CN104916574A - Flexible OLED demoulding device - Google Patents
Flexible OLED demoulding device Download PDFInfo
- Publication number
- CN104916574A CN104916574A CN201510192320.6A CN201510192320A CN104916574A CN 104916574 A CN104916574 A CN 104916574A CN 201510192320 A CN201510192320 A CN 201510192320A CN 104916574 A CN104916574 A CN 104916574A
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- Prior art keywords
- substrate
- oled
- laser
- base station
- flexible
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a flexible OLED demoulding device. The flexible OLED demoulding device comprises a main machine platform, and the upper plane of the main machine platform is provided with a movable substrate adsorption base station; the substrate adsorption base station is used to adsorb an OLED substrate; the main machine platform comprises an OLED substrate placing area and an OLED substrate laser irradiation area; the upper part of the OLED substrate placing area is provided with a hanging machine platform; the upper part of the laser irradiation area is provided with a laser generator, and the laser generator performs laser irradiation on the OLED substrate in the laser irradiation area through a linear array laser source disposed on the laser generator; and the lower surface of the hanging machine platform is provided with vacuum cups, and the vacuum cups and the hanging machine platform are connected through a cylinder. The upper part of the OLED substrate placing area is provided with the hanging machine platform, so stripping between a rigid supporting base and a flexible OLED film of the OLED substrate 12 occurs, and then a flexible OLED substrate is obtained; and the device has the effect that the rigid supporting base can be accurately and rapidly separated from a flexible supporting base.
Description
Technical field
The invention belongs to OLED and show manufacturing technology field, particularly relate to a kind of flexible OLED device for removing scum.
Background technology
The application of OLED flexible device is more and more extensive, from various large-scale curved display unit to intelligent miniature application end, as intelligent watch, wrist strap etc., has all started to be used widely.Compared to traditional panel display screen, flexible OLED application characteristic is obviously more superior, and expanding space of its market is also boundless.
Now ripe flexible OLED manufacturing process in rigid substrate (as glass substrate), makes flexible substrate (high molecular polymer) on flexible substrate, make OLED electrode and ray structure again.And after completing all manufacturing processes, need rigid substrate to be separated with flexible substrate, namely realize the demoulding of flexible OLED.
Summary of the invention
Technical problem to be solved by this invention is, needs accurately, fast rigid substrate to be separated with flexible substrate.
For solving the problems of the technologies described above, technical scheme of the present invention is: provide a kind of flexible OLED device for removing scum, comprise main engine bed, and the upper plane of main engine bed is provided with moveable substrate adsorption base station; Described substrate adsorption base station is for adsorbing oled substrate;
Described main engine bed comprises oled substrate put area and oled substrate laser-irradiated domain; The top of described oled substrate put area is provided with suspension board; The top of described laser-irradiated domain is provided with laser generator, and laser irradiation is carried out to the oled substrate in laser-irradiated domain in the linear array laser source that laser generator is provided with by it;
The lower surface of described suspension board is provided with vacuum cup, is connected between described vacuum cup with suspension board by cylinder.
Further, also comprise automatic manipulator, substrate cartridge and transport tape, described automatic manipulator is arranged on the front end of main engine bed, described transport tape and main engine bed horizontal parallel; Substrate cartridge is arranged on one side of automatic manipulator.
Further, be coupled by slide rail between described main engine bed and substrate adsorption base station.
Further, the surface of described substrate adsorption base station has Process is vacuum suction base station.
Further, the bottom of described substrate cartridge 4 is provided with card casket pedestal 11.
Beneficial effect of the present invention: the top due to oled substrate put area is provided with suspension board, the rigid substrate of oled substrate 12 and flexible OLED film are peeled off, obtain flexible oled substrate, this device has accurately and rapidly the effect that rigid substrate is separated with flexible substrate.
Accompanying drawing explanation
Fig. 1 is this programme structure vertical view;
Fig. 2 is this programme structure side view;
Wherein, 1, main engine bed, 2, substrate adsorption base station, 3, automatic manipulator, 4, substrate cartridge, 5, laser generator, 6, linear array laser source, 7, hang board, 8, cylinder, 9, vacuum cup, 10, transport tape, 11, card casket pedestal, 12, oled substrate.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the invention will be further elaborated.
As illustrated in fig. 1 and 2, a kind of flexible OLED device for removing scum, comprises main engine bed 1, and the upper plane of main engine bed 1 is provided with moveable substrate adsorption base station 2; Described substrate adsorption base station 2 is for adsorbing oled substrate 12.
Main engine bed 1 comprises substrate put area and substrate laser irradiation area; The top of described substrate put area is provided with and hangs board 7; The top of described laser-irradiated domain is provided with laser generator 5, and laser generator 5 carries out laser irradiation by the oled substrate 12 in its laser-irradiated domain, 6 pairs, linear array laser source be provided with; Be coupled by slide rail between main engine bed 1 and substrate adsorption base station 2, substrate adsorption base station 2 is the vacuum suction base station that surface has Process, substrate adsorption base station 2 adsorbs oled substrate 12 and enters into substrate laser irradiation area along slide rail from substrate put area, and oled substrate 12 back and forth runs along sled position at substrate laser irradiation area.
The lower surface hanging board 7 is provided with vacuum cup 9, be connected by cylinder 8 between described vacuum cup 9 with suspension board 7, cylinder 8 can control vacuum cup 9 reciprocating motion in vertical direction, vacuum cup 9 attached live in surface flexible panel, the little segment distance of the quick startup optimization of the rigid substrate that while cylinder upwards slightly packs up adsorption plate, bottom base station adsorbs, makes rigid substrate and flexible OLED film peel off.
Flexible OLED device for removing scum also comprises automatic manipulator 3, substrate cartridge 4 and transport tape 10, described automatic manipulator 3 is arranged on the front end of main engine bed 1, substrate cartridge 4 is arranged on one side of automatic manipulator 3, and oled substrate 12 takes out and is placed on absorption oled substrate 12 by automatic manipulator 3 from substrate cartridge 4.Transport tape 10 and main engine bed 1 horizontal parallel, suspension board 7 moves to the oled substrate 12 demoulding completed above transmission 10 band and is placed on rear on transport tape 10 reset.
During work, production operation personnel are placed on the substrate cartridge 4 that oled substrate 12 is housed on the fixing card casket pedestal 11 in position; Automatic manipulator 3 layering from substrate cartridge 4 is extracted the oled substrate 12 not carrying out demoulding process out and is placed on substrate adsorption base station 2, and main engine bed 1 vacuum is opened, and is fixed by the oled substrate 12 not carrying out demoulding process be placed on substrate adsorption base station 2.After laser is opened again, substrate adsorption base station 2 delivers the oled substrate 12 not carrying out demoulding process and enters laser-irradiated domain, and laser generator 5 carries out laser irradiation by the oled substrate 12 in its laser-irradiated domain, 6 pairs, linear array laser source be provided with.Substrate adsorption base station 2 drives the oled substrate 12 not carrying out demoulding process back and forth to run along slide rail in laser-irradiated domain, laser is made fully to irradiate oled substrate 12 all positions, it is obtain energy between flexible substrate and rigid substrate to allow adhesion is therebetween weakened that laser irradiates, the power invariability of Laser output, if want to make flexible substrate and rigid substrate to be peeled off smoothly, just need repeatedly to irradiate it, irradiate at the laser reaching technique initialization and require that metacoxal plate adsorbs base station 2 and drives oled substrate 12 to reset.(to judge according to the material of concrete substrate and laser power as number of times repeatedly, an actual test result, an empirical value.)
Now hang board 7 to move to substrate rest area and be irradiated with a laser above the oled substrate 12 evenly, cylinder 8 promotes vacuum cup 9 and stop after vacuum cup 9 touches oled substrate 12 upper surface downwards.Now sucker vacuum opens the flexible panel that vacuum cup 9 adsorbs oled substrate 12 upper surface, cylinder is to while slightly packing up vacuum cup 9 on 8, the rigid substrate that the lower basal plate absorption base station 2 of oled substrate 12 adsorbs oled substrate 12 starts fast runs little segment distance downwards, the rigid substrate of oled substrate 12 and flexible OLED film are peeled off, obtains flexible oled substrate.This exhaust hood 8 upwards regains a segment distance again, hang board 7 to move to be placed on transport tape 10 above transport tape 10 and by flexible oled substrate and then reset, wait for the instruction that the oled substrate 12 after the irradiation evenly of next laser puts in place, flexible oled substrate is transported to next station by transport tape 10.Meanwhile, substrate adsorption base station 2 vacuum is abolished, and the rigid substrate that automatic manipulator 3 picks up demoulding puts into it originally in the position of substrate cartridge 4.
By this operating procedure, the oled substrate 12 that automatic manipulator 3 extracts other non-demouldings again out carries out the operation of above step, after in substrate cartridge, all oled substrate 12 demoulding completes in 4, production operators is again to 4 replacing in whole substrate cartridge, and in substrate cartridge, 4 are arranged on card casket pedestal 11.Actual adjustment can be carried out according to need of production in the position of casket pedestal 11.
Those of ordinary skill in the art will appreciate that, embodiment described here is to help reader understanding's principle of the present invention, should be understood to that protection scope of the present invention is not limited to so special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combination of not departing from essence of the present invention according to these technology enlightenment disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
Claims (6)
1. a flexible OLED device for removing scum, is characterized in that: comprise main engine bed (1), and the upper plane of main engine bed (1) is provided with moveable substrate adsorption base station (2); Described substrate adsorption base station (2) is for adsorbing oled substrate (12);
Described main engine bed (1) comprises oled substrate put area and oled substrate laser-irradiated domain; The top of described oled substrate put area is provided with and hangs board (7); The top of described laser-irradiated domain is provided with laser generator (5), and laser generator (5) carries out laser irradiation by its linear array laser source (6) be provided with to the oled substrate (12) in laser-irradiated domain;
The lower surface of described suspension board (7) is provided with suction tray, is connected between described suction tray with suspension board (7) by cylinder (8).
2. flexible OLED device for removing scum according to claim 1, it is characterized in that: also comprise automatic manipulator (3), substrate cartridge (4) and transport tape (10), described automatic manipulator (3) is arranged on the front end of main engine bed (1), described transport tape (10) and main engine bed (1) horizontal parallel; Substrate cartridge (4) is arranged on one side of automatic manipulator (3).
3. flexible OLED device for removing scum according to claim 1, be is characterized in that: be coupled by slide rail between described main engine bed (1) and substrate adsorption base station (2).
4. flexible OLED device for removing scum according to claim 1, is characterized in that: described substrate adsorption base station (2) is the vacuum suction base station that surface has Process.
5. flexible OLED device for removing scum according to claim 2, is characterized in that: the bottom of described substrate cartridge (4) is provided with card casket pedestal (11).
6. flexible OLED device for removing scum according to claim 1, is characterized in that: described suction tray is vacuum cup (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510192320.6A CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510192320.6A CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104916574A true CN104916574A (en) | 2015-09-16 |
| CN104916574B CN104916574B (en) | 2017-11-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510192320.6A Expired - Fee Related CN104916574B (en) | 2015-04-22 | 2015-04-22 | A kind of flexible OLED device for removing scum |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104916574B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098965A (en) * | 2016-06-15 | 2016-11-09 | 昆山国显光电有限公司 | Flexible base board stripping off device and flexible base board stripping means |
| CN107452898A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | A kind of laser lift-off apparatus and method |
| CN108539050A (en) * | 2018-03-12 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | The separation method of flexible panel |
| CN110556330A (en) * | 2019-09-12 | 2019-12-10 | 云谷（固安）科技有限公司 | supporting substrate, stripping device, flexible display panel and preparation method thereof |
| CN112830251A (en) * | 2019-11-22 | 2021-05-25 | 汉松新科技股份有限公司 | Batch membrane separation and inspection device for manufacturing flexible display |
| CN113517214A (en) * | 2021-07-08 | 2021-10-19 | 深圳市强生光电科技有限公司 | Laser demolding device and demolding method for LED packaging product |
| CN116995002A (en) * | 2023-09-26 | 2023-11-03 | 迈为技术(珠海)有限公司 | Wafer and glass stripping device, stripping and cleaning integrated equipment and stripping method |
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| CN102769109A (en) * | 2012-07-05 | 2012-11-07 | 青岛海信电器股份有限公司 | Method for manufacturing flexible display and substrate for manufacturing flexible display |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
| CN203910868U (en) * | 2014-06-25 | 2014-10-29 | 京东方科技集团股份有限公司 | Laser lift-off device |
| US20140374144A1 (en) * | 2012-02-16 | 2014-12-25 | Ev Group E. Thallner Gmbh | Method for the temporary connection of a product substrate to a carrier substrate |
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2015
- 2015-04-22 CN CN201510192320.6A patent/CN104916574B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140374144A1 (en) * | 2012-02-16 | 2014-12-25 | Ev Group E. Thallner Gmbh | Method for the temporary connection of a product substrate to a carrier substrate |
| CN102769109A (en) * | 2012-07-05 | 2012-11-07 | 青岛海信电器股份有限公司 | Method for manufacturing flexible display and substrate for manufacturing flexible display |
| CN103995377A (en) * | 2013-02-18 | 2014-08-20 | 群创光电股份有限公司 | Display panel manufacturing method and system |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452898A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | A kind of laser lift-off apparatus and method |
| CN107452898B (en) * | 2016-05-31 | 2019-08-23 | 上海微电子装备（集团）股份有限公司 | A kind of laser lift-off device and method |
| CN106098965A (en) * | 2016-06-15 | 2016-11-09 | 昆山国显光电有限公司 | Flexible base board stripping off device and flexible base board stripping means |
| CN108539050A (en) * | 2018-03-12 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | The separation method of flexible panel |
| CN110556330A (en) * | 2019-09-12 | 2019-12-10 | 云谷（固安）科技有限公司 | supporting substrate, stripping device, flexible display panel and preparation method thereof |
| CN110556330B (en) * | 2019-09-12 | 2022-03-22 | 云谷（固安）科技有限公司 | Supporting substrate, stripping device, flexible display panel and preparation method thereof |
| CN112830251A (en) * | 2019-11-22 | 2021-05-25 | 汉松新科技股份有限公司 | Batch membrane separation and inspection device for manufacturing flexible display |
| CN113517214A (en) * | 2021-07-08 | 2021-10-19 | 深圳市强生光电科技有限公司 | Laser demolding device and demolding method for LED packaging product |
| CN113517214B (en) * | 2021-07-08 | 2023-06-06 | 深圳市强生光电科技有限公司 | Laser demolding device and demolding method for LED packaging product |
| CN116995002A (en) * | 2023-09-26 | 2023-11-03 | 迈为技术(珠海)有限公司 | Wafer and glass stripping device, stripping and cleaning integrated equipment and stripping method |
| CN116995002B (en) * | 2023-09-26 | 2023-12-19 | 迈为技术(珠海)有限公司 | Wafer and glass stripping device, stripping and cleaning integrated equipment and stripping method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104916574B (en) | 2017-11-10 |
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