JP2019153682A - Chip carrier - Google Patents

Abstract

To provide a chip carrier which can suppress the occurrence of a damage to a chip.SOLUTION: A chip carrier comprises: a tacky part 21 having a tacky face 22 for putting thereon a chip as an object to be transported, and formed in a film shape; a support part 31 disposed at such a position that the tacky part 21 is located between the chip and itself, and serving to discretely support chips disposed on the tacky part 21 in a direction in which the tacky part 21 extends; a frame part 11 for holding the tacky part 21 and the support part 31; and a plurality of moving parts 41A, 41B arranged so that they are caused to move with the aid of an attractive or repulsive force generated by a magnetic field applied thereto, and disposed in the tacky part 21 between locations where the support is performed by the support part 31. The plurality of moving parts include at least, a first moving part 41A where the attractive or repulsive force generated by the magnetic field is relatively large, and a second moving part 41B where the attractive or repulsive force is relatively small.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a chip carrier, particularly a chip carrier for ultra-thin chips.

  The chip carrier is a kind of case used for transporting a chip which is a minute or easily damaged optical component or electronic component. The chip conveyed by the chip carrier is placed at a desired position on the wiring board by an automatic mounting machine or the like, and can be made conductive by soldering (hereinafter also referred to as “mounted”).

  Since the chip is very small, it is supported by being attached to an adhesive sheet of a chip carrier. The automatic mounting machine takes out the chip from the chip carrier when mounting the chip. A method has been proposed in which a pin is stabbed from the back side of the pressure-sensitive adhesive sheet and the chip is pushed up at the time of taking out (see, for example, Patent Document 1).

JP 2013-131554 A

  In addition to the chip extraction method described in Patent Document 1, a method described below has also been proposed. As shown in FIGS. 5A and 5B, the chip carrier 101 which is a conventional technique described here is mainly composed of a frame portion 111, an adhesive film 121, and a case 171. The adhesive film 121 fixes the chip 3. The frame part 111 holds the adhesive film 121 to facilitate carrying. The case 171 protects the chip 3 from external impacts and foreign matters.

  The case 171 is mainly provided with a main body 172 on which the chip carrier 101 is disposed, and a lid 173 that is rotatably disposed with respect to the main body 172 and holds the chip carrier 101 between the main body 172 and the case 171. It has been.

  It is preferable that the adhesive film 121 has an adhesive property only on the surface to which the chip 3 is fixed, and the opposite surface has no adhesive property. The chip 3 is conveyed in a state of being adhered to the adhesive film 121. When the chip 3 is used after conveyance, it is peeled off from the adhesive film 121 using tweezers or the like.

  When the chip 3 is so small that it is difficult to peel the chip 3 from the adhesive film 121 using tweezers or the like as described above, the chip carrier 101 shown in FIG. 6 (a) and FIG. 6 (b) as an example. Is used. An adhesive film 121 and a support 131 are mainly provided on the frame portion 111 of the chip carrier 101. The support 131 has a net-like structure 132 disposed under the adhesive film 121. A metal piece 141 is embedded inside the adhesive film 121, and the metal piece 141 is disposed in the mesh of the support 131.

  A usage example of the chip carrier 101 will be described with reference to FIGS. As shown in FIG. 7A, the entire lower surface of the chip 3 is attached to the adhesive film 121 during transportation. In this state, as shown in FIG. 7B, the magnet 151 is brought closer from below, and the metal piece 141 is attracted to the magnet 151. The adhesive film 121 around the metal piece 141 is drawn downward and peeled off from the chip 3.

  That is, the adhesive force is weakened by reducing the area of the chip 3 that is bonded to the adhesive film 121, and the chip 3 is easily peeled off from the adhesive film 121. For example, it becomes easy to peel off the chip 3 from the adhesive film 121 using the suction nozzle 61.

  However, the above-described chip carrier 101 has the following problems. That is, when the adhesive force between the adhesive film 121 and the chip 3 around a part of the metal pieces 141 (the metal pieces 141 on the left side and the center in FIGS. 9A to 9C) is relatively weak. Is attracted first to the magnet 151 to which the partial metal piece 141 approaches.

  Thereafter, the other metal piece 141 (the right metal piece 141 in FIG. 9A to FIG. 9C) having a relatively high adhesive force is attracted to the magnet 151 with a delay. Then, as shown in FIG. 9C, the chip 3 is in an upright posture. When the chip 3 in this posture is peeled off from the adhesive film 121 using the suction nozzle 61, the chip 3 and the suction nozzle 61 come into contact with each other, and the chip 3 (and the suction nozzle 61 in some cases) is damaged. There was a risk.

  Since the order in which the metal pieces 141 are attracted to the magnet 151 is irregular, it is difficult to control the posture of the chip 3 when the magnet 151 is brought close to the chip carrier 101. In other words, there is a problem that it is difficult to suppress damage to the chip 3.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a chip carrier that can suppress the occurrence of chip damage.

In order to achieve the above object, the present invention provides the following means.
The chip carrier of the present invention is disposed at a position where the adhesive portion is sandwiched between the adhesive portion formed in a film shape having an adhesive surface on which a chip as a conveyance object is disposed, and the chip, By means of a support part that discretely supports the chip arranged in the adhesive part in the direction in which the adhesive part extends, a frame part that holds the adhesive part and the support part, and an attractive force or a repulsive force generated by an applied magnetic field A plurality of moving parts arranged between the portions of the adhesive part supported by the support part, wherein the plurality of moving parts are attractive forces generated by the magnetic field or It includes at least a first moving part having a relatively large repulsive force and a second moving part having a relatively small repulsive force, and the first moving part and the second moving part are alternately arranged.

  The chip carrier of the present invention is provided with first moving parts and second moving parts that are different in attractive force or repulsive force generated by an applied magnetic field and arranged alternately. When a magnetic field is applied to the first moving part and the second moving part in a direction away from the chip, the adhesion between the chip and the adhesive part is peeled off step by step. For this reason, when taking out the chip from the chip carrier, the posture of the chip is hardly disturbed.

  According to the chip carrier of the present invention, since the first moving unit and the second moving unit that are different in attractive force or repulsive force generated by the applied magnetic field are provided, it is possible to suppress the occurrence of chip damage. Play.

FIG. 1A is a top view for explaining the configuration of the chip carrier of the present invention, and FIG. 1B is a cross-sectional view taken along the line A-A ′ of FIG. FIG. 2A is a cross-sectional view for explaining a state in which the chip is fixed to the chip carrier, and FIG. 2B is a cross-sectional view for explaining a state in which the magnet is brought close to the chip carrier. FIG. 3A is a cross-sectional view for explaining a state in which the magnet is further brought closer to the chip carrier, and FIG. 3B is a cross-sectional view for explaining a state in which the chip is taken out from the chip carrier. It is a sectional view explaining other composition of the chip carrier of the present invention. FIG. 5A is a top view for explaining the configuration of the conventional chip carrier, and FIG. 5B is a top view for explaining the configuration of the chip carrier housed in the case. FIG. 6A is a top view for explaining the configuration of another conventional chip carrier, and FIG. 6B is a cross-sectional view taken along line A-A ′ of FIG. FIG. 7A is a cross-sectional view for explaining a state in which the chip is fixed to the conventional chip carrier, and FIG. 7B is a cross-sectional view for explaining a state in which the magnet is brought close to the conventional chip carrier. It is. FIG. 8A is a sectional view for explaining a state in which the suction nozzle is brought close to the conventional chip carrier, and FIG. 8B is a sectional view for explaining a state in which the chip is taken out from the conventional chip carrier. FIG. FIG. 9A is a cross-sectional view illustrating a state in which the chip is fixed to a conventional chip carrier, and FIG. 9B is a cross-section illustrating a state in which some metal pieces are attracted to the magnet. FIG. 9C is a cross-sectional view illustrating a state in which the posture of the chip is disturbed.

  A chip carrier 1 according to an embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the present invention will be described by applying the present invention to an example of a chip carrier 1 which is a case used for transporting a chip 3 which is an optical component or an electronic component.

  As shown in FIGS. 1A and 1B, the chip carrier 1 includes a frame portion 11, an adhesive film (adhesive portion) 21, a support body (support portion) 31, a first metal piece ( A first moving part) 41A and a second metal piece (second moving part) 41B are mainly provided. Although not shown in FIGS. 1A and 1B, the chip carrier 1 may include a case 171 shown in FIG. 5B.

  The frame part 11 is a member formed in a plate shape, and supports the adhesive film 21 and the support 31 from below. In this embodiment, the chip carrier 1 is described as applied to an example in which the frame portion 11 is formed to protrude and extend around the adhesive film 21 and the support 31 when viewed from the upper side. The material for forming the frame 11 is preferably a material that transmits a magnetic field.

  The adhesive film 21 holds the chip 3 that is a conveyance object. The adhesive film 21 is formed in a deformable film shape or sheet shape having an adhesive surface 22 having adhesiveness for holding the chip 3. In addition, as a material which forms the adhesive film 21, it is preferable that it is a material which can deform | transform and permeate | transmit a magnetic field.

  The support body 31 is arrange | positioned between the adhesive film 21 and the frame part 11, and supports the adhesive film 21 from the downward direction. The support 31 is a member formed by arranging linearly formed members 32 in a lattice shape. An example of the arrangement interval in which the linearly formed members 32 are arranged can be smaller than the dimension in the interval direction of the arranged chips 3. In addition, as a material which forms the support body 31, it is preferable that it is a material which does not generate attraction or repulsion between the 1st metal piece 41A and the 2nd metal piece 41B.

  In the present embodiment, the support 31 is described as applied to an example in which a plurality of members 32 are arranged in parallel at equal intervals and are orthogonally arranged. As long as the first metal piece 41A and the second metal piece 41B have a space that can move in the vertical direction, the specific shape is not limited.

  The first metal piece 41A and the second metal piece 41B move by attractive force or repulsive force generated by the applied magnetic field. The first metal piece 41 </ b> A and the second metal piece 41 </ b> B are arranged inside the adhesive film 21 and at positions corresponding to the plurality of members 32 arranged in a lattice shape of the support 31.

  In the present embodiment, the first metal piece 41A and the second metal piece 41B will be described as applied to an example in which the first metal piece 41A and the second metal piece 41B are formed of a metal material that is a magnetic body. However, attraction or repulsion is generated by applying a magnetic field. It may be formed of other materials.

  The first metal piece 41A has a relatively large attractive force or repulsive force generated by the magnetic field, and the second metal piece 41B has a relatively small attractive force or repulsive force generated by the magnetic field. In the present embodiment, the first metal piece 41A and the second metal piece 41B will be described by applying to an example in which the first metal piece 41A and the second metal piece 41B are alternately arranged along the direction in which the first metal piece 41A and the second metal piece 41B are arranged. In other words, the description is applied to an example in which both the first metal piece 41A and the second metal piece 41B are arranged in the region where the chip 3 is arranged.

  Further, the first metal piece 41A and the second metal piece 41B may be arranged symmetrically with respect to the arranged chip 3, respectively. Furthermore, one of the first metal piece 41A and the second metal piece 41B may be arranged at the center of the region where the chip 3 is arranged, and the other may be arranged at a symmetrical position with the other as the center.

  The first metal piece 41 </ b> A and the second metal piece 41 </ b> B have a size capable of entering and exiting a space formed between the plurality of members 32 of the support 31. In the present embodiment, the first metal piece 41A is a rectangular plate-like member formed from a metal material, and has a larger area than the second metal piece 41B, and is formed from the second metal piece 41B metal material. A rectangular plate-like member having an area larger than that of the first metal piece 41A will be described.

  Note that the shapes of the first metal piece 41A and the second metal piece 41B are not particularly limited as long as the relative magnitude of the attractive force or repulsive force generated by the magnetic field is generated.

  Moreover, you may produce the difference of a relative magnitude in the attractive force or repulsive force which generate | occur | produces with a magnetic field by making the material which forms 41 A of 1st metal pieces, and the 2nd metal piece 41B different. In this case, the first metal piece 41A and the second metal piece 41B may be formed in the same shape.

  Next, a method for taking out the chip 3 in the chip carrier 1 having the above-described configuration will be described with reference to FIGS. FIG. 2A shows a state in which the chip 3 is held and fixed to the adhesive film 21 of the chip carrier 1. The chip 3 is held and fixed by being attached to the adhesive surface 22 of the adhesive film 21. In this state, the chip 3 is transported.

  When the chip 3 is taken out from the chip carrier 1, first, as shown in FIG. Then, the magnetic field formed by the magnet 51 is applied to the first metal piece 41A, and an attractive force acts on the first metal piece 41A. At this time, the attractive force also acts on the second metal piece 41B. When the attractive force acting on the first metal piece 41A is compared with the attractive force acting on the second metal piece 41B, the attractive force acting on the first metal piece 41A is large.

  Therefore, the first metal piece 41A overcomes the adhesive force between the chip 3 and the adhesive film 21, and pulls down the adhesive film 21 around the first metal piece 41A. On the other hand, the second metal piece 41B cannot overcome the adhesive force between the chip 3 and the adhesive film 21 because the attractive force acting on itself is small. The adhesive film 21 around the second metal piece 41B remains adhered to the chip 3.

  Thereafter, the magnet 51 is further brought closer to the chip carrier 1 as shown in FIG. Then, the magnetic field applied to the 2nd metal piece 41B becomes strong, and the attractive force which acts on the 2nd metal piece 41B becomes large. Thereby, the 2nd metal piece 41B overcomes the adhesive force of the chip | tip 3 and the adhesive film 21, and pulls down the adhesive film 21 of the circumference | surroundings downward.

  In this state, the chip 3 and the adhesive film 21 are adhered only at the periphery where the member 32 of the support 31 is disposed. In other words, the area where the chip 3 and the adhesive film 21 adhere is smaller than before the magnetic field is applied.

  As shown in FIGS. 3A and 3B, the suction nozzle 61 for taking out the chip 3 from the chip carrier 1 approaches the chip 3 from above. The suction nozzle 61 takes out the chip 3 by holding the upper surface of the chip 3 by a suction force and lifting it upward.

  In the present embodiment, the magnet 51 is applied to the first metal piece 41A and the second metal piece 41B. However, the magnet 51 may be a permanent magnet. In addition, an electromagnet may be used. When the magnet 51 is an electromagnet, the current supplied to the electromagnet may be increased or decreased instead of moving the magnet closer to or away from the chip carrier 1.

  According to the chip carrier 1 having the above configuration, the first metal piece 41A and the second metal piece 41B having different attractive forces generated by the applied magnetic field are provided, so that the chip 3 and the adhesive film 21 are stepwise. Can be peeled off. Therefore, the disorder of the posture of the chip 3 when taking out the chip 3 from the chip carrier 1 is less likely to occur, and the occurrence of damage to the chip 3 can be suppressed.

  Since the first metal piece 41A and the second metal piece 41B are arranged in a region facing the arranged chip 3, the adhesion between the chip 3 and the adhesive film 21 is easily peeled off step by step. Therefore, when the chip 3 is taken out from the chip carrier 1, the posture of the chip 3 is more difficult to be disturbed, and the occurrence of damage to the chip 3 is easily suppressed.

  Since the first metal piece 41A and the second metal piece 41B are arranged symmetrically with respect to the arranged chip 3, the adhesion between the chip 3 and the adhesive film 21 is easily peeled off step by step. Therefore, when the chip 3 is taken out from the chip carrier 1, the posture of the chip 3 is more difficult to be disturbed, and the occurrence of damage to the chip 3 is easily suppressed.

  By forming the first metal piece 41A with a relatively large size, it becomes easier to relatively increase the attractive force acting by the magnetic field. In addition, by forming the second metal piece 41B with a relatively small size, it becomes easier to relatively reduce the attractive force acting by the magnetic field.

  By disposing the first metal piece 41A and the second metal piece 41B inside the adhesive film 21, the adhesive film 21 around the first metal piece 41A and the second metal piece 41B becomes the first metal piece 41A and It becomes easy to move following the movement of the second metal piece 41B. Therefore, it becomes easy to peel off the chip 3 from the adhesive film 21.

  Note that the first metal piece 41A and the second metal piece 41B may be arranged in the adhesive film 21 as in the above-described embodiment, or as shown in FIG. The second metal piece 41 </ b> B may be disposed on the lower surface of the adhesive film 21. In other words, it may be arranged on the surface on the support 31 side.

  Thus, by arranging the first metal piece 41A and the second metal piece 41B on the surface of the adhesive film 21 facing the support 31, the first metal piece 41A and the second metal piece 41B are compared with the case where the first metal piece 41A and the second metal piece 41B are arranged inside the adhesive film 21. It becomes easy to arrange the first metal piece 41A and the second metal piece 41B.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the chip carrier according to the present invention is applied to an example in which the chip carrier is used for transporting a chip that is an optical component or an electronic component. However, the present invention is not limited to optical parts and electronic parts.

  DESCRIPTION OF SYMBOLS 1 ... Chip carrier, 3 ... Chip, 11 ... Frame part, 21 ... Adhesive film (adhesive part), 22 ... Adhesive surface, 31 ... Support body (support part), 32 ... Member, 41A ... 1st metal piece (1st) 1 moving part), 41B ... 2nd metal piece (2nd moving part)

Claims (6)

An adhesive part formed in a film shape having an adhesive surface on which chips to be conveyed are placed;
A support portion that is disposed at a position between which the adhesive portion is sandwiched between the tip and the tip that is discretely supported in the direction in which the adhesive portion extends;
A frame portion for holding the adhesive portion and the support portion;
A plurality of moving parts that are moved by an attractive force or a repulsive force generated by an applied magnetic field and are arranged between the portions of the adhesive part supported by the support part; and
The plurality of moving units include at least a first moving unit that generates a relatively large attractive force or repulsive force generated by the magnetic field and a relatively small second moving unit, and the first moving unit and the second moving unit. Chip carrier in which parts are arranged alternately.   The chip carrier according to claim 1, wherein the first moving unit and the second moving unit are arranged in a region facing the arranged chip.   The chip carrier according to claim 1, wherein the first moving unit and the second moving unit are arranged symmetrically with respect to the arranged chip.   4. The chip carrier according to claim 1, wherein the first moving part is formed with a relatively large size, and the second moving part is formed with a relatively small size. 5.   The chip carrier according to any one of claims 1 to 4, wherein the first moving part and the second moving part are arranged inside the adhesive part formed in a film shape.   5. The chip carrier according to claim 1, wherein the first moving part and the second moving part are arranged on a surface of the adhesive part that faces the support part. 6.

Images