CN104916574B - A kind of flexible OLED device for removing scum - Google Patents
A kind of flexible OLED device for removing scum Download PDFInfo
- Publication number
- CN104916574B CN104916574B CN201510192320.6A CN201510192320A CN104916574B CN 104916574 B CN104916574 B CN 104916574B CN 201510192320 A CN201510192320 A CN 201510192320A CN 104916574 B CN104916574 B CN 104916574B
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- CN
- China
- Prior art keywords
- substrate
- oled
- laser
- base station
- main engine
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a kind of flexible OLED device for removing scum, including main engine bed, the upper plane of main engine bed is provided with moveable substrate adsorption base station；The substrate adsorption base station is used to adsorb oled substrate；The main engine bed includes oled substrate placement region and oled substrate laser-irradiated domain；The top of the oled substrate placement region is provided with suspension board；The top of the laser-irradiated domain is provided with laser generator, and the linear array laser source that laser generator is provided with by it carries out laser irradiation to the oled substrate in laser-irradiated domain；The lower surface of the suspension board is provided with vacuum cup, is connected between the vacuum cup and suspension board by cylinder.Because the top of oled substrate placement region is provided with suspension board, makes the rigid substrate of oled substrate 12 and flexible OLED films peeling-off, obtain flexible oled substrate, the device has the effect that accurately and rapidly rigid substrate is separated with flexible substrate.
Description
Technical field
The invention belongs to OLED to show manufacturing technology field, more particularly to a kind of flexible OLED device for removing scum.
Background technology
The application of OLED flexible devices is more and more extensive, from various large-scale curved display devices to intelligent miniature application end,
Such as intelligent watch, wrist strap, all have begun to widely be used.Compared to traditional panel display screen, flexible OLED applications
Characteristic is obviously more superior, and expanding space for its market is also boundless.
Flexible OLED manufacturing process the most ripe is to make flexible substrate in rigid substrate (such as glass substrate) now
(high molecular polymer) makes OLED electrodes and ray structure on flexible substrate again.And complete all manufacturing processes
Afterwards, it is necessary to which rigid substrate is separated with flexible substrate, that is, realize flexible OLED demoulding.
The content of the invention
The technical problems to be solved by the invention are, it is necessary to which accurately, quickly rigid substrate is separated with flexible substrate.
In order to solve the above technical problems, the technical scheme is that：A kind of flexible OLED device for removing scum, including master are provided
Board, the upper plane of main engine bed are provided with moveable substrate adsorption base station；The substrate adsorption base station is used to adsorb oled substrate；
The main engine bed includes oled substrate placement region and oled substrate laser-irradiated domain；The oled substrate is placed
The top in region is provided with suspension board；The top of the laser-irradiated domain is provided with laser generator, and laser generator passes through it
The linear array laser source being provided with carries out laser irradiation to the oled substrate in laser-irradiated domain；
The lower surface of the suspension board is provided with vacuum cup, is connected between the vacuum cup and suspension board by cylinder
Connect.
Further, in addition to automatic manipulator, substrate cartridge and transmission belt, the automatic manipulator are arranged on main engine bed
Front end, the transmission belt and main engine bed horizontal parallel；Substrate cartridge is arranged on one side of automatic manipulator.
Further, coupled between main engine bed and the substrate adsorption base station by slide rail.
Further, it is vacuum suction base station that the surface of the substrate adsorption base station, which is provided with Process,.
Further, the bottom of the substrate cartridge 4 is provided with cassette pedestal 11.
Beneficial effects of the present invention：Because the top of oled substrate placement region is provided with suspension board, make oled substrate 12
Rigid substrate and flexible OLED films it is peeling-off, obtain flexible oled substrate, the device have accurately and rapidly rigid lining
The effect that bottom separates with flexible substrate.
Brief description of the drawings
Fig. 1 is this programme structure top view；
Fig. 2 is this programme structural side view；
Wherein, 1, main engine bed, 2, substrate adsorption base station, 3, automatic manipulator, 4, substrate cartridge, 5, laser generator, 6,
Linear array laser source, 7, suspension board, 8, cylinder, 9, vacuum cup, 10, transmission belt, 11, cassette pedestal, 12, oled substrate.
Embodiment
The invention will be further elaborated with specific embodiment below in conjunction with the accompanying drawings.
As illustrated in fig. 1 and 2, a kind of flexible OLED device for removing scum, including main engine bed 1, the upper plane of main engine bed 1 is provided with removable
Dynamic substrate adsorption base station 2；The substrate adsorption base station 2 is used to adsorb oled substrate 12.
Main engine bed 1 includes substrate placement region and substrate laser irradiation area；The top of the substrate placement region is provided with
Hang board 7；The top of the laser-irradiated domain is provided with laser generator 5, and the linear array that laser generator 5 is provided with by it swashs
Light source 6 carries out laser irradiation to the oled substrate 12 in laser-irradiated domain；Pass through between main engine bed 1 and substrate adsorption base station 2
Slide rail couples, and substrate adsorption base station 2 is the vacuum suction base station that surface is provided with Process, and substrate adsorption base station 2 adsorbs
Oled substrate 12 enters substrate laser irradiation area along slide rail from substrate placement region, and oled substrate 12 irradiates in substrate laser
Back and forth run along sled position in region.
The lower surface of suspension board 7 is provided with vacuum cup 9, passes through cylinder 8 between the vacuum cup 9 and suspension board 7
Connection, cylinder 8 can control vacuum cup 9 to move back and forth in vertical direction, vacuum cup 9 it is attached live in surface flexible face
Plate, the small segment distance of the quick startup optimization of rigid substrate that bottom base station adsorbs while cylinder slightly packs up adsorption plate upwards,
So that rigid substrate and flexible OLED films are peeling-off.
Flexible OLED device for removing scum also includes automatic manipulator 3, substrate cartridge 4 and transmission belt 10, the automatic manipulator 3
It is arranged on the front end of main engine bed 1, substrate cartridge 4 is arranged on one side of automatic manipulator 3, and automatic manipulator 3 is by oled substrate 12
Take out and be placed on onto absorption oled substrate 12 from substrate cartridge 4.Transmission belt 10 and the horizontal parallel of main engine bed 1, suspension board 7 are transported
Reset after the oled substrate 12 for being stripped completion is placed in transmission belt 10 by row to transmission 10 with top.
During work, production operation personnel are placed on the substrate cartridge 4 equipped with oled substrate 12 in the cassette base of position fixation
On seat 11；Automatic manipulator 3 be layered from substrate cartridge 4 extract out do not carry out be stripped processing oled substrate 12 be placed on substrate adsorption
On base station 2, the vacuum of main engine bed 1 is opened, and the oled substrate 12 for not carrying out being stripped processing being placed on substrate adsorption base station 2 is consolidated
It is fixed.After laser is opened again, substrate adsorption base station 2 delivers the oled substrate 12 for not carrying out being stripped processing and enters laser-irradiated domain,
The linear array laser source 6 that laser generator 5 is provided with by it carries out laser irradiation to the oled substrate 12 in laser-irradiated domain.Base
Plate absorption base station 2 drives the oled substrate 12 for not carrying out being stripped processing back and forth to be run in laser-irradiated domain along slide rail, makes laser
Fully 12 whole positions of irradiation oled substrate, laser irradiation are to allow acquisition energy between flexible substrate and rigid substrate to cause
Therebetween adhesion weakens, the power invariability of laser output, if it is desired to enable flexible substrate suitable with rigid substrate
Profit is peeled off, it is necessary to it is irradiated repeatedly, is irradiated in the laser for reaching technique initialization and requires that metacoxal plate adsorbs base station 2 band
Dynamic oled substrate 12 resets.(to be judged as number repeatedly according to the material and laser power of specific substrate, a reality
Test result, an empirical value.)
Now suspension board 7 runs to substrate rest area the top of oled substrate 12 after being irradiated with a laser uniformly, and cylinder 8 pushes away
Dynamic vacuum cup 9 is downward and stops after vacuum cup 9 touches the upper surface of oled substrate 12.Now sucker vacuum opens vacuum
Sucker 9 adsorbs the flexible panel of the upper surface of oled substrate 12, and cylinder is to while slightly packing up vacuum cup 9 on 8, OLED bases
Quick start of rigid substrate that the lower basal plate absorption base station 2 of plate 12 adsorbs oled substrate 12 runs downwards small segment distance, makes
It is peeling-off to obtain rigid substrate and the flexible OLED films of oled substrate 12, obtains flexible oled substrate.This exhaust hood 8 is received upwards again
A segment distance is returned, suspension board 7 runs to the top of transmission belt 10 and flexible oled substrate is placed in transmission belt 10 and then resetted,
The instruction of oled substrate 12 in place after next laser irradiation uniformly is waited, flexible oled substrate is transported to next by transmission belt 10
Station.At the same time, the vacuum of substrate adsorption base station 2 is abolished, and the rigid substrate that automatic manipulator 3 picks up demoulding is put into its original
The position come in substrate cartridge 4.
By this operating procedure, automatic manipulator 3 extracts the work of the progress above step of oled substrate 12 of other non-demouldings out again
Industry, treat in 4 in substrate cartridge after the completion of whole demouldings of oled substrate 12, production operators are carried out in whole substrate cartridge 4 again
Replace, 4 are arranged on cassette pedestal 11 in substrate cartridge.The position of casket pedestal 11 can need to carry out actual adjustment according to production.
One of ordinary skill in the art will be appreciated that embodiment described here is to aid in reader and understands this hair
Bright principle, it should be understood that protection scope of the present invention is not limited to such especially statement and embodiment.This area
Those of ordinary skill can make according to these technical inspirations disclosed by the invention various does not depart from the other each of essence of the invention
The specific deformation of kind and combination, these deform and combined still within the scope of the present invention.
Claims (5)
- A kind of 1. flexible OLED device for removing scum, it is characterised in that：Including main engine bed (1), the upper plane of main engine bed (1) is provided with removable Dynamic substrate adsorption base station (2)；The substrate adsorption base station (2) is used to adsorb oled substrate (12)；The main engine bed (1) includes oled substrate placement region and oled substrate laser-irradiated domain；The oled substrate is placed The top in region is provided with suspension board (7)；The top of the laser-irradiated domain is provided with laser generator (5), laser generator (5) the linear array laser source (6) being provided with by it carries out laser irradiation to the oled substrate (12) in laser-irradiated domain；The lower surface of the suspension board (7) is provided with suction tray, passes through cylinder (8) between the suction tray and suspension board (7) Connection；Also include automatic manipulator (3), substrate cartridge (4) and transmission belt (10), the automatic manipulator (3) is arranged on main frame The front end of platform (1), the transmission belt (10) and main engine bed (1) horizontal parallel；Substrate cartridge (4) is arranged on automatic manipulator (3) One side.
- 2. flexible OLED device for removing scum according to claim 1, it is characterised in that：The main engine bed (1) and substrate adsorption Base station is coupled between (2) by slide rail.
- 3. flexible OLED device for removing scum according to claim 1, it is characterised in that：The substrate adsorption base station (2) is table Face is provided with the vacuum suction base station of Process.
- 4. flexible OLED device for removing scum according to claim 1, it is characterised in that：The bottom of the substrate cartridge (4) is set There is cassette pedestal (11).
- 5. flexible OLED device for removing scum according to claim 1, it is characterised in that：The suction tray is vacuum cup (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510192320.6A CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510192320.6A CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104916574A CN104916574A (en) | 2015-09-16 |
| CN104916574B true CN104916574B (en) | 2017-11-10 |
Family
ID=54085545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510192320.6A Expired - Fee Related CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104916574B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452898B (en) * | 2016-05-31 | 2019-08-23 | 上海微电子装备（集团）股份有限公司 | A kind of laser lift-off device and method |
| CN106098965B (en) * | 2016-06-15 | 2018-08-21 | 昆山国显光电有限公司 | Flexible base board stripping off device and flexible base board stripping means |
| CN108539050B (en) * | 2018-03-12 | 2020-07-03 | 武汉华星光电半导体显示技术有限公司 | Method for separating flexible panel |
| CN110556330B (en) * | 2019-09-12 | 2022-03-22 | 云谷（固安）科技有限公司 | Supporting substrate, stripping device, flexible display panel and preparation method thereof |
| KR102093949B1 (en) * | 2019-11-22 | 2020-03-26 | 주식회사 한송네오텍 | Batch film removal and inspection apparatus for flexible display manufacturing |
| CN113517214B (en) * | 2021-07-08 | 2023-06-06 | 深圳市强生光电科技有限公司 | Laser demolding device and demolding method for LED packaging product |
| CN116995002B (en) * | 2023-09-26 | 2023-12-19 | 迈为技术(珠海)有限公司 | Wafer and glass stripping device, stripping and cleaning integrated equipment and stripping method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769109A (en) * | 2012-07-05 | 2012-11-07 | 青岛海信电器股份有限公司 | Method for manufacturing flexible display and substrate for manufacturing flexible display |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
| CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012101237A1 (en) * | 2012-02-16 | 2013-08-22 | Ev Group E. Thallner Gmbh | A method for temporarily connecting a product substrate to a carrier substrate |
-
2015
- 2015-04-22 CN CN201510192320.6A patent/CN104916574B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769109A (en) * | 2012-07-05 | 2012-11-07 | 青岛海信电器股份有限公司 | Method for manufacturing flexible display and substrate for manufacturing flexible display |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
| CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104916574A (en) | 2015-09-16 |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20171110 Termination date: 20210422 |