CN109801859A - It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage - Google Patents
It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage Download PDFInfo
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- CN109801859A CN109801859A CN201811562108.4A CN201811562108A CN109801859A CN 109801859 A CN109801859 A CN 109801859A CN 201811562108 A CN201811562108 A CN 201811562108A CN 109801859 A CN109801859 A CN 109801859A
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Abstract
The present invention relates to integrated circuit Advanced Packaging fields, and in particular to a kind of for correcting the semiconductor device and antidote of the plastic packaging sheet warpage comprising IC chip.Wherein semiconductor device includes: bearing structure, and including the supporting region for carrying plastic packaging plate, supporting region is plane setting；Vacuum passage is set in bearing structure, and is connected to setting with supporting region, for applying vacuum to the gap between plastic packaging plate and supporting region；Pressing structure, it is set to above bearing structure and is moved back and forth along perpendicular to supporting region direction, pressing structure, which has, to be correspondingly arranged and for plastic packaging plate, without the compacting end for applying correction pressure at exposed die, the contact surface for suppressing end and plastic packaging plate to be plane with plastic packaging plate；Heating structure is set on bearing structure and/or pressing structure, for heating up to plastic packaging flat heater.Semiconductor device of the invention is less likely to be damaged exposed die in correction and rectification effect is good.
Description
Technical field
The present invention relates to integrated circuit Advanced Packaging fields, and in particular to one kind includes ic core for correcting
The semiconductor device and antidote of the plastic packaging sheet warpage of piece.
Background technique
Plate grade is fanned out to the characteristics of encapsulation is due to its own, and production capacity with higher is integrated always circuit envelope in recent years and surveys
Industry is of interest, and future, which is expected to become, is fanned out to one of main production technology of encapsulation, especially for the small of relatively more pins
Chip package, production cost undoubtedly have huge attraction.
It is being fanned out in encapsulation, plastic packaging molding reconstruct wafer or large scale plate are essential step, usual chip
According to encapsulation design layout, will be tested good chip (known-gooddie) by chip mounter and be reassembled into can continue work
Skill integrated wafer or plate.However, due to the difference of the physical parameters such as chip and capsulation material elasticity modulus, thermal expansion coefficient
Not, plastic packaging wafer or large scale plate after cooling tend not to keep surfacing, and different degrees of warpage is all presented, sticks up
Qu Chengdu is generally determined with the packing material contained inside elasticity modulus, coefficient of expansion difference size and plastic packaging material.
Reconstructing molding panel size by hot pressing injection molding is also the key parameter for influencing warpage degree, and the size of plate is got over
Greatly, the degree of warpage is just more obvious.For example the size of plastic packaging plate is increased to 600x600 milli from 300x300 millimeters (long x wide)
Rice is using same chip and capsulation material, or even with the same technological parameter, larger journey will be presented in larger-size plate
The warpage of degree.
Size can be reduced in right amount from the development of material selection, matching, the selection of process optimization, chip size etc.
The warpage degree of plate, but even if spending bigger manufacturing cost, satisfied put down can not be all obtained in hot pressing Shooting Technique
Whole degree, after encapsulation chip and material change, pervious experience is often improper, it is also necessary to go debugging, research and development again.Therefore make
It is necessary with the instrument for correcting sheet warpage, corrected using instrument it is smooth after, for various chip sizes
Under the conditions of size, the thickness of thinned die, plastic packaging raw material and packing material ratio, various injection molding preparation processes etc., it can obtain
Meet the plastic packaging plate of semiconductor technology flatness requirement, apparatus for correcting in the prior art, which applies plastic-sealed body by platform, to be rectified
Normal pressure, but since there is exposed die on plastic-sealed body surface, the core of surface exposure can be damaged by carrying out application corrective force by platform
Piece.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is that overcoming in the prior art for correcting the half of warpage plastic packaging plate
The still out-of-flatness, still of plastic packaging plate of the conductor device in correction after the exposed die that is easily damaged on plastic packaging plate or correction
There are the technological deficiencies of miscellaneous warpage, so that providing one kind is less likely to be damaged exposed die and correction in rectification technique
It includes integrated that plastic packaging plate flatness afterwards is good, reaches the correction that is used for for the flatness for complying fully with that every semiconductor technology requires
The semiconductor device and antidote of the plastic packaging sheet warpage of circuit chip.
In order to solve the above technical problems, The technical solution adopted by the invention is as follows:
The present invention provides a kind of for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip, packet
Include: bearing structure, including the supporting region for carrying the plastic packaging plate, the supporting region is plane setting；Vacuum passage, if
In in the bearing structure, and it is connected to setting with the supporting region, between the plastic packaging plate and the supporting region
Gap applies vacuum；Pressing structure is set to above the bearing structure and moves back and forth along perpendicular to the supporting region direction,
The pressing structure, which has, to be correspondingly arranged and for strong without applying at exposed die to the plastic packaging plate with the plastic packaging plate
The contact surface of the compacting end of normal pressure, the compacting end and the plastic packaging plate is plane；Heating structure is set to the carrying and ties
On structure and/or the pressing structure, for heating up to the plastic packaging flat heater.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the compacting end is
The ring structure being adapted to the plastic packaging plate peripheral shape applies correction pressure with the periphery to the plastic packaging plate.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the vacuum passage
For groove and/or the duct for being connected to setting with the supporting region surface, the vacuum passage includes described at least one is extended to
The connector being arranged outside bearing structure.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the vacuum passage
For the groove being correspondingly arranged with the supporting region.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the groove includes
Several line flowing channels and several arced flow paths, several line flowing channel parallel arrangements, the head of the two neighboring line flowing channel
Tail is connected to by the arced flow path.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the groove is also wrapped
Include the first connector for connecting with vacuum system and the second connector for the inert gas that circulates.
It further include being set in the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip
On the pressing structure and it is set in the guard circle suppressed on the outside of end, the compacting end, which applies the plastic packaging plate, presses
When power, the guard circle is sheathed on the plastic packaging flat board outer rim to prevent the plastic packaging plate deformation.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the guard circle is leaned on
One end of the nearly plastic packaging plate is plane setting, and the compacting end and the guard circle are along the side of movement of the pressing structure
To difference in height be less than the plastic packaging plate thickness.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the protection snare
There are gaps between the plastic packaging plate when outside the plastic packaging plate.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the gap is less than
1 millimeter.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the pressing structure
It further include the pressing table being set to above the compacting end.
It is above-mentioned for correct comprising IC chip plastic packaging sheet warpage semiconductor device in, the compacting end and
The pressing table is connected using dismountable mode.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, in the pressing table
It is provided with several in heat temperature raising, making the gas evaporated in the capsulation material of the plastic packaging plate from compacting gap
The through-hole escaped out.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the through-hole perforation
The upper and lower surfaces of the pressing table are arranged.
In the above-mentioned semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, the heating structure
Including the first heating structure being set on the pressing structure and the second heating structure being set in the bearing structure.
The present invention also provides a kind of methods using above-mentioned semiconductor device correction plastic packaging plate, which is characterized in that packet
Include following steps:
The plastic packaging plate is placed in the supporting region and heat temperature raising is carried out to the plastic packaging plate；The compacting knot
Structure is mobile towards the plastic packaging plate and makes the compacting end and the plastic packaging board joint contact application plus-pressure, to the plastic packaging plate
Gap between the supporting region applies vacuum, fits closely plastic packaging plate with the supporting region surface；Finally to correction
The smooth plastic packaging plate is cooled down.
Technical solution of the present invention has the advantages that
1. provided by the present invention for the semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip, packet
Include: bearing structure, including the supporting region for carrying the plastic packaging plate, the supporting region is plane setting；Vacuum passage, if
In in the bearing structure, and it is connected to setting with the supporting region, between the plastic packaging plate and the supporting region
Gap applies vacuum；Pressing structure is set to above the bearing structure and moves back and forth along perpendicular to the supporting region direction,
The pressing structure, which has, to be correspondingly arranged and for strong without applying at exposed die to the plastic packaging plate with the plastic packaging plate
The contact surface of the compacting end of normal pressure, the compacting end and the plastic packaging plate is plane；Heating structure is set to the carrying and ties
On structure and/or the pressing structure, for heating up to the plastic packaging flat heater.Can all there be exposed core on the surface of plastic packaging plate
Piece, when carrying out warpage correction to plastic packaging plate, the one side of usually not exposed die is contacted with supporting region, there is exposed die
One is arranged facing towards pressing structure, if pressing structure has pressing on one side for exposed die to plastic packaging plate by plane
System, it will usually damage these chips, therefore by true from applying between one side and supporting region of the plastic packaging plate without exposed die
Sky, while application pressure at chip is not pasted to the one side that plastic packaging plate has exposed die, it can not damaged under the cooperation of the two
Under the premise of bad chip, the plastic packaging plate of warpage is set to obtain height smooth.
2. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
Stating compacting end is the ring structure being adapted to the plastic packaging plate peripheral shape, applies correction with the periphery to the plastic packaging plate
Pressure.The plastic packaging plate for generally comprising IC chip has a side of staying of one fixed width, i.e., around the plate in several millimeters
(3-6 millimeters usual) does not paste chip in advance, therefore the design for suppressing end ring structure can press plastic packaging plate periphery
System, simultaneously because being generally difficult to closely be pasted with supporting region at plastic packaging plate edge when applying vacuum to the plastic packaging plate back side
It closes, i.e., plate edge can not be sucked by vacuum, therefore suppress end by annular and suppress to plastic packaging plate periphery and reach smooth
Plastic packaging plate peripheral edge margin, while edge is pressed intermediate position can also be made to play the role of promotion when applying vacuum, accelerates
Plastic packaging plate planarizes process.
3. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
State vacuum passage be connected to the supporting region surface setting groove and/or duct, the vacuum passage include at least one
Extend to the connector being arranged outside the bearing structure.The vacuum passage is the groove being correspondingly arranged with the supporting region.
The groove includes several line flowing channels and several arced flow paths, and several line flowing channel parallel arrangements are two neighboring described
The head and the tail of line flowing channel are connected to by the arced flow path.Such structure design can also be passed through inertia into groove when needed
Gas increases the heat transfer between bearing structure surface and plastic packaging plate, and obtaining plastic packaging plate more, accurately temperature controls.
4. described provided by the present invention for the semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip
Groove further includes the first connector for connecting with vacuum system and the second connector for the inert gas that circulates.Two
The design of connector can be more easily attached with different device, to realize different functions.
5. including in the semiconductor device of plastic packaging sheet warpage of IC chip, also provided by the present invention for correcting
Including the guard circle for being set on the pressing structure and being set on the outside of the compacting end, the compacting end is to the plastic packaging
When plate applies pressure, the guard circle is sheathed on the plastic packaging flat board outer rim to prevent the plastic packaging plate deformation.Guard circle
Structure design can guarantee that plastic packaging plate will not deform in correcting process, protect plastic packaging plate integrality.
6. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
It is plane setting that guard circle, which is stated, close to one end of the plastic packaging plate, and the compacting end and the guard circle are tied along the compacting
The difference in height of the moving direction of structure is less than the thickness of the plastic packaging plate.The design of such structure compacting end to plastic packaging plate into
When row applies pressure, guard circle will not stop compacting end to move downward, and contact compacting end successfully simultaneously with plastic packaging plate
It is carried out to apply correction pressure.
7. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
State when guard circle is sheathed on outside the plastic packaging plate that there are gaps between the plastic packaging plate.Such structure design can reach
To the protection indeformable purpose of plastic packaging plate, while may insure not damaging modeling when guard circle is moved up and down from plastic packaging plate periphery
Seal plate.
8. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
It states compacting end and is connect with the pressing table using dismountable mode.Such design can make to suppress end as independent portion
Part, so as to freely replace the pressure end of corresponding size according to plastic packaging panel size to be processed.
9. including institute in the semiconductor device of plastic packaging sheet warpage of IC chip provided by the present invention for correcting
It states and is provided with several in heat temperature raising in pressing table, make the gas evaporated in the capsulation material of the plastic packaging plate
The through-hole escaped out from compacting gap.When plastic packaging plate is heated in top, the lower part of device, inside plastic packaging plate
Steam or other organic gas will evaporate inside plate, and gas can escape from edge at the beginning, but in plastic packaging
When plate edge is pressed end extruding, the steam evaporated or other organic gas just gather plastic packaging planar surface and compacting
In gap between structure, pressure can be inhaled into the surface part of plastic packaging plate again again after increasing quickly, can reduce in this way
The subsequent quality for doing cloth conductor wire related process on the surface thereof, therefore the setting of through-hole may be implemented plastic packaging plate and stuck up
While song correction, some processes in plastic packaging plate degasification technique can also be realized, when shortening the technique of subsequent degasification technique
Between, to improve the production efficiency of integrated artistic process.
10. provided by the present invention in semiconductor device of the correction comprising the plastic packaging sheet warpage of IC chip,
The through-hole penetrates through the upper and lower surfaces setting of the pressing table.Such design can make gas escape more smooth.
11. provided by the present invention in semiconductor device of the correction comprising the plastic packaging sheet warpage of IC chip,
The heating structure includes the first heating structure being set on the pressing structure and is set in the bearing structure
Second heating structure.Such design may be implemented device and heat simultaneously to the upper and lower part of plastic packaging plate, to make
The heat temperature raising of plastic packaging plate faster, is integrally heated more evenly.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the semiconductor device for correcting plastic packaging sheet warpage of the invention；
Fig. 2 is the bottom view of the pressing structure in the semiconductor device shown in FIG. 1 for correcting plastic packaging sheet warpage；
Fig. 3 is the top view of the bearing structure in the semiconductor device shown in FIG. 1 for correcting plastic packaging sheet warpage；
Description of symbols:
1- suppresses platform；2- guard circle；3- bearing structure；4- suppresses end；5- plastic packaging plate；6- through-hole.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
Embodiment 1
As shown in Figure 1-3, being according to the present invention for correcting the plastic packaging sheet warpage comprising IC chip
A kind of specific embodiment of semiconductor device comprising bearing structure 3, vacuum passage, pressing structure, guard circle 2 and add
Heat structure.
In the present embodiment, bearing structure 3 includes the supporting region for carrying the plastic packaging plate 5, and the supporting region is
Plane setting.The surface of supporting region is needed by polishing treatment, to guarantee not making its back when carrying out warpage correction to plastic packaging plate
Face generates scratch.
In the present embodiment, vacuum passage is set in the bearing structure 3, and is connected to setting with the supporting region, is used for
Vacuum is applied to the gap between the plastic packaging plate 5 and the supporting region, so that it is guaranteed that the plastic packaging plate back side can be smooth
It is fitted on supporting region surface；Supporting region needs that there is good thermal conducting function material to be made.
Further, the vacuum passage is groove and/or the duct that setting is connected to the supporting region surface, described true
Empty channel includes that at least one extends to the connector being arranged outside the bearing structure 3.In the present embodiment, the vacuum is logical
Road is the groove being correspondingly arranged with the supporting region.Further, the groove includes several line flowing channels and several arc streams
Road, several line flowing channel parallel arrangements, the head and the tail of the two neighboring line flowing channel are connected to by the arced flow path.This
The structure design of sample can also be passed through inert gas into groove when needed, increase between bearing structure surface and plastic packaging plate
Heat transfer, so that plastic packaging plate obtains more, accurately temperature is controlled.The outer rim of the groove is suitable for covering supporting region, simultaneously
The size of groove, which meets, reaches expected vacuum degree or gas flow when applying vacuum or circulated gases, can be according to practical need
It wants, sets 1-4 millimeters deep for groove dimensions, it is 1-4 millimeters wide.Such structure design can make plastic packaging plate and supporting region
Between application vacuum effectiveness it is more preferable, realize the planarizing of entire plastic packaging plate.
After application vacuum promotes plastic packaging plate and supporting region surface to fit closely between plastic packaging plate and supporting region, work as needs
When plastic packaging plate is removed from supporting region, it can also be passed through inert gas into groove, the back side of plastic packaging plate is made to quickly reach 1
A atmospheric pressure realizes the front and back pressure balance of plastic packaging plate, convenient for removing the plastic packaging plate after correction out of supporting region.
In pressing structure and bearing structure to plastic packaging flat heater to certain temperature, and compacting termination is made to contact plastic packaging plate
Top surface edge part can be used after reaching scheduled pressure and being kept for the defined time and be passed through inert gas in groove
(such as helium, argon, nitrogen), so that the temperature that plastic packaging plate is heated is more accurate and uniform.It is needing to cool down plastic packaging plate
When, the inert gas in groove can make the heat of plastic packaging plate quickly be transmitted to the cooling layer of bearing structure bottom.
The structure of groove can be determined according to the shape of plastic packaging plate, and as alternative embodiment, groove can also be
The groove or other grooves corresponding with plastic packaging panel size shape of annular setting.
Further, the groove further includes the first connector for connecting with vacuum system and for the inertia that circulates
Second connector of gas.The design of two connectors can be more easily attached with different device, to realize difference
Function, to facilitate to being vacuumized or carried out to be filled with inert gas in groove.
In the present embodiment, pressing structure is set to 3 top of bearing structure and along perpendicular to the supporting region direction
It moves back and forth, the pressing structure, which has, to be correspondingly arranged with the plastic packaging plate 5 and be used for the plastic packaging plate 5 without exposed core
Apply the compacting end 4 of correction pressure at piece, the end 4 and the contact surface of the plastic packaging plate 5 of suppressing is plane.Pressing structure with
Bearing structure is correspondingly arranged, and the lower surface at compacting end 4 requires height smooth, smooth, need to pass through polishing treatment, to avoid to modeling
It seals when plate 5 applies correction pressure and damages plastic packaging plate 5, while being conducive to heat radiation.Pressing structure can be by electronic, pneumatic or oily
Its edge of pressure driving is moved up and down perpendicular to supporting region direction.
Further, the compacting end 4 is the ring structure being adapted to 5 peripheral shape of plastic packaging plate, to described
The periphery of plastic packaging plate 5 applies correction pressure.The width of the contact surface at the compacting end 4 and plastic packaging plate periphery of annular setting can root
It is set as 3-6 millimeters according to actual needs.It can make the plastic packaging flat board overall of warpage under the cooperation of compacting end 4 and application vacuum
It is planarized.
In the present embodiment, the pressing structure further includes the pressing table for being set to the compacting end 4 top, pressing table with
Supporting region is correspondingly arranged, and compacting end 4 is set to below pressing table, as shown in Figure 1, pressing table is a platform, i.e., pressing table is upper
Surface and lower surface are plane setting；Pressing table can usually be made by aluminium alloy, ceramic material, heat proof material, stainless steel etc.
Make；Pressing table needs lower surface flat and smooth, to increase heat-conductive characteristic.
Further, the compacting end 4 is connect with the pressing table using dismountable mode.Such design can make
Suppressing end 4 becomes independent component, so as to freely replace corresponding size according to warpage plastic packaging panel size to be processed
Suppress end 4.
Further, it is provided in the pressing table several for making the plastic packaging of the plastic packaging plate 5 in heat temperature raising
The through-hole 6 that the gas evaporated in material is escaped out from compacting gap.
Further, the through-hole 6 penetrates through the upper and lower surfaces setting of the pressing table.
In the present embodiment, guard circle 2 is set on the pressing structure and is set in 4 outside of compacting end, described
When suppressing end 4 to the plastic packaging plate 5 application pressure, it is described to prevent that the guard circle 2 is sheathed on 5 outer rim of plastic packaging plate
Plastic packaging plate 5 deforms.Guard circle 2 is set to below pressing table, in order to guarantee that 5 edge of plastic packaging plate is not damaged, in guard circle 2
Ring size is more somewhat larger than 5 size of plastic packaging plate, can be set as 1 millimeter according to actual needs or close to 1 millimeter, ability is true in this way
It protects when guard circle 2 is moved up and down from the periphery of plastic packaging plate 5 and does not damage plastic packaging plate 5, to guarantee that warpage plastic packaging plate is being corrected
Edge will not be damaged in the process, do not influence the integrality of plastic packaging plate after correction.
Further, the guard circle 2 close to one end of the plastic packaging plate 5 be plane setting, and the compacting end 4 and
The difference in height of moving direction of the guard circle 2 along the pressing structure is less than the thickness of the plastic packaging plate 5.As shown in Figure 1,
The thickness of guard circle 2 is greater than the thickness at compacting end 4, and the thickness difference of the two is necessarily less than the thickness of plate, such as: compacting end 4 is thick
Degree is 2 millimeters, and the thickness requirement of guard circle 2 is not more than 2.5 millimeters, and such structure design carries out plastic packaging plate at compacting end
When applying pressure, guard circle, which will not stop to suppress end, to be moved downward, and is allow to suppress end and is successfully contacted with plastic packaging plate and right
It carries out applying correction pressure, while also needing guard circle 2 is made to be located at 5 outer rim of plastic packaging plate to protect it, prevent its deformation.
Further, the guard circle 2 be sheathed on the plastic packaging plate 5 it is outer when and the plastic packaging plate 5 between there are
Gap.Further, the gap is less than 1 millimeter, and the shape and size of guard circle 2 are corresponding to plastic packaging plate, in this reality
Apply in example, plastic packaging plate be it is rectangular, guard circle is also rectangular, and size is corresponding, with meet plastic packaging plate can be protected not become
The purpose of shape, while ensuring to damage the edge of plastic packaging plate when guard circle is moved up and down from the periphery of plastic packaging plate.
Further, guard circle 2 is connect with pressing table using dismountable mode, and guard circle 2 is made to become independent component,
The guard circle 2 of corresponding size can freely be replaced according to the size of plastic packaging plate 5 to be processed in this way.Specifically, guard circle 2
And compacting end can be connect by flat-top screw with pressing table,
In the present embodiment, heating structure is set on the bearing structure 3 and/or the pressing structure, for described
5 heat temperature raising of plastic packaging plate.Further, the heating structure includes the first heating structure being set on the pressing structure
And it is set to the second heating structure in the bearing structure 3.Specifically, the first heating structure and the second heating structure
For the Resistant heating system being respectively arranged in pressing structure and bearing structure.
In the present embodiment, support frame is additionally provided in bearing structure bottom end.
Can all there be exposed chip on the surface of plastic packaging plate, usually not naked when correcting to warpage plastic packaging plate
The one side of dew chip is contacted with supporting region surface, has the one of exposed die to be arranged facing towards pressing structure, if pressing structure is logical
It crosses plane and plastic packaging plate is on one side suppressed with exposed die, it will usually damage exposed die, therefore by from plastic packaging
Plate has the one side of exposed die to plastic packaging plate without applying vacuum between the one side and supporting region of exposed die
It stays border region to apply correction pressure, under the cooperation of the two, neither damages exposed die, and warpage plastic packaging plate is made to obtain height
It is smooth.Usual plastic packaging plate patch has the side of staying of one fixed width, i.e., does not paste and appoint in advance within 3-6 millimeters of plate edge
What chip, therefore the design for suppressing end ring structure can suppress plastic packaging plate periphery, simultaneously because to plastic packaging plate
When vacuum is aspirated at the back side, plastic packaging flat board outer rim is generally difficult to be fitted closely with supporting region surface, i.e., edge usually can not
It is sucked by vacuum, therefore plastic packaging plate periphery is suppressed using annular compacting end, it is smooth that plastic packaging plate periphery may be implemented
Change, while edge is pressed intermediate position can also be made to play facilitation when applying vacuum, improves warpage plastic packaging plate
Planarization effects.
Semiconductor device of the invention is suitable for warpage plastic packaging wafer or plate to the shapes such as circle, square, rectangle
It is corrected.Rectangular plastic packaging plate can be square or rectangle, its warped shapes plastic packaging wafer compared with degree are wanted
It is much more complex, in addition to whole convex, female type warpage, there are also part corner warpages, or even there are small-scale convex, recessed combination shapes
The corrugated shape warpage of formula, therefore the warpage of rectangular plastic packaging plate corrects obtain bigger than the difficulty that the warpage of plastic packaging wafer is corrected
More, semiconductor device of the invention may be implemented to implement correction work to the warpage form and large scale plastic packaging plate of various complexity
Skill realizes the plastic packaging flat board overall planarizing of warpage.
Embodiment 2
The present invention provides a kind of method using the correction plastic packaging plate of semiconductor device described in embodiment 1 comprising
Following steps:
The plastic packaging plate 5 is placed in the supporting region and heat temperature raising is carried out to the plastic packaging plate 5；The compacting
Structure is mobile towards the plastic packaging plate 5 and the compacting end 4 is made to contact application pressure with the plastic packaging plate 5, to the modeling
The gap sealed between plate 5 and the supporting region applies vacuum, fits closely plastic packaging plate 5 with the supporting region surface；Most
The plastic packaging plate 5 smooth to correction cools down afterwards.
The warpage plastic packaging plate for being fanned out to encapsulation to be corrected, is sent in the cavity of semiconductor device, is placed exactly in and holds
It carries on area surface, bearing structure is preheating to the temperature of technique requirement；Pressing structure is also heated to preset temperature by technique requirement,
Pressing structure moves down along perpendicular to the direction of supporting region, i.e. vertical direction shown in Fig. 1, at the same by pressing structure from
Plastic packaging plate is just heated in face of it；When the heated heating of plastic packaging plate, it is whole it is substantially smooth after, compacting end on pressing structure with
The edge surface of plastic packaging plate contacts；Pressure according to process requirement, needed for being provided by pressing structure；Plastic packaging plate back
After face contact to supporting region surface, the first connector of groove is connected into upper vacuum system and applies vacuum, such plastic packaging plate quilt
Suction is fitted closely with supporting region surface；Heating system, according to process requirement, can independently add each region using automatically controlling
Temperature of the heat to technique setting；After plastic packaging plate reaches the temperature and pressure of technique initialization, keep technique predetermined with this condition
Time；Heating power supply is cut off, plastic packaging plate is allowed slowly to cool down, heat transfer can also be accelerated the bottom of to inert gas is passed through in groove
The cooling layer in portion removes the pressure of pressure end application after plastic packaging plate is cooled to scheduled temperature, and pressing structure has been elevated
Come, inert gas is filled with out of bearing structure groove and rises to 1 atmospheric pressure, so that the plastic packaging plate after correcting is from supporting region
Interior removal, the plastic packaging plate after correcting at this time are sent to special cooling chamber from chamber, are further cooled to room temperature.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (16)
1. the semiconductor device for correcting the plastic packaging sheet warpage comprising IC chip characterized by comprising
Bearing structure (3), including the supporting region for carrying the plastic packaging plate (5), the supporting region is plane setting；
Vacuum passage is set on the bearing structure (3), and is connected to setting with the supporting region, for the plastic packaging plate
(5) gap between the supporting region applies vacuum；
Pressing structure is set to above the bearing structure (3) and moves back and forth along perpendicular to the supporting region direction, the pressure
Structure processed, which has, to be correspondingly arranged and for strong without applying at exposed die to the plastic packaging plate (5) with the plastic packaging plate (5)
The contact surface of the compacting end (4) of normal pressure, compacting end (4) and the plastic packaging plate (5) is plane；
Heating structure is set on the bearing structure (3) and/or the pressing structure, for heating to the plastic packaging plate (5)
Heating.
2. it is according to claim 1 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, compacting end (4) is the ring structure being adapted to plastic packaging plate (5) peripheral shape, to the modeling
The periphery for sealing plate (5) applies correction pressure.
3. it is according to claim 1 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the vacuum passage is groove and/or the duct for being connected to setting with the supporting region surface, the vacuum passage
The connector being arranged outside the bearing structure (3) is extended to including at least one.
4. it is according to claim 3 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the vacuum passage is the groove being correspondingly arranged with the supporting region.
5. it is according to claim 4 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the groove includes several line flowing channels and several arced flow paths, several line flowing channel parallel arrangements, phase
The head and the tail of adjacent two line flowing channels are connected to by the arced flow path.
6. it is according to claim 5 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the groove further includes the first connector for connecting with vacuum system and for the inert gas that circulates
Second connector.
7. it is according to claim 1 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, further including the guard circle (2) for being set on the pressing structure and being set on the outside of compacting end (4), institute
When stating compacting end (4) to the plastic packaging plate (5) application pressure, the guard circle (2) is sheathed on plastic packaging plate (5) outer rim
To prevent the plastic packaging plate (5) from deforming.
8. it is according to claim 7 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the guard circle (2) close to the plastic packaging plate (5) one end be plane be arranged, and the compacting end (4) and
The difference in height of moving direction of the guard circle (2) along the pressing structure is less than the thickness of the plastic packaging plate (5).
9. it is according to claim 8 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the guard circle (2) be sheathed on the plastic packaging plate (5) it is outer when and the plastic packaging plate (5) between there are
Gap.
10. it is according to claim 9 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the gap is less than 1 millimeter.
11. it is according to claim 1 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the pressing structure further includes the pressing table being set to above compacting end (4).
12. the semiconductor dress according to claim 11 for correcting the plastic packaging sheet warpage comprising IC chip
It sets, which is characterized in that the compacting end (4) is connect with the pressing table using dismountable mode.
13. the semiconductor dress according to claim 11 for correcting the plastic packaging sheet warpage comprising IC chip
It sets, which is characterized in that be provided in the pressing table several for making the plastic packaging of the plastic packaging plate (5) in heat temperature raising
The through-hole (6) that the gas evaporated in material is escaped out from compacting gap.
14. the semiconductor dress according to claim 13 for correcting the plastic packaging sheet warpage comprising IC chip
It sets, which is characterized in that the through-hole (6) penetrates through the upper and lower surfaces setting of the pressing table.
15. it is according to claim 1 for correcting the semiconductor device of the plastic packaging sheet warpage comprising IC chip,
It is characterized in that, the heating structure includes the first heating structure being set on the pressing structure and is set to described hold
Carry the second heating structure on structure (3).
16. a kind of method using any semiconductor device correction plastic packaging plate of claim 1-15, feature exist
In, comprising the following steps:
The plastic packaging plate (5) is placed in the supporting region and heat temperature raising is carried out to the plastic packaging plate (5)；The compacting
Structure is mobile towards the plastic packaging plate (5) and the compacting end (4) is made to contact application pressure with the plastic packaging plate (5), right
Gap between the plastic packaging plate (5) and the supporting region applies vacuum, keeps plastic packaging plate (5) and the supporting region surface tight
Closely connected conjunction；The plastic packaging plate (5) finally smooth to correction cools down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811562108.4A CN109801859A (en) | 2018-12-19 | 2018-12-19 | It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811562108.4A CN109801859A (en) | 2018-12-19 | 2018-12-19 | It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage |
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| CN109801859A true CN109801859A (en) | 2019-05-24 |
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| CN201811562108.4A Pending CN109801859A (en) | 2018-12-19 | 2018-12-19 | It is a kind of for correcting the semiconductor device and antidote of plastic packaging sheet warpage |
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Application publication date: 20190524 |