023327A1 (en) * 2005-08-24 2007-03-01 Infineon Technologies Ag Magnetically alignable semiconductor chip and rewiring substrate and a method for magnetically aligning the semiconductor chip and the rewiring substrate
US7994608B2 (en) 2005-08-24 2011-08-09 Infineon Technologies Ag Magnetically alignable integrated circuit device
WO2010121674A2 (en) * 2009-04-23 2010-10-28 Agc Glass Europe Lighting electronic structure
WO2010121666A2 (en) * 2009-04-23 2010-10-28 Agc Glass Europe Electronic structure
WO2010121666A3 (en) * 2009-04-23 2010-12-16 Agc Glass Europe Electronic structure
WO2010121674A3 (en) * 2009-04-23 2011-02-24 Agc Glass Europe Lighting electronic structure
WO2019150001A1 (en) * 2018-02-01 2019-08-08 Teknologian Tutkimuskeskus Vtt Oy Electronic circuit
US11051409B2 (en) 2018-02-01 2021-06-29 Teknologian Tutkimuskeskus Vtt Oy Electronic circuit

Also Published As

Publication number Publication date
BE744656A (en) 1970-07-01
CH509028A (en) 1971-06-15
NL7000714A (en) 1970-07-23
FR2030170A1 (en) 1970-10-30
ES375911A1 (en) 1972-07-01
DE2002191A1 (en) 1970-08-06
SE359219B (en) 1973-08-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees