CN108539050B - Method for separating flexible panel - Google Patents
Method for separating flexible panel Download PDFInfo
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- CN108539050B CN108539050B CN201810201218.1A CN201810201218A CN108539050B CN 108539050 B CN108539050 B CN 108539050B CN 201810201218 A CN201810201218 A CN 201810201218A CN 108539050 B CN108539050 B CN 108539050B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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Abstract
The invention discloses a flexible panel separation method, which separates a first substrate from a flexible panel by using sound waves generated by a vibration sounder.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible panel separation method.
Background
Currently, most of the flexible OLED (Organic Light-Emitting Diode) technologies are to attach a flexible substrate such as PI, PET or metal foil to a rigid substrate such as a glass substrate, perform a related process for OLED preparation on the flexible substrate, and peel off the flexible substrate from the rigid substrate after the preparation is completed. With the development of industrial technology, LLO (laser lift off) technology has been widely applied to the field of flexible OLED display, and generally, after a display device is manufactured, a high-energy laser beam is scanned on the back surface of the display device, so that an adhesive between a flexible panel and a rigid substrate is aged, the adhesion performance is reduced, and then the flexible panel and the rigid substrate are separated by peeling. However, this method requires high-energy laser beam scanning, which results in low production efficiency and poor separation uniformity, and the flexible panel is easily damaged during the peeling process, thereby reducing the separation yield.
Disclosure of Invention
The invention mainly solves the technical problem of providing a flexible panel separation method to simplify the process flow and improve the separation yield rate under the condition of not damaging the flexible panel during separation.
In order to solve the technical problems, the invention adopts a technical scheme that:
there is provided a method of separating a flexible panel bonded to a first substrate, the method comprising:
the first substrate and the flexible panel are separated by generating sound waves through a vibration generator.
The invention has the beneficial effects that: different from the situation of the prior art, the first substrate is separated from the flexible panel by using the vibration sounder to generate sound waves, so that the flexible panel is protected from being damaged, the separation process flow is simplified, and the separation yield is improved.
Drawings
FIG. 1 is a schematic view of a first working state of the flexible panel separation method of the present invention;
FIG. 2 is a schematic view of a second working state of the flexible panel separation method of the present invention;
FIG. 3 is a schematic view of a third working state of the flexible panel separation method of the present invention;
4 a-4 d are schematic diagrams of a scene application of the flexible panel separation method of the present invention;
fig. 5 is a schematic flow chart of the flexible panel separation method of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Fig. 1 is a schematic view showing a first working state of the flexible panel separation method according to the present invention. Wherein the flexible panel 20 is bonded to the first substrate 10, and the first substrate 10 and the flexible panel 20 are separated by generating sound waves through the vibration generator 30.
The flexible panel 20 includes:
a second substrate 21 bonded to the first substrate 10;
a switching element 22 provided on a surface of the second substrate 21 remote from the first substrate 10;
a light-emitting layer 23 covering the switching element 22; and
and an encapsulation layer 24 covering the light emitting layer 23.
At least one vibration sounder 30 is arranged near the bonding position of the first substrate 10 and the second substrate 21.
In this embodiment, the two vibration generators 30 are symmetrically disposed on two sides of the bonding portion between the first substrate 10 and the second substrate 21. In the present embodiment, the flexible panel 20 only shows a part of the structure, and the rest of the structure is the same as that of the existing flexible panel, and is not described herein again.
The first substrate is a glass substrate, and the second substrate 21 is a polyimide flexible substrate.
Wherein the frequency of the sound wave generated by the vibration generator 30 is less than the natural frequency of the first substrate 10.
Wherein, the frequency of the sound wave generated by the vibration sounder 30 is 10000 Hz-15000 Hz.
An adsorption device is disposed on a side of the first substrate 10 away from the flexible panel 20 and/or a side of the flexible panel 20 away from the first substrate 10, so as to adsorb the first substrate 10 and the flexible panel 20 or adsorb one of the first substrate 10 and the flexible panel 20.
In this embodiment, an upper suction device 41 and a lower suction device 42 are respectively disposed on a side of the first substrate 10 away from the flexible panel 20 and a side of the flexible panel 20 away from the first substrate 10, the lower suction device 42 sucks the flexible panel 20 to fix, and the upper suction device 41 is horizontally disposed at a distance of about 0.2mm from the side of the first substrate 10 away from the flexible panel 20. In other embodiments, the first substrate 10 may be sucked and fixed by the first suction device 41, and the lower suction device 42 may be horizontally disposed at a distance from the side of the flexible panel 20 away from the first substrate 10 (as shown in fig. 2), or the first substrate 10 may be sucked and fixed by the first suction device 41, and the flexible panel 20 may be also sucked and fixed by the second suction device 42 (as shown in fig. 3). Since the upper flexible substrate 10 is pressed against the lower flexible substrate 20 by gravity (as shown in fig. 1) or the upper flexible substrate 20 is pressed against the lower flexible substrate 10 by gravity (as shown in fig. 2) after the flexible panel 20 is separated from the first substrate 10 by the vibration generator 30, the lower suction device 42 serves as a fixing function, and the upper suction device 41 may be spaced apart from the sucked first substrate 10 or flexible panel 20.
Wherein, the adsorption devices 41 and 42 are vacuum adsorption platforms.
Please refer to fig. 4 a-4 d, which are schematic diagrams illustrating a scene application of the flexible panel separation method according to the present invention.
As shown in fig. 4a, suction devices 41, 42 are provided.
An upper adsorption device 41 is arranged on one side of the first substrate 10 far away from the flexible panel 20, and a lower adsorption device 42 is arranged on one side of the flexible panel 20 far away from the first substrate 10, the flexible panel 20 is adsorbed by the lower adsorption device 42 to be fixed, and the upper adsorption device 41 is horizontally arranged at a position which is about 0.2mm away from one side of the first substrate 10 far away from the flexible panel 20.
As shown in fig. 4b, a vibration generator 30 is provided for vibration isolation.
Two vibration sounders 30 are symmetrically arranged on two sides of the bonding part of the first substrate 10 and the second substrate 21, when the vibration sounders 30 are turned on, sound waves generated by the vibration sounders 30 enable the first substrate 10 and the flexible panel 20 to start to vibrate simultaneously, and because of different substances, the vibration frequencies of the first substrate 10 and the flexible panel 20 are different, and in the vibration process, the first substrate 10 and the flexible panel 20 are separated.
The frequency of the sound wave generated by the vibration generator 30 is less than the natural frequency of the first substrate 10, so as to prevent the first substrate 10 from being damaged due to resonance with the first substrate 10.
The first substrate 10 is a glass substrate, and the natural frequency of the glass is 20000 × 1+ 8% Hz.
Wherein the flexible panel 20 comprises: a second substrate 21 bonded to the first substrate 10; a switching element 22 provided on a surface of the second substrate 21 remote from the first substrate 10; a light-emitting layer 23 covering the switching element 22; and an encapsulation layer 24 covering the light emitting layer 23.
Wherein, the light emitting layer 23 is an OLED (composite material) and is not affected by sound waves.
Wherein, the frequency of the sound wave generated by the vibration sounder 30 is 10000 Hz-15000 Hz.
As shown in fig. 4c, the vibration generator 30 is turned off and the vibration separating operation is stopped.
After the vibration sound generator 30 is operated for about 30s, the vibration sound generator 30 is turned off and withdrawn, and at this time, the first substrate 10 and the second substrate 21 on the flexible panel 20 are completely separated, and the first substrate 10 is pressed on the second substrate 21 due to gravity.
Wherein the second substrate 21 is a polyimide flexible substrate.
As shown in fig. 4d, the first substrate 10 and the flexible panel 20 are sucked and moved apart.
Moving an upper adsorption device 41 arranged on the first substrate 10 downward, making the upper adsorption device 41 adsorb the first substrate 10, and moving the upper adsorption device 41 and the lower adsorption device 42, so that the first substrate 10 adsorbed by the upper adsorption device 41 is separated from the flexible panel 20 adsorbed by the lower adsorption device 42.
Wherein, the adsorption devices 41 and 42 are vacuum adsorption platforms.
Fig. 5 is a schematic flow chart of a flexible panel separation method according to the present invention. The method comprises the following steps:
step S10: the first substrate 10 and the flexible panel 20 are separated by generating sound waves through the vibration generator 30.
Specifically, two vibration sound generators 30 are symmetrically arranged on two sides of a bonding part of the first substrate 10 and the second substrate 21, when the vibration sound generators 30 are turned on, sound waves generated by the vibration sound generators 30 enable the first substrate 10 and the flexible panel 20 to start to vibrate simultaneously, and because of different substances, the vibration frequencies of the first substrate 10 and the flexible panel 20 are also different, and the first substrate 10 and the flexible panel 20 are separated in the vibration process.
The frequency of the sound wave generated by the vibration generator 30 is less than the natural frequency of the first substrate 10, so as to prevent the first substrate 10 from being damaged due to resonance with the first substrate 10.
The first substrate 10 is a glass substrate, and the natural frequency of the glass is 20000 × 1+ 8% Hz.
Wherein the flexible panel 20 comprises: a second substrate 21 bonded to the first substrate 10; a switching element 22 provided on a surface of the second substrate 21 remote from the first substrate 10; a light-emitting layer 23 covering the switching element 22; and an encapsulation layer 24 covering the light emitting layer 23.
Wherein, the light emitting layer 23 is an OLED (composite material) and is not affected by sound waves.
Wherein, the frequency of the sound wave generated by the vibration sounder 30 is 10000 Hz-15000 Hz.
Step S10 is preceded by:
step S11: an adsorption device is disposed on a side of the first substrate 10 away from the flexible panel 20 and/or a side of the flexible panel 20 away from the first substrate 10, so as to adsorb the first substrate 10 and the flexible panel 20 or adsorb one of the first substrate 10 and the flexible panel 20.
Specifically, an upper suction device 41 is disposed on a side of the first substrate 10 away from the flexible panel 20, and a lower suction device 42 is disposed on a side of the flexible panel 20 away from the first substrate 10, so as to suck the flexible panel 20, wherein the upper suction device 41 is horizontally disposed at a position about 0.2mm away from the side of the first substrate 10 away from the flexible panel 20.
Wherein, the adsorption devices 41 and 42 are vacuum adsorption platforms.
Before step S10, the method further includes:
step 12: scanning the flexible panel 20 or the first substrate 10 by a high-energy laser beam to reduce the adhesive force between the first substrate 10 and the second substrate 21.
Specifically, a high-energy laser beam is used to scan a surface of the first substrate 10 away from the flexible panel 20, so that the adhesive force between the first substrate 10 and the second substrate 21 is reduced, and the first substrate 10 and the flexible panel 20 are easily separated.
Further included after step S10 is:
step S13: the first substrate 10 and the flexible panel 20 are moved apart by the suction device.
Specifically, the upper adsorption device 41 disposed on the first substrate 10 is moved down, so that the upper adsorption device 41 adsorbs the first substrate 10, and the upper adsorption device 41 and the lower adsorption device 42 are moved, so that the first substrate 10 adsorbed by the upper adsorption device 41 is separated from the flexible panel 20 adsorbed by the lower adsorption device 42.
According to the invention, the two vibration sounders are symmetrically arranged on two sides of the bonding part of the first substrate and the second substrate of the flexible panel, and the vibration sounders generate sound waves with the frequency less than the natural frequency of the first substrate to separate the first substrate from the flexible panel, so that the flexible panel is protected from being damaged, the separation process flow is simplified, and the separation yield is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A method of separating a flexible panel bonded to a first substrate, the method comprising:
separating the first substrate from the flexible panel by generating sound waves by a vibration sounder, the frequency of the sound waves generated by the vibration sounder being less than the natural frequency of the first substrate;
wherein before the first substrate and the flexible panel are separated by the sound wave generated by the vibration sounder, the method further comprises the following steps:
and arranging an adsorption device on one side of the first substrate far away from the flexible panel and/or one side of the flexible panel far away from the first substrate so as to adsorb the first substrate and the flexible panel or adsorb one of the first substrate and the flexible substrate.
2. The method of separating a flexible panel according to claim 1, wherein the flexible panel comprises:
a second substrate bonded to the first substrate;
a switching element disposed on a surface of the second substrate remote from the first substrate;
a light-emitting layer covering the switching element; and
and an encapsulation layer covering the light emitting layer.
3. The method of separating a flexible panel according to claim 2, wherein at least one of the vibration generators is provided in the vicinity of the bonding of the first substrate and the second substrate.
4. The method for separating a flexible panel according to claim 2, wherein at least two vibration generators are arranged and symmetrically arranged on two sides of the bonding position of the first substrate and the second substrate.
5. The method of separating a flexible panel according to claim 1, wherein the frequency of the sound wave generated by the vibration generator is 10000Hz to 15000 Hz.
6. The method of separating a flexible panel according to claim 1, wherein the suction device is a vacuum suction platform.
7. The method of separating a flexible panel according to claim 1, further comprising, after separating the first substrate and the flexible panel by generating sound waves through the vibration generator:
moving the first substrate and the flexible panel apart by the suction device.
8. The method of separating a flexible panel according to claim 1, further comprising, before separating the first substrate and the flexible panel by generating sound waves through the vibration generator:
scanning the flexible panel or the first substrate with a high energy laser beam to reduce an adhesive force between the first substrate and the flexible panel.
9. The method of separating a flexible panel according to claim 2, wherein the first substrate is a glass substrate and the second substrate is a polyimide flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810201218.1A CN108539050B (en) | 2018-03-12 | 2018-03-12 | Method for separating flexible panel |
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| CN201810201218.1A CN108539050B (en) | 2018-03-12 | 2018-03-12 | Method for separating flexible panel |
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| CN108539050B true CN108539050B (en) | 2020-07-03 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102625951A (en) * | 2009-08-27 | 2012-08-01 | 康宁股份有限公司 | Debonding a glass substrate from carrier using ultrasonic wave |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080047930A1 (en) * | 2006-08-23 | 2008-02-28 | Graciela Beatriz Blanchet | Method to form a pattern of functional material on a substrate |
| KR100931856B1 (en) * | 2007-08-24 | 2009-12-15 | 세메스 주식회사 | Substrate Cleaning Apparatus and Substrate Cleaning Method |
| CN104465475B (en) * | 2013-09-22 | 2017-08-04 | 昆山工研院新型平板显示技术中心有限公司 | The preparation method and flexible display device of flexible display device |
| KR102131091B1 (en) * | 2014-09-26 | 2020-07-08 | 엘지디스플레이 주식회사 | Laser irradiation apparatus for manufacturing of flexible display device |
| CN104916574B (en) * | 2015-04-22 | 2017-11-10 | 四川虹视显示技术有限公司 | A kind of flexible OLED device for removing scum |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102625951A (en) * | 2009-08-27 | 2012-08-01 | 康宁股份有限公司 | Debonding a glass substrate from carrier using ultrasonic wave |
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