JP2013216079A - Carrier copper foil peeling device and carrier copper foil peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate peeling by simplifying peeling of a carrier copper foil which protects a surface copper foil of a copper clad laminate.SOLUTION: A carrier copper foil peeling device winds and peels a carrier copper foil attached on a rectangular copper clad laminate by a roller rotating around an axial center. The roller 33 includes a winding surface which is in contact with the carrier copper foil 11 and is adhesive. The roller 33 is arranged so as to reciprocate in an oblique direction with respect to one side of the copper clad laminate 12 to start peeling of the carrier copper foil 11 from a corner part by making a winding surface in contact with and bonded to the corner part of the carrier copper foil 11.

Description

  The present invention relates to a carrier copper foil peeling apparatus and a carrier copper foil peeling method for peeling a carrier copper foil bonded for surface protection on a copper-clad laminate used for a printed wiring board or the like.

  In general, copper-clad laminates used to manufacture printed wiring boards are made by press-molding and pasting a resin board in which a glass cloth or the like is impregnated with a thermosetting resin and a copper foil in a high-temperature vacuum atmosphere. Manufactured by.

  In recent years, with increasing density of printed wiring boards (fine patterning), copper foils bonded to copper-clad laminates are becoming thinner. When a thick copper foil is used as a copper foil for a printed wiring board for fine patterns, not only the etching time for forming a wiring circuit by etching becomes longer, but also the verticality of the side wall of the wiring pattern to be formed is easily broken. If the wiring line width of the wiring pattern is narrow, it may lead to disconnection.

  Currently, copper foil having a thickness of about 5 μm is most frequently used as a copper foil for fine pattern applications, and further thinning is required. In order to prevent deterioration of workability due to thinning and to protect the surface, the thin film copper foil is generally bonded to a carrier copper foil of about 20 μm.

  As a method for peeling such a carrier copper foil, a human method in which an operator manually peels off is generally used. Moreover, as a general film peeling method, for example, as shown in (Patent Document 1), a machine using a film peeling apparatus that holds a film end portion with an arm and winds a protective film while adjusting a peeling angle. Method.

JP 2011-104778 A

  However, in the above human peeling method, the carrier copper foil is held at one corner, so if there is a part where the adhesive strength between the carrier copper foil and the thin film copper foil is partially strong, Carrier copper foil remains and affects the next process.

  Further, in the case of a mechanical peeling method using a peeling device such as (Patent Document 1), since the carrier copper foil is not flexible, wrinkles are generated in the carrier copper foil at the time of peeling, and the wrinkles are copper-clad laminates. There is a problem that the plate is touched and scratched, and the quality is deteriorated.

  The problem to be solved by the present invention is a carrier copper foil peeling device capable of stably peeling a carrier copper foil from a copper clad laminate on which a carrier copper foil is bonded, without damaging the copper clad laminate, and It is in providing the carrier copper foil peeling method.

  In order to solve the above-mentioned problems, the present invention provides a carrier copper foil peeling apparatus that peels a carrier copper foil bonded to a rectangular copper-clad laminate while winding it with a roller that rotates around an axis. The roller has an adhesive winding surface that contacts the carrier copper foil, and contacts and bonds the winding surface to a corner of the carrier copper foil, and the carrier copper foil is peeled from the corner. As described above, the copper-clad laminate is provided so as to be reciprocally movable in an oblique direction with respect to one side.

  Here, as for a roller, it is desirable for the length dimension of an axial direction to be longer than the length of the diagonal of a copper clad laminated board.

  The roller is desirably provided so as to be capable of reciprocating so that the locus of the central portion in the axial direction coincides with one of the diagonal lines of the copper-clad laminate. Further, it is desirable that the length of the roller in the axial direction is at least twice the length of the short side of the copper-clad laminate.

  Further, the present invention provides a carrier copper foil peeling method in which a carrier copper foil bonded to a rectangular copper-clad laminate is peeled off while being wound by a roller that rotates around an axis, and is adhesive to the winding surface. A roll having a roller is used, a winding surface of the roller is brought into contact with a corner portion of the carrier copper foil, the roller is rotated, and the carrier copper foil is wound and peeled off from the copper-clad laminate on the winding surface.

  Here, the length dimension in the axial direction of the roller is set to √2 times or more of the short side length of the copper-clad laminate, and the roller has a central locus in the axial direction of the copper-clad laminate. It is desirable to reciprocate to coincide with one of the diagonal lines.

  According to the present invention, the carrier copper foil can be peeled off without wrinkles or residue by bringing an adhesive roller into contact with the corner of the copper-clad laminate and starting the peeling of the carrier copper foil from the corner. Moreover, the carrier copper foil remains on the copper-clad laminate by setting the width of this roller to be longer than the diagonal length of the carrier copper foil or more than twice the length of the short side of the copper-clad laminate. The carrier copper foil can be peeled from the copper-clad laminate without damaging the surface of the copper-clad laminate due to the wrinkles of the carrier copper foil.

It is sectional drawing which shows the external appearance structure of the carrier copper foil peeling apparatus concerning one Embodiment of this invention. It is sectional drawing which shows typically the copper clad laminated board with a carrier copper foil installed in the stage part of the apparatus of FIG. FIG. 5 is a plan view illustrating a positional relationship between a laminated plate placed on a belt conveyor and a robot arm for explaining an embodiment of the present invention. It is for describing one embodiment of the present invention, and is a schematic diagram showing the relationship between a copper-clad laminate and the length of a roller.

  Hereinafter, a carrier copper foil peeling apparatus and a carrier copper foil peeling method according to embodiments of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is a cross-sectional view showing an external configuration of a carrier copper foil peeling apparatus according to an embodiment of the present invention.

  The carrier copper foil peeling apparatus of this embodiment is a stage part 20 for placing a copper-clad laminate, a peeling part 30 for peeling the carrier copper foil, and a dumping of the peeled carrier copper foil. It is comprised with the copper foil dumping part 40. FIG.

  As shown in FIG. 2, the stage unit 20 is obtained by attaching a suction stage 22 such as a vacuum chuck on a belt conveyor 21. The copper-clad laminate 10 with carrier copper foil is adsorbed on the adsorption stage 22 and conveyed. By adsorbing the copper-clad laminate 10 with carrier copper foil by the adsorption stage 22, the copper-clad laminate 12 is displaced by the peeling roller 31 together with the carrier copper foil 11 when the carrier copper foil 11 is separated. It can be prevented from getting caught. Further, by installing the suction stage 22 on the belt conveyor 21, it is possible to continuously peel without moving the installation position of the peeling unit 30.

  The copper-clad laminate 12 is often configured by laminating a resin plate with a very thin copper foil (not shown) and a carrier copper foil 11 that are larger than the resin plate, and pressing them. Therefore, the size of the copper-clad laminate 12 and the carrier copper foil 11 is large. Are often approximately equal.

  The peeling unit 30 includes a peeling roller 31 and a robot arm 32. Among these, the peeling roller 31 is composed of a roller 33 made of an adhesive substance, a rotating portion 35 and a bracket 34. The roller 33 rotates about the axis, and the width of the roller 33 (the width in the axial direction) is a diagonal line of the copper-clad laminate 10 with carrier copper foil placed on the suction stage 22. It is longer than the length. This is because the roller 33 covers the entire copper-clad laminate 12 even when the moving direction of the peeling roller 31 is inclined with respect to the copper-clad laminate 12. The peeling roller 31 is detachable from the bracket 34 with respect to the robot arm 32, and a predetermined shape is selected according to the size of the copper-clad laminate 12 with the carrier copper foil.

  The roller 33 is formed of a substance having a sticky surface. More specifically, the adhesive strength with the carrier copper foil is made of a material stronger than the adhesive strength between the carrier copper foil and the copper-clad laminate. This material may be, for example, a metal coated with an adhesive material on the surface, but may be silicon or rubber having adhesiveness to prevent damage to the copper-clad laminate 10 with carrier copper foil due to contact with the roller 33. desirable. Alternatively, the portion through which the rotary shaft 35 is inserted may be formed of metal or resin, and the roller 33 that is a contact surface with the carrier copper foil 11 may be formed of adhesive rubber.

  On the other hand, as shown in FIG. 3, the robot arm 32 is installed at a position where the robot arm 32 can sufficiently reach the corner portion of the suction stage 22 farthest from the peeling portion 30. The peeling roller 31 is moved in an oblique direction with respect to the copper-clad laminate 12. For example, the peeling roller 31 is perpendicular to the diagonal line of the copper-clad laminate 12, and the locus of the roller center is aligned with the direction parallel to the diagonal line of the copper-clad laminate 12.

  The copper foil dumping part 40 is constituted by a dumping box 42 provided with a winding roller 41, and is disposed between the stage part 20 and the peeling part 30.

  Next, an example of the carrier copper foil peeling method according to the present embodiment will be specifically described with reference to the carrier copper foil peeling device shown in FIGS. In this embodiment, the object to be peeled is described as a copper-clad laminate 10 with a rectangular carrier copper foil used for a general printed wiring board.

  The copper-clad laminate 10 with carrier copper foil is formed by laminating a thin film copper foil with carrier copper foil on a glass cloth impregnated resin plate, and is installed on the stage unit 20 as shown in FIG.

  First, a carrier copper foil peeling step for peeling the carrier copper foil 11 while winding it with the peeling roller 31 will be described with reference to FIG. Here, for the sake of explanation, in the drawing, a glass cloth-impregnated resin plate and a thin film copper foil are integrated as a copper-clad laminate 12, and a protective copper copper foil 11 is attached to the copper-clad laminate 12 as carrier copper. The copper clad laminated board 10 with foil is represented. In addition, in this embodiment, although carrier copper foil 11 is bonded only to the single side | surface of the copper clad laminated board 12, even if it is bonded on both surfaces, there will be no trouble.

  With the carrier copper foil 11 to be peeled off, the copper-clad laminate 10 with the carrier copper foil is sucked and held on the suction stage 22 (see FIG. 2). Next, the robot arm 32 is driven, and the peeling roller 31 whose contact surface with the carrier copper foil 11 is made of an adhesive substance is moved to the farthest corner from the peeling device of the copper-clad laminate 10 with the carrier copper foil. At this time, the peeling roller 31 is translated at a height that does not contact the copper-clad laminate 10 with the carrier copper foil. The peeling roller 31 is stopped once when it moves to the upper part of the base end of the carrier copper foil 11.

  Next, the robot arm 32 is driven, and the peeling roller 31 is rotated toward the center of the bracket so that the axial center direction is perpendicular to the diagonal line of the copper-clad laminate 10 with the carrier copper foil, and then brought closer. Then, with the roller 33 of the peeling roller 31 adhered to the corner of the carrier copper foil 11, the peeling roller 31 is once again stopped.

  Thus, in the carrier copper foil peeling apparatus according to the present embodiment, the peeling roller 31 can be moved up and down by the robot arm 32. Thereby, even when peeling the copper-clad laminate 10 with the carrier copper foil having different thickness dimensions, it is possible to peel the carrier copper foil 11 without applying excessive pressure to the copper-clad laminate 10 with the carrier copper foil. Thus, breakage of the peeling roller 31 and poor quality of the copper-clad laminate 12 can be prevented. The bracket 34 can also be operated, and the peeling roller 31 can be rotated 45 degrees or more around the bracket 34.

  Thereafter, with the roller 33 of the peeling roller 31 adhered to the corner of the carrier copper foil 11, the robot arm 32 is driven and the peeling roller 31 is slid in the rolling direction. That is, the roller 33 is rotated and the peeling roller 31 is moved in the diagonal direction of the copper-clad laminate 12. Then, the carrier copper foil 11 is peeled from the copper-clad laminate 12 while being wound around the roller 33 of the peeling roller 31 (see FIGS. 1 and 3). The carrier copper foil 11 is completely peeled when the peeling roller 31 slides to the edge of the carrier copper foil 11.

  Here, since the width of the roller 33 of the peeling roller 31 is longer than the length of the diagonal line of the copper-clad laminate 12, the carrier copper foil 11 and the bracket 34 supporting the peeling roller 31 come into contact with each other and the carrier copper foil. The winding of 11 is not hindered.

  The peeling roller 31 that has wound the carrier copper foil 11 stops its rotation, is moved to the upper part of the copper foil discarding section 40 by the robot arm 32, and is temporarily stopped.

  Here, the peeling roller 31 is lowered toward the entraining roller 41 by the robot arm 32. At the same time, the entraining roller 41 is rotated. If it does so, the edge part of the carrier copper foil 11 which hung down from the peeling roller 31 will be pinched | interposed into the winding roller 41, and will be pulled below with the rotational force. As a result, the carrier copper foil 11 is separated from the peeling roller 31. The separated carrier copper foil 11 is discharged to a dumping box 42 of a copper foil dumping unit 40 provided below the entraining roller 41.

  Thus, the peeling process of the carrier copper foil 11 is complete | finished. Then, after the next copper-clad laminate 10 with carrier copper foil is set on the suction stage 22 and the peeling roller 31 returns to the original position again, the next peeling step is started.

  In the above description of the embodiment, it has been described that the roller 33 whose entire contact surface with the carrier copper foil 11 is made of an adhesive material is provided on the outer peripheral surface of the peeling roller 31. It is not necessary for the entire surface to be an adhesive substance. Near the center of the roller 33, for example, only a surface that contacts a predetermined corner where the roller 33 starts to peel may be formed of an adhesive substance. In this way, since the bonding area between the carrier copper foil 11 and the peeling roller 31 is reduced, it is possible to prevent the carrier copper foil 11 from remaining on the peeling roller 31.

  In the above description, the length of the roller 33 in the axial direction is longer than the diagonal line of the copper-clad laminate 12, but the carrier copper foil peeling roller 31 is moved in a direction parallel to the diagonal line of the copper-clad laminate 12. In the case, it is not always necessary to make it longer than the diagonal line.

As shown in FIG. 4, the roller 33 is moved along the diagonal line of the rectangular copper-clad laminate 12. At this time, in order for the roller 33 to cover the entire copper-clad laminate 12, when the length of the short side of the copper-clad laminate 12 is A and the angle between the diagonal and the short side is α, the roller 33 The length L of
L> 2Acosα
If it is.

Here, the maximum value of cosα is 1, so
L> 2A
It becomes.

  That is, the length of the roller 33 in the axial direction may be at least twice the short side of the rectangular copper-clad laminate 12.

  When the copper-clad laminate 12 is close to a square, cos α≈1 / √2, so L> √2A. In this case, the length of the roller 33 in the axial direction may be √2A or more, substantially longer than the diagonal line. That is, when the copper-clad laminate 12 is close to a square, the length is equal to or longer than the diagonal, and when the length in the long side direction is sufficiently longer than the short side direction, the length is 2A or more.

  Thus, according to the carrier copper foil peeling apparatus and the carrier copper foil peeling method according to the present embodiment, the roller 33 that peels off while winding the carrier copper foil 11 has adhesiveness. The carrier copper foil 11 is peeled off without being left on the copper-clad laminate 12 and without being damaged on the copper-clad laminate 12 due to wrinkles of the carrier copper foil 11 by performing peeling while applying pressure on the plate 10 with a constant force. be able to.

  In this case, since the contact between the roller 33 and the carrier copper foil 11 starts from the corner at the start of peeling, the pressure from the roller 33 is concentrated and the adhesion between the roller 33 and the carrier copper foil 11 is ensured, and the carrier is more stable. The copper foil 11 can be peeled off.

  Further, by setting the width of the roller 33 to be longer than the diagonal length of the copper-clad laminate 12, the carrier copper foil 11 and the bracket 34 supporting the peeling roller 31 are brought into contact with each other when the carrier copper foil 11 is peeled off. There is no hindrance.

  Further, when the locus of reciprocation at the center of the roller 33 is set in the rolling direction parallel to the diagonal line of the copper-clad laminate 12, the width of the roller 33 is not necessarily longer than the length of the diagonal line, and the carrier copper foil It may be set longer than twice the length of the short side of 11. In this case, it is possible to reduce the size of the apparatus without increasing the width of the roller 33 more than necessary. This is because the copper-clad laminate 12 is not close to a square and the length in the long side direction is sufficiently longer than the short side direction (especially, the length of the long side is more than twice the length of the short side). It becomes effective.

(Modification)
The present invention is not limited to the above-described embodiments.

  In the embodiment, a belt conveyor and a suction stage are attached to the stage unit to improve production efficiency. However, for example, when separation is desired in a space-saving manner, the suction stage is fixed and installed within the operating range of the robot arm. The copper foil may be peeled off.

  Further, the moving direction of the roller does not necessarily need to coincide with one of the diagonal lines of the carrier copper foil, and may be a direction in which peeling starts from one corner of the carrier copper foil. Furthermore, it is sufficient if the length of the roller is longer than the diagonal length of the copper-clad laminate, but when the direction of movement of the roller is parallel to the diagonal, the length of the roller is shorter than that of the copper-clad laminate. It may be more than twice the side. Moreover, the material of each part is not limited to what was demonstrated in embodiment, and can be suitably changed according to a specification.

  In short, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the invention.

DESCRIPTION OF SYMBOLS 10 ... Copper-clad laminated board with carrier copper foil 11 ... Carrier copper foil 12 ... Copper-clad laminated board 20 ... Stage part 21 ... Belt conveyor 22 ... Adsorption stage 30 ... Peeling part 31 ... Peeling roller 32 ... Robot arm 33 ... Roller 34 ... Bracket 35 ... Rotating part 40 ... Copper foil dumping part 41 ... Roll-in roller 42 ... Dumping box

Claims (6)

In the carrier copper foil peeling device that peels off the carrier copper foil bonded to the rectangular copper-clad laminate while winding it with a roller that rotates around the axis,
The roller has a winding surface in contact with the carrier copper foil having adhesiveness, and the winding surface is brought into contact with a corner portion of the carrier copper foil to be bonded, and the carrier copper foil is peeled off from the corner portion. The carrier copper foil peeling device is provided so as to be capable of reciprocating in an oblique direction with respect to one side of the copper-clad laminate.   2. The carrier copper foil peeling apparatus according to claim 1, wherein the roller has a length dimension in the axial direction longer than a diagonal length of the copper-clad laminate.   2. The carrier copper foil according to claim 1, wherein the roller is provided so as to be able to reciprocate so that a locus of a central portion in the axial direction coincides with one of diagonal lines of the copper-clad laminate. Peeling device.   The length of the roller in the axial direction is longer than the length of the diagonal line of the copper-clad laminate, or more than twice the length of the short side of the copper-clad laminate. The carrier copper foil peeling apparatus according to claim 3. In the carrier copper foil peeling method in which the carrier copper foil bonded to the rectangular copper-clad laminate is peeled off while being wound by a roller that rotates around the axis,
Using a roller having adhesiveness on the winding surface, bringing the winding surface of the roller into contact with a corner of the carrier copper foil, rotating the roller, and laminating the carrier copper foil on the winding surface with the copper-clad laminate A carrier copper foil peeling method comprising winding and peeling from a plate.   The length in the axial direction of the roller is set to be longer than the diagonal length of the copper-clad laminate, or more than twice the length of the short side of the copper-clad laminate, The carrier copper foil peeling method according to claim 5, wherein the carrier copper foil is reciprocated so that a locus of a central portion in an axial direction coincides with one of diagonal lines of the copper-clad laminate.

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