JP2014105261A - Carrier copper foil peeling device and carrier copper foil peeling method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To peel, both continuously and stably, a carrier copper foil protecting a surface copper foil fitted to a copper-clad laminate sheet.SOLUTION: The provided carrier copper foil peeling device for peeling a carrier copper foil from a carrier copper foil-fitted copper-clad laminate sheet is furnished with: a conveying mechanism 11 for unidirectionally conveying a copper-clad laminate sheet 30 mounted thereon; a tacky film moving mechanism for moving a tacky film 21 along the conveying direction of the conveying mechanism 11; a pasting roller 23 for contacting the tacky film 21 with the surface of a copper-clad laminate sheet 30 atop the conveying mechanism 11 so as to paste the carrier copper foil 31 onto the tacky film 21; and a peeling roller 24 for peeling, from the copper-clad laminate sheet 30, the carrier copper foil 31 pasted onto the tacky film 21.

Description

  The present invention relates to a carrier copper foil peeling apparatus and a carrier copper foil peeling method for peeling a carrier copper foil bonded for surface protection on a copper-clad laminate used for a printed wiring board or the like.

  In general, copper-clad laminates used to manufacture printed wiring boards are made by press-molding and pasting a resin board in which a glass cloth or the like is impregnated with a thermosetting resin and a copper foil in a high-temperature vacuum atmosphere. Manufactured by.

  In recent years, with the increase in the density of printed wiring boards, the copper foil bonded to the copper-clad laminate has been made thinner, and in advanced products, the thickness is 5 μm or less. And in order to prevent the deterioration of workability | operativity by thin film formation and surface protection, it is common that carrier copper foil of about 20 micrometers is bonded to thin film copper foil.

  As a method for peeling such a carrier copper foil, a human method in which an operator manually peels off is generally used. Moreover, as a general film peeling method, for example, as shown in (Patent Document 1), a machine using a film peeling apparatus that holds a film end portion with an arm and winds a protective film while adjusting a peeling angle. Method.

JP 2011-104778 A

  However, in the above human peeling method, the carrier copper foil is held at one corner, so if there is a part where the adhesive strength between the carrier copper foil and the thin film copper foil is partially strong, Carrier copper foil remains and affects the next process.

  Further, in the case of a mechanical peeling method using a peeling device such as (Patent Document 1), since the carrier copper foil is not flexible, wrinkles are generated in the carrier copper foil at the time of peeling, and the wrinkles are laminated with copper. There was a problem that the plate was damaged when touched and the quality was deteriorated. Furthermore, in the peeling method described above, it is necessary for a person to carry the copper-clad laminate, and the copper-clad laminate cannot be carried continuously, and it has been difficult to shorten the tact time of the process.

  The problem to be solved by the present invention is a carrier copper capable of stably and continuously peeling the carrier copper foil from the copper-clad laminate on which the carrier copper foil is bonded without damaging the copper-clad laminate. The object is to provide a foil peeling apparatus and a carrier copper foil peeling method.

  In order to solve the above-mentioned problems, a carrier copper foil peeling apparatus according to the present invention includes a transport mechanism for placing a copper-clad laminate with a carrier copper foil and transporting it in one direction, and an adhesive film along the transport direction of the transport mechanism. An adhesive film moving mechanism for moving the adhesive film, an adhesive film in contact with the surface of the copper-clad laminate on the transport mechanism, a bonding roller for bonding the carrier copper foil to the adhesive film, and a carrier bonded to the adhesive film And a peeling roller for peeling the copper foil from the copper-clad laminate.

  Moreover, the carrier copper foil peeling apparatus concerning this invention is the conveyance which winds up the conveyance film unwound from the conveyance film delivery roll which unwinds the conveyance film in which the copper clad laminated board with carrier copper foil is mounted, and the conveyance film delivery roll Film take-up roll, pressure-sensitive adhesive film take-out roll for taking out the pressure-sensitive adhesive film attached to the surface of the copper-clad laminate, pressure-sensitive adhesive film take-up roll for taking up the pressure-sensitive adhesive film drawn out from the pressure-sensitive adhesive film pay-out roll, and a transport film pay-out roll And a laminating roller installed between the carrier film winding roll and pressing the adhesive film fed out from the adhesive film feeding roll against the surface of the copper-clad laminate on the conveying film to be bonded to the carrier copper foil, Conveying film feeding roll and conveying film winding Taken disposed downstream of the lamination roller with the rolls, the carrier copper foil stuck to the adhesive film, characterized by comprising a peeling roller for peeling a copper-clad laminate, a.

  Here, the transport film is a release film having releasability from the copper-clad laminate and the adhesive film.

  Next, it is a case where a conveyance film is made into the non-release film which has non-release property with respect to an adhesive film, and a bonding roller and a peeling roller are the adhesive film and a conveyance film from the height of a copper clad laminated board. Is made close to a short distance and the adhesive film is not brought into contact with the transport film.

  When peeling the front and back carrier copper foils from the copper-clad laminate, the carrier copper foil is pasted on both sides, the transport film is a film having adhesiveness, and the laminating roller is an adhesive film. Is attached to the carrier copper foil on the front side of the copper-clad laminate, and the transport film is attached to the carrier copper foil on the back side of the copper-clad laminate. The carrier copper foil on the back side bonded to the transport film is peeled from the copper-clad laminate.

  In addition, the carrier copper foil peeling method according to the present invention is a method in which an adhesive film is brought into contact with the surface of the copper-clad laminate mounted on a transport mechanism by a laminating roller, and the carrier copper is brought into contact with the adhesive film. A laminating step for laminating the foil, a peeling step for peeling the carrier copper foil affixed to the adhesive film from the copper-clad laminate by a peeling roller, and an adhesive with a carrier copper foil peeled from the copper-clad laminate And a carrier copper foil recovery step of winding the film with a winding roll.

  According to the carrier copper foil peeling apparatus and the carrier copper foil peeling method according to the present invention, the adhesive film is brought into contact with the copper-clad laminate while the copper-clad laminate with the carrier copper foil is conveyed in one direction by the conveyance mechanism. The film is bonded to the carrier copper foil, and the carrier copper foil bonded to the adhesive film is peeled off by the peeling roller, thereby damaging the copper-clad laminate from the copper-clad laminate bonded to the carrier copper foil. The carrier copper foil can be peeled stably and continuously without imparting the above.

It is a sectional side view which shows schematic structure of the carrier copper foil peeling apparatus concerning the 1st Embodiment of this invention. It is a sectional side view which shows schematic structure of the carrier copper foil peeling apparatus concerning the 2nd Embodiment of this invention. It is a sectional side view which shows schematic structure of the carrier copper foil peeling apparatus concerning the 3rd Embodiment of this invention.

  Hereinafter, embodiments of a carrier copper foil peeling apparatus and a carrier copper foil peeling method according to the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a side sectional view showing a schematic configuration of a carrier copper foil peeling apparatus according to the first embodiment of the present invention.

  In the figure, reference numeral 11 denotes a release film (transport film) for transporting the copper-clad laminate 30. The release film 11 is unwound from a release film feed roll 12a and wound by a release film take-up roll 12b. It has come to be taken. The copper-clad laminate 30 has carrier copper foils 31 and 32 bonded to the front and back sides, and is placed on the release film 11 with the back side facing down.

  Reference numeral 21 denotes an adhesive film for peeling the carrier copper foil. The adhesive film 21 is fed out from the adhesive film feed roll 22a, moves at the same speed as the release film 11, and is taken up by the adhesive film take-up roll 22b. It is like that.

  A pair of laminating rollers 23 are installed between the release film feeding roll 12a and the release film take-up roll 12b. This bonding roller 23 presses the adhesive film 21 fed out from the adhesive film feeding roll 22a against the surface of the copper-clad laminate 30 on the release film 11 and sticks it to the carrier copper foil.

  A pair of peeling rollers 24 is installed on the downstream side of the bonding roller 23 between the release film feeding roll 12a and the release film take-up roll 12b. The peeling roller 24 peels the carrier copper foil attached to the adhesive film 21 from the copper-clad laminate 30.

  The release film 11 is obtained by performing fluorine processing on the surface of the PET film, and the surface in contact with the copper-clad laminate 30 with the carrier copper foil has release properties. The releasability of the release film 11 needs to be easily peelable by the peeling roller 24 even if it contacts the adhesive film 21.

  The adhesive film 21 is coated with a substance having adhesiveness on the surface in contact with the carrier copper foil on the copper-clad laminate 30. This adhesive force needs to be stronger than the adhesive force between the carrier copper foil and the copper-clad laminate 30, and is formed, for example, by adhering an adhesive on the surface of a PET film.

  The laminating roller 23 and the peeling roller 24 are preferably made of flexible rubber in order to bond and peel the adhesive copper film 21 and the carrier copper foil on the copper-clad laminate 30 without scratching. The laminating roller 23 is configured to bring the adhesive film 21 and the release film 11 closer to a distance shorter than the height of the copper-clad laminate 30. Further, with respect to the peeling roller 24, in order to give a peeling angle, it is desirable that the roller radius is small, for example, less than 5 cm in diameter. Furthermore, it is desirable that the peeling angle in the peeling roller 24 is an angle of 90 degrees or more and 180 degrees or less in order to perform peeling reliably.

  Next, an example of a carrier copper foil peeling method using the carrier copper foil peeling apparatus configured as described above will be specifically described. In the present embodiment, the object to be peeled is described as a copper-clad laminate with a carrier copper foil used for a general printed wiring board. The copper-clad laminate 30 is obtained by press-molding a resin plate in which a glass cloth or the like is impregnated with a thermosetting resin and a copper foil in a high-heat vacuum atmosphere. And the carrier copper foils 31 and 32 for surface protection are bonded on the surface and the back surface of this copper-clad laminate 30.

  First, as shown in FIG. 1, the copper-clad laminate 30 with carrier copper foil is placed on the release film 11 fed from the release film feed roll 12a. Next, the release film take-up roll 22b is driven, and the copper-clad laminate 30 with carrier copper foil is conveyed in the right direction on the paper surface. In the middle of this conveyance, the copper-clad laminate 30 with carrier copper foil is sandwiched by the laminating roller 23, and the adhesive film 21 fed out from the adhesive film feed roll 22 a is pressed against the upper surface of the copper-clad laminate 30. Thereby, the adhesive film 21 is bonded to the carrier copper foil 31 on the copper-clad laminate 30 without any defects. Thereafter, the carrier copper foil 31 on the upper surface is peeled off at a predetermined angle by the peeling roller 24 by further transport of the copper-clad laminate 30. And the copper clad laminated board 30 is conveyed as it is, and the peeled carrier copper foil 31 is wound up by the adhesive film winding roll 22b.

  In the present embodiment, the peeling roller 24 can adjust the distance between the rollers. Thereby, even when peeling the copper-clad laminate 30 with the carrier copper foil having different thickness dimensions, it is possible to peel the carrier copper foil 31 without applying excessive pressure to the copper-clad laminate 30 with the carrier copper foil. Thus, breakage of the peeling roller 24 and poor quality of the copper-clad laminate 30 can be prevented.

  Further, since the carrier copper foil 31 is bonded to the adhesive film 21 by the bonding roller 23 without any wrinkles and is wound as it is on the adhesive film take-up roll 22b, a cut end or the like remains in the apparatus and prevents peeling. There are no defects.

  Thus, the peeling process of the carrier copper foil 31 is completed. Then, the next copper-clad laminate 30 with carrier copper foil is placed on the release film 11 and the next peeling step is started.

  As described above, according to the present embodiment, the adhesive film 21 is bonded to the copper-clad laminate 30 with the carrier copper foil by the bonding roller 23, and then is peeled off with the peeling roller 24 while applying pressure. By peeling the carrier copper foil 31 from the copper-clad laminate 30, the carrier copper foil 31 can be peeled stably and continuously without wrinkles or residue without damaging the copper-clad laminate 30. .

  Further, since the peeled carrier copper foil 31 is wound as a roll by the take-up roller 22b while being adhered to the adhesive film 21, a space for collecting the carrier copper foil 31 can be omitted. Furthermore, by carrying the copper-clad laminate 30 with the release film 11, adhesion between the release film 11 and the adhesive film 21 can be prevented and stable peeling can be performed.

(Second Embodiment)
FIG. 2 is a side sectional view showing a schematic configuration of a carrier copper foil peeling apparatus according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to FIG. 1 and an identical part, and the detailed description is abbreviate | omitted.

  The difference between the present embodiment and the first embodiment described above is that the transport film is changed to the non-release film 41.

  In 1st Embodiment demonstrated previously, although the release film 11 was used in order to prevent adhesion | attachment with the adhesion film 21 for conveyance of the copper clad laminated board 30 with carrier copper foil, the bonding roller 23 and peeling By changing the setting of the roller 24, a non-release film 41 such as a PET film can be used. That is, a non-release film 41 as a transport film is fed from a non-release film feed roll 42a and wound up by a non-release film take-up roll 42b.

  When the transport film is the release film 11, the adhesion between the copper-clad laminate 30 and the release film 11 is not so good, and when the adhesive film 21 is bonded to the copper-clad laminate 30, There is a possibility that the laminated plate 30 moves on the release film 11. On the other hand, when the non-release film 41 is used as the transport film as in this embodiment, the adhesion between the copper-clad laminate 30 and the non-release film 41 can be increased, and the adhesive film 21 is made of copper. It is possible to prevent the copper-clad laminate 30 from moving on the non-release film 41 when bonding to the laminate 30.

  In the present embodiment, when the non-release film 41 and the adhesive film 21 come into contact with each other, it becomes difficult to peel off these films 41 and 21, resulting in a malfunction of the apparatus. For this reason, it is necessary to adjust each roller gap | interval of the bonding roller 23 and the peeling roller 24 to the width | variety below 10 micrometers or more and the thickness of the copper clad laminated board 30 with a carrier copper foil. By performing the gap adjustment described above, the carrier copper foil 31 can be peeled without contact between the non-release film 41 and the adhesive film 21.

  Therefore, according to this embodiment, the carrier copper foil can be peeled off in the same manner as in the first embodiment using the non-release film 41 that is lower in cost than the release film 11 as the transport film. . For this reason, the same effects as those of the first embodiment can be obtained, and the copper-clad laminate 30 is not displaced at the time of bonding and peeling, and more reliable peeling can be performed. In addition, there is an advantage that the cost related to the process can be suppressed.

(Third embodiment)
FIG. 3 is a side sectional view showing a schematic configuration of a carrier copper foil peeling apparatus according to the third embodiment of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The present embodiment is different from the first embodiment in that an adhesive film 51 is used as a transport film, and a transport roller 55 is further provided on the downstream side of the peeling roller 24.

  That is, instead of the release film 11 and the rolls 12a and 12b, an adhesive film 51, an adhesive film feeding roll 52a, and an adhesive film take-up roll 52b are used. In the peeling roller 24, the adhesive film 51 and the adhesive film 21 are laminated with copper. It is made to peel from the board 30. FIG. Further, the copper-clad laminate 30 is conveyed by a conveyance roller 55 provided on the downstream side of the peeling roller 24.

  In this embodiment, first, the copper-clad laminate 30 with carrier copper foil is placed on the adhesive film 51 fed out from the adhesive film feed roll 52a. Next, the adhesive film take-up roll 52b is driven to convey the copper-clad laminate 30 with carrier copper foil. The copper-clad laminate 30 with the carrier copper foil is bonded to the adhesive films 21 and 51 fed from the adhesive film feeding rolls 22a and 52a by the laminating roller 23 without any defects. That is, the adhesive film 21 is bonded to the upper surface side of the copper-clad laminate 30, and the adhesive film 51 is bonded to the lower surface side of the copper-clad laminate 30. Thereafter, the carrier copper foils 31 and 32 on both sides are peeled off at a predetermined angle by the peeling roller 24.

  The copper-clad laminate 30 from which the carrier copper foils 31 and 32 have been peeled off is conveyed as it is by the conveying roller 55. The peeled carrier copper foil 31 is taken up by an adhesive film take-up roll 22b, and the peeled carrier copper foil 32 is taken up by an adhesive film take-up roll 52b. In this case, as in the second embodiment, the laminating roller 23 and the peeling roller 24 need to be adjusted to a width of 10 μm or more and a width equal to or less than the thickness of the copper-clad laminate 30 with a carrier copper foil.

  Thus, by changing the apparatus configuration, the carrier copper foils 31 and 32 can be continuously peeled from both the front and back surfaces of the copper-clad laminate 30 with the carrier copper foil in one step. Moreover, since the adhesive film 51 carries the copper-clad laminate 30 with the carrier copper foil before the peeling roller 24, the adhesiveness can prevent the positional deviation of the copper-clad laminate 30 with the carrier copper foil. Also, it can be expected to prevent a peeling failure due to positional deviation.

(Modification)
The present invention is not limited to the above-described embodiments.

  In the first and second embodiments, the transport mechanism for transporting the copper-clad laminate with carrier copper foil is not necessarily limited to a film, and can transport the copper-clad laminate with carrier copper foil in one direction. It is also possible to use a movable stage, a belt conveyor, or the like. Furthermore, the copper-clad laminate may be a suction stage that can be moved by suction with a vacuum chuck or an electrostatic chuck. In this case, the laminating roller and the peeling roller are not a pair of rollers, but a single roller that presses the adhesive film to the transport mechanism side.

  The pressure-sensitive adhesive film is not limited to the material described in the embodiment, and can be appropriately changed as long as the adhesive strength to the carrier copper foil is stronger than the adhesive strength between the carrier copper foil and the copper-clad laminate. Furthermore, the release film and the non-release film can be appropriately changed according to the specifications.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

11 ... Release film (conveyance mechanism)
12a ... Release film feeding roll 12b ... Release film winding roll 21 ... Adhesive film 22a ... Adhesive film feeding roll 22b ... Adhesive film winding roll 23 ... Pasting roller 24 ... Peeling roller 30 ... Copper-clad laminate 31, 32 ... carrier copper foil 41 ... non-release film (conveyance mechanism)
42a ... Non-release film feeding roll 42b ... Non-release film take-up roll 51 ... Adhesive film (conveyance mechanism)
52a ... Adhesive film feeding roll 52b ... Adhesive film take-up roll 55 ... Conveying roller

Claims (7)

A carrier copper foil peeling apparatus for peeling a carrier copper foil from a copper clad laminate with a carrier copper foil,
A transport mechanism for placing the copper-clad laminate and transporting it in one direction;
An adhesive film moving mechanism for moving the adhesive film along the conveying direction of the conveying mechanism;
A bonding roller for bringing the adhesive film into contact with the surface of the copper-clad laminate on the transport mechanism, and bonding the carrier copper foil to the adhesive film;
A peeling roller for peeling the carrier copper foil bonded to the adhesive film from the copper-clad laminate;
A carrier copper foil peeling apparatus comprising:   The carrier copper foil peeling apparatus according to claim 1, wherein the transport mechanism is a suction stage that can move by sucking the copper-clad laminate. A transport film feeding roll for feeding a transport film on which a copper-clad laminate with a carrier copper foil is placed;
A transport film take-up roll that winds up the transport film fed from the transport film feed roll;
An adhesive film feeding roll for feeding out an adhesive film to be attached to the surface of the copper-clad laminate;
An adhesive film take-up roll that winds up the adhesive film fed from the adhesive film feed roll;
The carrier is installed between the transport film feed roll and the transport film take-up roll and presses the adhesive film fed from the adhesive film feed roll against the surface of the copper-clad laminate on the transport film. A bonding roller to be bonded to the copper foil;
Peeling off the carrier copper foil bonded to the adhesive film from the copper-clad laminate between the transport film feed roll and the transport film take-up roll. Laura,
A carrier copper foil peeling apparatus comprising:   The carrier copper foil peeling apparatus according to claim 3, wherein the transport film is a release film having releasability from the copper-clad laminate and the adhesive film.   The transport film is a non-release film having a non-release property with respect to the adhesive film, and the laminating roller and the peeling roller are configured so that the pressure-sensitive adhesive film and the transport film are high in the copper-clad laminate. The carrier copper foil peeling apparatus according to claim 3, wherein the carrier copper foil peeling apparatus is configured so as to approach a shorter distance than the thickness and not to bring the adhesive film into contact with the transport film. The copper-clad laminate is obtained by pasting the carrier copper foil on both sides,
The transport film is an adhesive film,
The laminating roller affixes the adhesive film to a carrier copper foil on the front side of the copper-clad laminate, and affixes the transport film to a carrier copper foil on the back side of the copper-clad laminate,
The peeling roller peels the carrier copper foil on the front side from the copper-clad laminate and peels the carrier copper foil on the back side bonded to the transport film from the copper-clad laminate. The carrier copper foil peeling apparatus according to claim 3. A carrier copper foil peeling method for peeling a carrier copper foil from a copper clad laminate with a carrier copper foil,
A bonding step in which an adhesive film is brought into contact with the surface of the copper-clad laminate that is placed and moved on a transport mechanism by a bonding roller, and the carrier copper foil is bonded to the adhesive film;
A peeling step of peeling the carrier copper foil attached to the adhesive film from the copper-clad laminate by a peeling roller;
Carrier copper foil recovery step of winding the adhesive film with carrier copper foil peeled off from the copper-clad laminate with a winding roll;
The carrier copper foil peeling method characterized by including.

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