NL2004218C2 - Micropart alignment. - Google Patents

Micropart alignment. Download PDF

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Publication number
NL2004218C2
NL2004218C2 NL2004218A NL2004218A NL2004218C2 NL 2004218 C2 NL2004218 C2 NL 2004218C2 NL 2004218 A NL2004218 A NL 2004218A NL 2004218 A NL2004218 A NL 2004218A NL 2004218 C2 NL2004218 C2 NL 2004218C2
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NL
Netherlands
Prior art keywords
flux
component
substrate
support surface
magnetic field
Prior art date
Application number
NL2004218A
Other languages
Dutch (nl)
Inventor
Marcel Tichem
Thomas Poiesz
Original Assignee
Univ Delft Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Delft Tech filed Critical Univ Delft Tech
Priority to NL2004218A priority Critical patent/NL2004218C2/en
Application granted granted Critical
Publication of NL2004218C2 publication Critical patent/NL2004218C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95091—Under pressure
    • H01L2224/95092—Atmospheric pressure, e.g. dry self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95136—Aligning the plurality of semiconductor or solid-state bodies involving guiding structures, e.g. shape matching, spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H01L2224/95144—Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body

Description

P90455NL00
Title: Micropart alignment
FIELD OF INVENTION
The invention relates to a component placement method for placement of a 5 component on a substrate.
BACKGROUND
Self-assembly of discrete components (generally referenced as micro-parts or chips) on a substrate is a process for which precision positioning with sufficient 10 accuracy is necessary to allow for electrical, optical or other type of interconnects when a component becomes attached to a placement position. One example is WO 2004/051701 wherein components are guided on a carrier web towards a placement position via a gas flow. The substrates are designed with corresponding cavities, wherein the components can be held by a pressure difference provided by 15 vacuum suction through via through holes in the cavities. In particular, when chip thickness decreases (e.g. around and below 20-40 um chip thickness) the handling by known solutions becomes more difficult.
SUMMARY OF THE INVENTION
20 The invention relates to a component placement method for placement of a component on a substrate, comprising: providing a substrate; administering a component to a support face the component having a flux guiding component structure, the support face comprised of by the substrate or by a support structure to be aligned with the substrate; generating a magnetic field; and directing the 25 component to a placement position by means of a flux guiding substrate structure provided on the support face, interacting with the flux guiding component structure, the flux guiding structure interacting with the magnetic field. The component is trapped on the support face by said magnetic field; and, when the support face is comprised by a support structure distinct from the substrate, the 30 support face is aligned with the substrate.
Accordingly, magnetic forces (which can be modulated in time and space) can be used to position micro-parts of these components with reference to microfeatures arranged on the substrate.
2
BRIEF DESCRIPTION OF THE FIGURES
Figure 1 shows a first embodiment;
Figure 2 shows a detailed embodiment of flux guide structures for use in an 5 embodiment as depicted in Figure 1;
Figure 3 shows a further implementation of the placement device in a reel to reel system; and
Figure 4 shows an alternative placement system.
10 DETAILED DESCRIPTION
Several methods exist to assemble discrete components on substrates.
Many of these methods call for wet environments, which use tension forces of fluids to attract and align parts. For high speed assembly processes of electronic parts dry self-assembly is evidently more attractive. To obviate costly pick and 15 place machines that take the chips from a specific location and place them one by one at the target location, in an aspect, a low cost dry self assembly method is provided for high speed positioning of discrete components on substrates. In particular, the method can be used for very thin components, of about less than 100 micron, more specifically, in the range of 20 - 40 micron.
20 The present invention concerns a method for self-assembly of discrete components (chips) on a substrate on which precision positioning with sufficient accuracy is necessary to allow for electrical/optical/ or other interconnects. In an embodiment, the self assembly uses local features in the substrate through which forces are applied to the component through magnetic entrapment and alignment. 25 The magnetic field takes care of autonomous entrapment and alignment, i.e. without the need for contact based, direct handling.
In particular, a substrate is patterned such that in-plane, very thin magnetisable structures are realized in the form of flux guides. For instance the flux guides comprise oppositely arranged flux guide members defining a yoke 30 structure that traps the component by focusing the magnetic flux near the support face. As an example, two rectangular shapes are provided. The dimensions of the magnetisable structures, in particular, the width and the distance between the rectangular shapes, corresponds to the dimensions of the chip, more specifically, to the flux guiding component structure, to be aligned. An external (permanent or 35 non-permanent) magnet creates a magnetic field between its poles. The substrate 3 is positioned between the poles of this magnet. As a consequence, the structures fabricated in the substrate capture the field lines, and create a high density magnetic field between the ends of the rectangular structures. The chip (or micropart) to be aligned is provided with a thin layer of magnetisable material as 5 well to make it susceptible to the magnetic field. If this chip is administered to the substrate, in the vicinity of/between the two rectangular structures where the magnetic field has high density, the chip is trapped by the magnetic field and positioned with respect to the rectangular structures. Advantageously, the administering can be done with a placement error in the order of the chip 10 dimension since the magnetic flux guiding structure will provide precision alignment.
For instance, the flux guides may be provided in the substrate by substrate modification or provided adjacent to the substrate by layer attachment. It is noted that throughout the text, the term substrate is used, where alternatively, the term 15 foil, or carrier web may be used as a term commonly known by the skilled person; in particular, the substrate may be rigid or flexible.
While magnetic fields are known to scale poorly with decreasing dimensions, by shaping the flux guides in correspondence with the chip dimensions and structures this method provides autonomous chip alignment that 20 can be implemented in a dry environment, and which allow parallelization of a chip assembly process to a high degree. Indeed, if multiple chips are administered to the substrate, the present alignment scheme can take care of the alignment of such chips in a single process step.
25 Figure 1 shows a first embodiment wherein a substrate 20 is administered to a support face 21, the support face comprised of by the substrate 20. A magnetic field 50 is generated and the component 10 is directed to a placement position 30 by means of a flux guiding substrate structure 40 provided on the support face 21, 90, the flux guiding substrate structure 40 interacting with the magnetic field. As 30 a consequence, the component 10 is trapped on the support face 21 by said magnetic field.
Alternatively, as can be seen in Figure 4, the alignment can be performed via a support structure of an intermediate support 70, where the components 10 are aligned using the herein disclosed concept of magnetism assisted micropart 35 alignment via a structure arranged on a face of support 90 (see Fig 4).
4
In particular, a component placement method is disclosed for placement of a component 10 on a substrate or foil 20. The method involves providing a substrate 20; providing a component 10 to be placed on a predefined placement position 30; and providing magnetic flux guiding structure 40 to direct the 5 component 10 to the placement position 30.
In addition, a trapping force is generated by an applied magnetic field 50 to induce the component 10 to move to the placement position 30. As will be illustrated further, the component 10 is trapped on the support face 21 by the magnetic field.
10 To further assist placement, a cavity may be provided in the substrate 20 for receiving the component 10, however, the provision of such is not necessary, and the structure 40 in the shown form or in other herein disclosed forms may already be sufficient for accurate placement.
In the example of Figure 1, the trapping force 50 is excited by a magnetic 15 field generator 60 arranged to trap the component 10 from the support face 21, 90 by a magnetic field. In this example, the flux guiding substrate structure is further formed by flux guides 40 in the support face arranged for directing the magnetic flux of the magnetic field. The magnetic field generator 60 may include electromagnets, permanent magnets or any combination thereof arranged to 20 generate magnetic field 50.
In the example, this directionality may be enhanced by varying the flux guides 40 in size to provide a directional force. Specifically, the flux guides 40 may have a decreasing diameter towards the placement position 30. Alternatively, the density of flux guides may be varied, to provide a gradiented magnetic trapping 25 force in effect.
Figure 2 shows a detailed embodiment of flux guide structures for use in an embodiment as depicted in Figure 1. The structure in Figure 2 embodies opposite rectangular flux guides parts 40 that form a yoke structure 40 that traps the component by focusing the magnetic flux near the support face to mate with a 30 component 10, more specifically flux guide members 11. A further stabilizing effect may be provided by the structure in Figure 2B-D embodying flux guides 41-43 that correspond to a chip 10 having guide members 11 placed directly outside a flux zone 31 defined by oppositely arranged flux guides 41-43. The flux guiding members 11 may be arranged fixed or detachable on a face of the component away 35 from the support face support 10 as illustrated. An example of a detachable 5 structure could be a foil having a magnetisable structure as flux guiding members that can be attached to a component, at least in the process of placement. If desired the magnetisable structure can be removed after placement. Figure 2C shows further concentration of flux slanted facing guiding structures 42 5 narrowing the flux zone. Figure 2D illustrates an embodiment 43 having multiple flux guides 43A, B arranged to correspond with multiple guide members 11A, 11B on the chip component 10. The particular advantage of design 2D is that it allows a unique and more precise control of the in-plane orientation of the component to be aligned.
10 Thus a method is disclosed wherein the flux guides 40 are varied in size and/or density to provide a directional force. In particular, the flux guides comprise oppositely arranged flux guide members defining a yoke structure that traps the component by focusing the magnetic flux near the support face.
In Figure 3A it is schematically shown in plan view how these processes 15 can be carried out on subsequent stations in simultaneous placement process on a larger substrate; Figure 3B shows the corresponding aspects in aspect view. Although the example discloses a reel to reel method other substrate transport is possible, in particular, a batch type placement process. In more detail, a substrate 20 or carrier web is unwound from a first reel 26 and guided via a set of guide 20 rollers 25 to a second reel 27 to be wound up. In the unwound condition, various sub processes can be carried out, in particular, as one of the sub processes, component placement 310 via a trapping force 50 as currently disclosed in the previous Figures. In particular, these sub processes may involve: - supply 300 of a component 10, for example, a silicon based chip 25 component 10, to the target area on the substrate 20 from a chip supply 80; - placement 310 of the chip component 10 using the present magnetism assisted micropart alignment concept; - fixation 320 of the chip 10 after its placement; and - making 330 interconnects 30 - lamination 340 of the chips 10.
The steps may be integrated with one another, for example, fixation 310 and interconnects 320 may be provided in a single step by a suitable adhesive. After step 340, the chip assembly may be laminated in a protective substrate 22. Supply of components can be done by placement of chips on a carrier tape and 35 removing it there from in a conventional way, for example, by removal of the tape 6 or by embossing. The chips may be released on a support face of the substrate 20 web directly, as disclosed in Figures 1 and 2, or to on a support face of an intermediate support 70 as disclosed in Figure 3. To position the components 10 after landing, in addition to the methods disclosed in Figures 1 and 2, further 5 measures may be taken, including: a droplet or adhesive 32 to fine position and temporarily hold the part on the basis of face tension forces to attract and temporarily hold the part.
Figure 4 shows an embodiment of such intermediate support 70 as alternative embodiment. This intermediate support functions as an administering 10 device 70 for administering of aligned components 10 to predetermined placement positions 30 on the face of support zone 90. The administering device 70 to this end comprises a component 10 inlet, a support zone 90, provided with the flux guiding substrate structure 40, and an alignment system 100 to align the support zone 90 with a predetermined substrate 20 position. The administering device 70 15 may thus comprise a module which positions a number of chips 10 from a chip supply 80 in parallel on the substrate 20 on respective placement positions by a magnetic trapping force which would allow for many chips 10 to be aligned / assembled at the same time.
While the invention has been illustrated and described in detail in the 20 drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments. In particular, unless clear from context, aspects of various embodiments that are treated in various embodiments separately discussed are deemed disclosed in any combination variation of 25 relevance and physically possible and the scope of the invention extends to such combinations. For example, functions of the inlet and administering device may be combined in one device or in separate devices. Other variations to the disclosed embodiments can be understood and by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended 30 claims. In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measured cannot be used to advantage. Any 35 reference signs in the claims should not be construed as limiting the scope.
7
Various advantages of the disclosed method may include: • the placement method is inexpensive due to absence of mechanical devices.
• Magnetic field can be easily tuned.
• The method allows aligning any chip, provided with a suitable magnetisable 5 structure.
• The method provides the ability to handle very thin chips in a contactless approach.
• The method allows control of the rotational position of the chip.

Claims (15)

1. Componenten (10) plaatsings werkwijze voor het plaatsen van een 5 component (10) op een substraat (20), omvattende: -het aanvoeren van een substraat (20); -het toevoeren van een component (10) naar een draagvlak (21,90), waarbij de component een flux geleidende componenten structuur (11) heeft en het draagvlak dat tot het substraat of een draag 10 structuur (70) behoort bestemd is om te worden gevoegd bij het substraat (20); -het opwekken van een magnetisch veld; en -het richten van de component (10) naar een plaatsings positie (30) door middel van een flux geleidende substraat structuur (40,45) 15 aangebracht op het draagvlak (21, 90), waarbij de flux geleidende substraat structuur samenwerkt met het magnetisch veld; -waarbij de component (10) wordt vastgehouden op het draagvlak (21,90) door het magnetisch veld; en waarbij, wanneer het draagvlak (21,90) behoort bij een draag structuur (70) die verschilt 20 van het substraat (20), het draagvlak wordt samengevoegd met het substraat.A component (10) placement method for placing a component (10) on a substrate (20), comprising: supplying a substrate (20); supplying a component (10) to a support surface (21.90), wherein the component has a flux-conducting component structure (11) and the support surface that belongs to the substrate or a support structure (70) is intended to are added to the substrate (20); generating a magnetic field; and - directing the component (10) to a placement position (30) by means of a flux-conducting substrate structure (40,45) arranged on the support surface (21, 90), the flux-conducting substrate structure cooperating with the magnetic field; wherein the component (10) is retained on the support surface (21.90) by the magnetic field; and wherein, when the support surface (21.90) belongs to a support structure (70) that differs from the substrate (20), the support surface is joined to the substrate. 2. Werkwijze volgens concl.1, waarbij de flux geleidende componenten structuur (11) flux geleiders (40) op het draagvlak (21,90) omvat die 25 opgesteld zijn om de magnetische flux van het magneetveld te richten.2. Method according to claim 1, wherein the flux conductive component structure (11) comprises flux conductors (40) on the support surface (21, 90) arranged to direct the magnetic flux of the magnetic field. 3. Werkwijze volgens concl. 2, waarbij de flux geleiders (40) variërend zijn in afmeting en/of intensiteit teneinde een richtende kracht te verschaffen. 303. Method according to claim 1. 2, the flux conductors (40) varying in size and / or intensity to provide a directing force. 30 4. Werkwijze volgens conclusie 1, waarbij de flux geleiders tegenover elkaar opgestelde flux geleidende delen omvatten die een juk structuur vormen die de component vasthouden door de magnetische flux te concentreren bij het draagvlak.The method of claim 1, wherein the flux conductors comprise opposed flux conductive members forming a yoke structure that retain the component by concentrating the magnetic flux at the support surface. 5. Systeem voor het plaatsen van een component (10) op een substraat 5 (20), omvattende: -een substraat drager(25) voor het dragen van een substraat (20); - een draagvlak (21,90), dat tot het substraat of een draag structuur behoort en bestemd is om te worden gevoegd bij het substraat; -een toevoer inrichting (70) voor het toevoeren van een component 10 (10) naar het draagvlak (21,90); - een magnetisch veld generator (60) direct nabij het draagvlak (21,90) voor het opwekken van een magnetisch veld; en - een flux geleidende substraat structuur aangebracht op het draagvlak (21, 90) voor het richten van de component (10) naar een 15 plaatsings positie (30); waarbij de richtende substraat structuur samenwerkt met het magnetisch veld; -de magnetisch veld generator (60) opgesteld is om de component (10) vast te houden van het draagvlak (21,90) door het magnetisch veld; en wanneer het draagvlak behoort bij een draag structuur 20 verschilt van het substraat -een samenvoeg systeem (100) voor het samenvoegen van het draagvlak met het substraat.A system for placing a component (10) on a substrate 5 (20), comprising: a substrate carrier (25) for supporting a substrate (20); - a support surface (21.90), which belongs to the substrate or a support structure and is intended to be added to the substrate; -a supply device (70) for supplying a component 10 (10) to the support surface (21,90); - a magnetic field generator (60) immediately adjacent the support surface (21.90) for generating a magnetic field; and - a flux conductive substrate structure disposed on the support surface (21, 90) for directing the component (10) to a placement position (30); wherein the targeting substrate structure cooperates with the magnetic field; - the magnetic field generator (60) is arranged to hold the component (10) from the support surface (21.90) by the magnetic field; and when the bearing surface belongs to a bearing structure 20 differs from the substrate-a joining system (100) for joining the bearing surface to the substrate. 6. Systeem volgens conclusie 5, waarbij de magnetisch veld generator 25 een electromagneet (60) omvat.The system of claim 5, wherein the magnetic field generator 25 comprises an electromagnet (60). 7. Systeem volgens conclusie 5, waarbij flux geleidende substraat structuur flux geleiders (40) in het draagvlak omvat opgesteld om de magnetische flux van het magneet veld te richten. 30The system of claim 5, wherein flux conductive substrate structure comprises flux conductors (40) arranged in the support surface to direct the magnetic flux of the magnetic field. 30 8. Systeem volgens conclusie 7, waarbij de de flux geleiders (40) variëren in afmeting en/of intensiteit teneinde een richtende kracht te verschaffen.The system of claim 7, wherein the flux conductors (40) vary in size and / or intensity to provide a directing force. 9. Systeem volgens conclusie 5, waarbij de flux geleidende substraat structuur tegenover elkaar opgestelde flux geleidende delen omvat die een juk structuur (40-42) vormen die de component vasthouden door de magnetische flux te concentreren bij het draagvlak.The system of claim 5, wherein the flux conductive substrate structure comprises opposed flux conductive members forming a yoke structure (40-42) that hold the component by concentrating the magnetic flux at the support surface. 10. Systeem volgens conclusie 5, waarbij het draagvlak (90) aanwezig is op de toevoer inrichting (70).The system of claim 5, wherein the support surface (90) is present on the feed device (70). 11. Systeem volgens conclusie 5, waarbij tegenoverliggende rechthoekige flux geleidende delen (40-42) aangebracht zijn die koppelen met een 15 component (10).11. System as claimed in claim 5, wherein opposite rectangular flux conductive parts (40-42) are arranged which couple to a component (10). 12. Systeem volgens conclusie 5, waarbij flux geleiders (41-43) aangebracht zijn die overeenkomen met een chip (10) die geleidingsdelen (11) bezit aanwezig direct buiten een flux zone (31) bepaald door de flux 20 geleiders (41-43).12. System according to claim 5, wherein flux conductors (41-43) are arranged which correspond to a chip (10) which has guide parts (11) present immediately outside a flux zone (31) defined by the flux conductors (41-43) ). 13. Systeem volgens conclusie 5, waarbij de flux geleiders (41-43) voorzien zijn hellend tegenoverliggende geleidings structuren (42).The system of claim 5, wherein the flux conductors (41-43) are provided with inclined opposite guide structures (42). 14. Component (10), omvattende een de flux geleidende componenten structuur (11) voor het geleiden van een magnetische flux in overeenstemming met een de flux geleidende substraat structuur (40, 45) aangebracht op een componenten draagvlak.A component (10) comprising a flux-conducting component structure (11) for guiding a magnetic flux in accordance with a flux-conducting substrate structure (40, 45) disposed on a component support surface. 15. Component (10) volgens conclusie 14, waarbij de flux geleidende componenten structuur één of meer flux geleidende delen (11) omvat vast of losneembaar aanwezig op een zijde van de component die afgekeerd is van de draagvlak drager (10)A component (10) according to claim 14, wherein the flux conductive component structure comprises one or more flux conductive parts (11) fixed or releasably present on a side of the component remote from the support surface support (10)
NL2004218A 2010-02-10 2010-02-10 Micropart alignment. NL2004218C2 (en)

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US20050250229A1 (en) * 2004-03-12 2005-11-10 Nuggehalli Ravindra M Method of magnetic field assisted self-assembly
WO2008054326A1 (en) * 2006-11-03 2008-05-08 Agency For Science, Technology And Research Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrate

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Publication number Priority date Publication date Assignee Title
US3439416A (en) * 1966-02-03 1969-04-22 Gen Telephone & Elect Method and apparatus for fabricating an array of discrete elements
CH509028A (en) * 1969-01-21 1971-06-15 Western Electric Co Method for positioning an electrical circuit element and mounting element for carrying out such a method
US6780696B1 (en) * 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
US20050250229A1 (en) * 2004-03-12 2005-11-10 Nuggehalli Ravindra M Method of magnetic field assisted self-assembly
WO2008054326A1 (en) * 2006-11-03 2008-05-08 Agency For Science, Technology And Research Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrate

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Title
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