JP2008157639A - Method for manufacturing magnetic sensor, and magnetic sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a magnetic sensor and the magnetic sensor, capable of enhancing productivity. <P>SOLUTION: The method includes a bonding step of arranging a pair of bias magnets 20a-20c and magnetic detecting elements 30a-30c on respective mounting parts e1-e3 via an adhesive 50, in a lead frame 10 having the plurality of mounting parts e1-e3 for mounting the pair of bias magnets 20a-20c and magnetic detecting elements 30a-30c, and for bonding the bias magnets 20a-20c and the magnetic detecting elements 30a-30c to the lead frame 10, a dividing step of dividing the lead frame 10 in every of the mounting parts e1-e3 mounted with the pair of bias magnets 20a-20c and magnetic detecting elements 30a-30c, and a temporarily fixing step of fixing temporarily the bias magnets 20a-20c to the lead frame 10 by a temporarily fixing member 40, in the bonding step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a magnetic sensor and a magnetic sensor.

  Conventionally, as an example of a magnetic sensor, there has been one disclosed in Patent Document 1.

In the magnetic sensor shown in Patent Document 1, a sensor chip including a magnetoresistive element pair and a bias magnet for applying a bias magnetic field to the magnetoresistive element pair are integrally molded with a resin while being mounted on a support member. Then, when the magnetized rotor rotates in the vicinity of the sensor chip, a change in the magnetic vector generated in cooperation with the bias magnetic field is detected as a change in the resistance value of the magnetoresistive element pair to detect the rotation mode of the magnetized rotor. To do.
JP 2006-3225 A

  Usually, when manufacturing a magnetic sensor as shown in Patent Document 1, a pair of sensor chips and bias magnets are mounted on each mounting portion with respect to a support member having a plurality of mounting portions on which a pair of sensor chips and bias magnets are mounted. Is mounted via an adhesive, and a splitting step for splitting each mounting portion after the adhesive is cured.

  However, in the case of such a manufacturing method of the magnetic sensor, there is a possibility that the bias magnets are displaced due to magnetic interference before the adhesive is cured.

  In order to suppress the deviation of the bias magnets, it is also conceivable to increase the interval between the bias magnets to reduce the magnetic interference between the bias magnets. However, when the gap between the bias magnets is increased, there is a problem that unnecessary portions of the support member increase.

  The present invention has been made in view of the above problems, and an object thereof is to provide a magnetic sensor manufacturing method and a magnetic sensor that can improve productivity.

  In order to achieve the above object, a method of manufacturing a magnetic sensor according to claim 1 is a method of manufacturing a magnetic sensor having a bias magnet and a sensor chip that are bonded and fixed to a support member, and includes a pair of bias magnet and sensor chip. A pair of bias magnets and a sensor chip are arranged on each mounting part via an adhesive to support a member having a plurality of mounting parts for mounting the supporting member, and the supporting member, the bias magnet and the sensor chip are bonded. A step, a dividing step of dividing the support member for each mounting portion on which the pair of bias magnets and the sensor chip are mounted, and a temporary fixing step of temporarily fixing the bias magnet and the supporting member with the temporary fixing member in the bonding step; It is characterized by providing.

  In this manner, by temporarily fixing the bias magnet and the support member with the temporary fixing member in the bonding step, it is possible to suppress the bias magnet from being displaced due to magnetic interference between adjacent bias magnets. Therefore, since the space | interval of each mounting part can be made small, the unnecessary part of a support member can be decreased and productivity can be improved.

  According to a second aspect of the present invention, the temporary fixing member may be made of a magnetic material and disposed at least at a position facing the bias magnet with the support member interposed therebetween.

  By doing so, the bias magnet and the temporary fixing member made of a magnetic material can be attracted to temporarily fix the bias magnet.

  According to a third aspect of the present invention, the bias magnet and the sensor chip are arranged on the mounting portion so that one side faces each other, and the temporary fixing member is made of a magnetic material. You may make it arrange | position on the same side as the side by which the bias magnet in a support member is arrange | positioned in the position which will arrange | position the side surface on the opposite side to the side which opposes a sensor chip.

  Also in this way, the bias magnet and the temporary fixing member made of a magnetic material can be attracted to temporarily fix the bias magnet. In addition, the bias magnet can be easily temporarily fixed by disposing the support member on the same side as the side where the bias magnet is disposed.

  According to a fourth aspect of the present invention, the temporary fixing member is made of a magnetic material, has a width corresponding to the interval between the bias magnets disposed in the plurality of mounting portions, and is located at a position where the bias magnet is to be disposed. You may make it arrange | position between.

  By doing so, the bias magnet and the temporary fixing member made of a magnetic material can be attracted to temporarily fix the bias magnet, and the deviation of the bias magnet can be further suppressed.

  According to a fifth aspect of the present invention, the temporary fixing member is made of a magnetic material and includes a hole corresponding to the shape of the bias magnet, and the bias magnet is attached to each mounting portion in a state of being disposed in the hole. It may be arranged via.

  By doing in this way, while being able to temporarily fix a bias magnet, the shift | offset | difference of a bias magnet can be suppressed further.

  According to a sixth aspect of the present invention, the adhesive is a thermosetting adhesive, the bonding step includes a heating step of heating the adhesive, and the temporary fixing member includes a hole corresponding to the shape of the bias magnet. The bias magnet disposed in the mounting portion may be pressure-bonded to the support member in a state of being disposed in the hole portion by the temporary fixing member before the heating step.

  Thus, in the case of a thermosetting adhesive, the viscosity is high at room temperature, and the viscosity is lowered by heating. Therefore, since the bias magnet can withstand magnetic interference with the adjacent bias magnet when it is disposed on the support member via the adhesive, it is difficult to shift. However, as the adhesive is heated, the viscosity of the adhesive decreases, and the bias magnet may lose its magnetic interference with the adjacent bias magnet. Therefore, by making it as shown in the sixth aspect, the bias magnet can be temporarily fixed, and the deviation of the bias magnet can be further suppressed.

  In order to achieve the above object, a method of manufacturing a magnetic sensor according to claim 7 is a magnetic sensor having a bias magnet and a sensor chip that are bonded and fixed to a support member, and the support member includes a pair of bias magnet and sensor. There are a plurality of mounting portions for mounting the chip, and at least one of the mounting portion and the bias magnet has a holding portion that holds the positional relationship between the mounting portion and the bias magnet, and a pair of bias magnets is mounted on each mounting portion. And the sensor chip are arranged via an adhesive to bond the support member, the bias magnet, and the sensor chip, and the support member is divided for each mounting portion on which the pair of bias magnets and the sensor chip are mounted. And a dividing step.

  Thus, at least one of the mounting portion and the bias magnet has the holding portion that holds the positional relationship between the mounting portion and the bias magnet, so that the bias magnet is displaced due to magnetic interference between adjacent bias magnets. Can be suppressed. Therefore, since the space | interval of each mounting part can be made small, the unnecessary part of a support member can be decreased and productivity can be improved.

  Further, as shown in claim 8, the holding portion may be a hole provided in the mounting portion and a protrusion corresponding to the hole provided in the bias magnet, or as shown in claim 9, the bias magnet It is good also as a protrusion corresponding to the hole provided in the mounting part and the hole provided in the mounting part.

  In order to achieve the above object, a magnetic sensor according to claim 10 is a magnetic sensor having a bias magnet and a sensor chip bonded and fixed to a support member, wherein at least one of the support member and the bias magnet is a mounting portion. And a biasing magnet. The holding unit holds the positional relationship between the bias magnet and the bias magnet.

  In this way, even when a plurality of pairs of bias magnets and sensor chips are bonded to the support member and the support members are divided for each pair of bias magnets and sensor chips, the magnetism between adjacent bias magnets can be reduced. It is possible to suppress the bias magnet from shifting due to mechanical interference. Therefore, since the space | interval of each mounting part can be made small, the unnecessary part of a support member can be decreased and productivity can be improved.

  Further, as shown in claim 11, the holding portion may be a hole provided in the support member and a protrusion corresponding to the hole provided in the bias magnet, or as shown in claim 12, the holding portion. May be a hole provided in the bias magnet and a protrusion corresponding to the hole provided in the support member.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the first embodiment will be described. FIG. 1 is a plan view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the first embodiment of the present invention. 2 is a cross-sectional view taken along the line II-II in FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. FIGS. 5A to 5C are process plan views showing the method of manufacturing the magnetic sensor according to the first embodiment of the present invention.

  In the magnetic sensor manufacturing method according to the present embodiment, a bias magnetic field is applied to a magnetic detection element by a bias magnet, and the operation of the detection target is performed by a change in magnetic vector that occurs in cooperation with the bias magnetic field when the detection target operates. Is a manufacturing method of a magnetic sensor (for example, a magnetic sensor that detects the rotation of a disk-shaped magnetized rotor that rotates with the axle of a vehicle).

  1, FIG. 3, FIG. 4 and the like, reference numeral 10 corresponds to a support member in the claims of the present invention, and a plurality of mounting portions indicated by broken lines (in this embodiment, three of e1 to e3). ). The mounting portions e1 to e3 are regions that are divided after the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed by the adhesive 50. In other words, the mounting portions e1 to e3 are areas necessary as support members for supporting the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c.

  In addition, a pair of bias magnets 20a to 20c and magnetic detection elements 30a to 30c are mounted on each mounting portion e1 to e3 to form a single piece (for example, the bias magnet 20a and the magnetic detection element 30a are mounted on the mounting portion e1). 1), a sensor part of a magnetic sensor through processes such as wire bonding and resin molding.

  In FIG. 1 or FIG. 2 and the like, reference numerals 20a to 20c are bias magnets magnetized to the N pole and the S pole, and apply a bias magnetic field to each of the magnetic detection elements 30a to 30c. Further, as shown in FIGS. 1 and 2, the bias magnets 20 a to 20 c are made of a rectangular parallelepiped, for example, and are mounted on the mounting portions e1 to e3 of the lead frame 10 via the adhesive 50.

  The magnetic detection elements 30a to 30c are sensor chips including a substrate on which a magnetoresistive element for detecting magnetism is patterned. Further, as shown in FIGS. 1, 3, and 4, the magnetic detection elements 30 a to 30 c are arranged on the same surface as the surface on which the bias magnets 20 a to 20 c are mounted in the mounting portions e1 to e3 of the lead frame 10. The bias magnets 20a to 20c are bonded (fixed) via an adhesive 50 at a position spaced apart from the bias magnets 20a to 20c so that one side faces each other. That is, a pair of bias magnets 20a to 20c and magnetic detection elements 30a to 30c are mounted on the mounting portions e1 to e3 via the adhesive 50. The adhesive 50 is not particularly limited, but in the present embodiment, a case where a thermosetting adhesive is used will be described as an example.

  1 to 4, reference numeral 40 corresponds to a temporary fixing member in claims of the present invention, is a flat plate-like magnetic body, and temporarily fixes the lead frame 10 and the bias magnets 20a to 20c. It is. The temporary fixing member 40 is detachably attached to the lead frame 10.

  Here, based on FIG. 5, the manufacturing method of the magnetic sensor in this Embodiment is demonstrated.

  First, as shown in FIG. 5A, the temporary fixing member 40 is attached to the lead frame 10. In this case, the lead frame 10 may simply be placed on the upper side of the temporary fixing member 40.

  Next, as shown in FIG. 5B, a bias magnet is attached to the mounting portions e1 to e3 of the lead frame 10 to which the temporary fixing member 40 is attached via an adhesive 50 (not shown in FIG. 5B). 20a-20c and magnetic detection elements 30a-30c are arranged. Then, the adhesive 50 is heated in a state where the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are arranged on the mounting portions e1 to e3 via the adhesive 50 (not shown in FIG. 5B). The mounting portions e1 to e3, the bias magnets 20a to 20c, and the magnetic detection elements 30a to 30c are bonded (temporary fixing process, bonding process).

  Here, a case where the temporary fixing member 40 is not used will be considered. In a state where the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are arranged on the mounting portions e1 to e3, magnetic interference (attraction force) between the adjacent bias magnets 20a to 20c (for example, the bias magnet 20a and the bias magnet 20b). Or repulsive force). At this time, the adhesive 50 is a thermosetting type and has a certain degree of viscosity until it is heated. Accordingly, since the adhesive 50 has a certain degree of viscosity, even if magnetic interference occurs between the adjacent bias magnets 20a to 20c, the adhesive 50 can withstand the magnetic interference and is not easily displaced (bias magnets 20a to 20b). 20c is difficult to be displaced).

  However, the adhesive 50 is cured after the viscosity is lowered when heated for curing. Therefore, in a state where the viscosity of the adhesive 50 is lowered, there is a possibility that it is shifted due to magnetic interference between the adjacent bias magnets 20a to 20c. In other words, the bias magnets 20a to 20c may be displaced in the plane direction due to magnetic interference between the adjacent bias magnets 20a to 20c.

  Further, in order to suppress magnetic interference between the adjacent bias magnets 20a to 20c, it is conceivable to increase the interval between the bias magnets 20a to 20c. However, in order to increase the interval between the bias magnets 20a to 20c, it is necessary to increase the interval between the mounting portions e1 to e3, and there is a problem that unnecessary portions of the lead frame 10 increase.

  Therefore, in the present embodiment, before the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are disposed on the mounting portions e1 to e3 via the adhesive 50 in the bonding step, the lead frame 10 is temporarily fixed. A member 40 is attached.

  By doing so, when the bias magnets 20a to 20c are arranged on the mounting portions e1 to e3 via the adhesive 50, the temporary fixing member 40 and the bias magnets 20a to 20c are attracted, and the bias magnets 20a to 20c are attracted. It can be temporarily fixed (temporary fixing process). That is, by providing a temporary fixing member 40 made of a magnetic material and applying a force in a direction in which the bias magnets 20a to 20c are pressure-bonded to the lead frame 10, the bias magnets 20a to 20c are moved in a plane direction by magnetic interference. Temporarily fix to prevent slippage.

  When the adhesive 50 is cured and the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed to the mounting portions e1 to e3, the lead frames 10 are mounted as shown in FIG. Divided into parts e1 to e3 into individual pieces (separation step).

  As described above, by temporarily fixing the bias magnets 20a to 20c and the lead frame 10 with the temporary fixing member 40 in the bonding step, the bias magnets 20a to 20c are caused by magnetic interference between the adjacent bias magnets 20a to 20c. Can be prevented from shifting. Therefore, since the space | interval of each mounting part e1-e3 can be made small, the unnecessary part of the lead frame 10 can be decreased and productivity can be improved.

  In the present embodiment, the example in which the temporary fixing member 40 is attached to the lead frame 10 before the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are arranged on the mounting portions e1 to e3 has been described. However, the present invention is not limited to this. The object of the present invention can be achieved by attaching the temporary fixing member 40 to the lead frame 10 and temporarily fixing the bias magnets 20a to 20c before heating the adhesive 50, that is, before the viscosity of the adhesive 50 decreases. Is.

  Further, in the present embodiment, the temporary fixing member 40 has a plane area larger than the plane area of the lead frame 10 and is disposed so as to cover the entire plane (back surface) of the lead frame 10. However, the present invention is not limited to this, and the object of the present invention can be achieved by disposing at least the positions corresponding to the bias magnets 20a to 20c.

  In the present embodiment, the example in which the temporary fixing member 40 is attached to the lead frame 10 has been described. However, the present invention is not limited to this, and the temporary fixing member 40 includes the bias magnets 20a to 20c. The object of the present invention can be achieved if the lead frame 10 is disposed so as to face the lead frame 10 so that the lead frame 10 can be pulled and temporarily fixed. For example, the temporary fixing member 40 and the lead frame 10 may be separated from each other.

  Further, in the present embodiment, the description has been made using the lead frame provided so that the mounting portions are arranged in one direction, but the present invention is not limited to this, and the mounting portions are arranged in two directions. In other words, a lead frame provided so that the mounting portions are two-dimensionally arranged may be used.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 6 is a plan view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the second embodiment of the present invention. 7 is a sectional view taken along line VII-VII in FIG.

  Since the manufacturing method of the magnetic sensor according to the second embodiment is often in common with that according to the first embodiment described above, detailed description of the common parts will be omitted, and different parts will be described mainly. To do. The second embodiment differs from the first embodiment described above in the shape and location of the temporary fixing member.

  The temporary fixing member 41 in the present embodiment is made of a magnetic material, has a length that allows contact with the plurality of bias magnets 20 a to 20 c, and has a size that can be mounted on the lead frame 10. That is, the temporary fixing member 41 is used in common for the plurality of bias magnets 20 a to 20 c, and temporarily fixes the plurality of bias magnets 20 a to 20 c with one temporary fixing member 41.

  When a magnetic sensor is manufactured using the temporary fixing member 41, first, the temporary fixing member 41 is attached to a predetermined position of the lead frame 10. The predetermined position is a side where the bias magnets 20a to 20c are arranged, and is a position where a side surface of the bias magnets 20a to 20c opposite to the side facing the magnetic detection elements 30a to 30c is to be arranged. In this case, the temporary fixing member 41 may simply be placed at a predetermined position above the lead frame 10.

  Next, the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are arranged on the mounting portions e1 to e3 of the lead frame 10 to which the temporary fixing member 41 is attached via an adhesive 50 (not shown in FIG. 6). To do. And it hardens | cures by heating the adhesive agent 50 in the state which has arrange | positioned the bias magnets 20a-20c and the magnetic detection elements 30a-30c via the adhesive agent 50 to the mounting parts e1-e3, and mounting parts e1-e3 and The bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are bonded (temporary fixing process, bonding process).

  Thus, when the bias magnets 20a to 20c are arranged on the mounting portions e1 to e3 via the adhesive 50, the temporary fixing member 41 and the bias magnets 20a to 20c are attracted to temporarily fix the bias magnets 20a to 20c. (Temporary fixing process). That is, since the temporary fixing member 41 is disposed at a position where the side surface of the bias magnets 20a to 20c opposite to the side facing the magnetic detection elements 30a to 30c is to be disposed, the bias magnets 20a to 20c are appropriately positioned. Will be temporarily fixed.

  Then, when the adhesive 50 is cured and the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed to the mounting portions e1 to e3, the lead frame 10 is divided into the mounting portions e1 to e3. (Separation step).

  Even if the temporary fixing member 41 is attached to the lead frame 10 and the bias magnets 20a to 20c are temporarily fixed before the adhesive 50 is heated, that is, before the viscosity of the adhesive 50 decreases, the object of the present invention. Can be achieved.

  Also in this way, the bias magnets 20a to 20c and the temporary fixing member 41 made of a magnetic material can be attracted to temporarily fix the bias magnets 20a to 20c. Further, the bias magnets 20a to 20c can be easily temporarily secured by being arranged on the same side as the side on which the bias magnets 20a to 20c are arranged in the lead frame 10.

  In the present embodiment, an example in which the temporary fixing member 41 common to the bias magnets 20a to 20c is used has been described. However, the present invention is not limited to this, and the bias magnets 20a to 20c are not limited to this. Even if one temporary fixing member is arranged, the object of the present invention can be achieved.

(Third embodiment)
Next, a third embodiment of the present invention will be described. FIG. 8 is a plan view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the third embodiment of the present invention. 9 is a cross-sectional view taken along the line IX-IX in FIG.

  The manufacturing method of the magnetic sensor according to the third embodiment is often in common with that according to the first embodiment described above. Therefore, detailed description of the common parts will be omitted, and different parts will be mainly described below. To do. The third embodiment differs from the first embodiment described above in the shape and location of the temporary fixing member.

  The temporary fixing member 42 in the present embodiment is made of a magnetic material and has a width corresponding to the interval between the bias magnets 20a to 20c arranged on the plurality of mounting portions e1 to e3. In other words, the temporary fixing member 42 is commonly used for two bias magnets (for example, 20a and 20b), and the two temporary biasing magnets (for example, 20a and 20b) are temporarily fixed by the single temporary fixing member 42. Is.

  When a magnetic sensor is manufactured using the temporary fixing member 42, first, the temporary fixing member 42 is attached to a predetermined position of the lead frame 10. This predetermined position is between the positions where the bias magnets 20a to 20c are to be arranged. In this case, the temporary fixing member 42 may simply be placed at a predetermined position of the lead frame 10.

  Next, the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are arranged on the mounting portions e1 to e3 of the lead frame 10 to which the temporary fixing member 42 is attached via an adhesive 50 (not shown in FIG. 8). To do. And it hardens | cures by heating the adhesive agent 50 in the state which has arrange | positioned the bias magnets 20a-20c and the magnetic detection elements 30a-30c via the adhesive agent 50 to the mounting parts e1-e3, and mounting parts e1-e3 and The bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are bonded (temporary fixing process, bonding process).

  Thus, when the bias magnets 20a to 20c are arranged on the mounting portions e1 to e3 via the adhesive 50, the temporary fixing member 42 and the bias magnets 20a to 20c are attracted to temporarily fix the bias magnets 20a to 20c. (Temporary fixing process). That is, since the temporary fixing member 42 is disposed between positions where the bias magnets 20a to 20c are to be disposed, the bias magnets 20a to 20c are appropriately positioned and temporarily fixed.

  Then, when the adhesive 50 is cured and the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed to the mounting portions e1 to e3, the lead frame 10 is divided into the mounting portions e1 to e3. (Separation step).

  Even if the adhesive 50 is heated, that is, before the viscosity of the adhesive 50 decreases, the temporary fixing member 42 is attached to the lead frame 10 and the bias magnets 20a to 20c are temporarily fixed. Can be achieved.

  By doing so, the bias magnets 20a to 20c and the temporary fixing member 42 made of a magnetic material can attract each other to temporarily fix the bias magnets 20a to 20c, and further suppress the deviation of the bias magnet. .

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. FIG. 10 is a plan view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the fourth embodiment of the present invention. 11 is a cross-sectional view taken along the line XI-XI in FIG.

  Since the manufacturing method of the magnetic sensor according to the fourth embodiment is often in common with that according to the first embodiment described above, the detailed description of the common parts will be omitted below, and different parts will be mainly described. To do. The fourth embodiment differs from the first embodiment described above in the shape and position of the temporary fixing member.

  The temporary fixing member 43 in the present embodiment includes a hole 43a corresponding to the shape of each bias magnet 20a to 20c. The hole 43a is also provided corresponding to the number of bias magnets 20a to 20c. Further, the hole 43a is provided corresponding to the interval between the bias magnets 20a to 20c when the bias magnets 20a to 20c are arranged on the lead frame 10.

  When a magnetic sensor is manufactured using the temporary fixing member 43, first, as shown in FIG. 11A, the bias magnets 20a to 20c and the magnetic detection element are mounted on the mounting portions e1 to e3 via the adhesive 50. 30a-30c are arranged. And as shown in FIG.11 (b), the bias magnet is arrange | positioned by arrange | positioning the temporary fixing member 43 on the bias magnets 20a-20c (the side opposite to the side facing the lead frame 10 of the bias magnets 20a-20c). Temporarily fix 20a to 20c. At this time, the bias magnets 20 a to 20 c are arranged in the hole portions 43 a of the temporary fixing member 43. Then, the bias magnets 20 a to 20 c are pressure-bonded to the lead frame 10 by the temporary fixing member 43. Further, the adhesive 50 is cured by heating in a state where the bias magnets 20a to 20c are pressure-bonded to the lead frame 10 by the temporary fixing member 43, and the mounting portions e1 to e3, the bias magnets 20a to 20c, and the magnetic detection elements 30a to 30c. 30c is bonded (temporary fixing process, bonding process). In other words, in the present embodiment, at least before the adhesive 50 is heated and until the adhesive 50 is cured, the bias magnets 20a to 20c are temporarily fixed by the temporary fixing member 43.

  Then, when the adhesive 50 is cured and the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed to the mounting portions e1 to e3, the lead frame 10 is divided into the mounting portions e1 to e3. (Separation step).

  Thus, in the case of the thermosetting adhesive 50, the viscosity is high at room temperature, and the viscosity is lowered by heating. Therefore, when the bias magnets 20a to 20c are arranged on the lead frame 10 via the adhesive 50, they can withstand magnetic interference with the adjacent bias magnets 20a to 20c, so that they are not easily displaced. Therefore, the bias magnets 20a to 20c can be easily temporarily fixed only by pressure-bonding the bias magnets 20a to 20c to the lead frame 10 by the temporary fixing member 43 having the hole 43a also in the present embodiment. it can. Moreover, since the temporary fixing member 43 in this Embodiment is provided with the hole part 43a corresponding to the shape of each bias magnet 20a-20c, and is provided corresponding to the space | interval between bias magnets 20a-20c, bias magnet 20a ~. The shift due to the magnetic interference of 20c can be further suppressed.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described. FIG. 12 is a sectional view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the fifth embodiment of the invention.

  Since the manufacturing method of the magnetic sensor according to the fifth embodiment is often in common with that according to the above-described fourth embodiment, detailed description of the common parts will be omitted, and different parts will be described mainly. To do. The fifth embodiment is different from the above-described fourth embodiment in that the temporary fixing member is a magnetic body.

  The temporary fixing member 44 in the present embodiment is made of a magnetic material and includes holes 44a corresponding to the shapes of the respective bias magnets 20a to 20c as in the above-described embodiment. The holes 44a are also provided corresponding to the number of bias magnets 20a to 20c. Further, the hole 44 a is provided corresponding to the interval between the bias magnets 20 a to 20 c when the bias magnets 20 a to 20 c are arranged on the lead frame 10.

  And when manufacturing a magnetic sensor using this temporary fixing member 44, first, each bias magnet 20a-20c is arrange | positioned to each hole 44a of the temporary fixing member 44, as shown to Fig.12 (a). Since the temporary fixing member 44 is made of a magnetic material, the bias magnets 20a to 20c are arranged (adsorbed) in the temporary fixing member 44 and the attracting hole 44a. Then, as shown in FIG. 12B, the temporary fixing member 44 in which the bias magnets 20a to 20c are arranged in the hole 44a is arranged on the lead frame 10 in which the adhesive 50 is arranged. As a result, the bias magnets 20 a to 20 c are arranged on the lead frame 10 via the adhesive 50.

  Next, the adhesive 50 is cured by heating in a state where the bias magnets 20a to 20c are pressure-bonded to the lead frame 10 with the temporary fixing member 44, and the mounting portions e1 to e3, the bias magnets 20a to 20c, and the magnetic detection element 30a are cured. ~ 30c are bonded (temporary fixing process, bonding process).

  Then, when the adhesive 50 is cured and the bias magnets 20a to 20c and the magnetic detection elements 30a to 30c are fixed to the mounting portions e1 to e3, the lead frame 10 is divided into the mounting portions e1 to e3. (Separation step).

  In this way, after the bias magnets 20a to 20c are attracted to the hole 44a of the temporary fixing member 44 in advance, the bias magnets 20a to 20c adsorbed to the temporary fixing member 44 are simply pressed against the lead frame 10. It is possible to easily temporarily fix the bias magnets 20a to 20c by simply crimping them to the lead frame 10. Moreover, since the temporary fixing member 44 in this Embodiment is provided with the hole part 44a corresponding to the shape of each bias magnet 20a-20c, and is provided corresponding to the space | interval between bias magnets 20a-20c, it is bias magnet 20a ~. The shift due to the magnetic interference of 20c can be further suppressed.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described. FIG. 13: is an enlarged plan view which shows schematic structure in the manufacturing process of the magnetic sensor in the 6th Embodiment of this invention. 14 is a cross-sectional view taken along the line XIV-XIV in FIG. Note that the lead frame 11 has a plurality of mounting portions, and a plurality of bias magnets are arranged on the mounting portions, but only one of them is shown in FIGS. 13 and 14. Yes.

  Since the magnetic sensor and the manufacturing method of the magnetic sensor in the sixth embodiment are often the same as those in the first embodiment described above, the detailed description of the common parts will be omitted below, and different parts will be emphasized. I will explain it. The sixth embodiment is different from the first embodiment described above in that a holding portion is provided in the bias magnet and the lead frame.

  The lead frame 11 in the present embodiment has a frame-side protrusion 111 (corresponding to the holding portion in the claims of the present invention) that holds the positional relationship with the bias magnet 21a. The frame-side protrusion 111 has, for example, a cylindrical shape, a rectangular parallelepiped shape, a cubic shape, or the like. The frame-side protrusion 111 is provided in a region facing the bias magnet 21a in the mounting portion on which the bias magnet 21a and the magnetic detection element are mounted. The frame-side protrusions 111 are preferably provided at positions facing each other in the vicinity of the periphery in the region facing the bias magnet 21a.

  Further, the bias magnet 21a in the present embodiment has a magnet side hole 21a1 (corresponding to the holding portion in the claims of the present invention) having a shape corresponding to the shape of the frame side protrusion 111. The magnet side hole 21a1 may be a through hole.

  When a magnetic sensor is manufactured using the above-described lead frame 11 and bias magnet 21a, first, as shown in FIGS. 14A and 14B, the lead frame 11 is placed in the magnet side hole 21a1 of the bias magnet 21a. The bias magnet 21a is disposed on the lead frame 11 (mounting portion) via an adhesive (not shown) so that the frame side protrusion 111 is inserted. Then, the adhesive is cured by heating in this state, and the bias magnet 21a is bonded to the lead frame 11 (mounting portion) (bonding step). The magnetic detection element is bonded to the lead frame 11 via an adhesive as in the above-described embodiment.

  Then, when the adhesive is cured and the bias magnet 21a and the magnetic detection element are fixed to the lead frame 11 (mounting portion), the lead frame 11 is divided into each mounting portion into individual pieces (separation step).

  As described above, the lead frame 11 (mounting portion) and the bias magnet 21a are composed of the frame side protrusion 111 and the magnet side hole portion 21a1 (holding portion) that hold the positional relationship between the lead frame 11 (mounting portion) and the bias magnet 21a. The bias magnets can be prevented from shifting due to magnetic interference between adjacent bias magnets. Therefore, since the interval between the mounting portions can be reduced, unnecessary portions of the lead frame 11 can be reduced and productivity can be improved.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described. FIG. 15 is an enlarged plan view showing a schematic configuration during the manufacturing process of the magnetic sensor according to the seventh embodiment of the invention. 16 is a cross-sectional view taken along the line XVI-XVI in FIG.

  Since the magnetic sensor and the manufacturing method of the magnetic sensor in the seventh embodiment are in common with those in the sixth embodiment described above, the detailed description of the common parts is omitted below, and different parts are emphasized. I will explain it. The seventh embodiment differs from the sixth embodiment described above in that the protrusion is provided in the bias magnet and the hole is provided in the lead frame.

  Further, the bias magnet 22a in the present embodiment has a magnet-side protrusion 22a1 (corresponding to a holding portion in the claims of the present invention) that holds the positional relationship with the lead frame 12. The magnet side protrusion 22a1 has, for example, a cylindrical shape, a rectangular parallelepiped shape, a cubic shape, or the like. Further, it is preferable that the magnet side protrusions 22a1 are provided at positions facing each other in the vicinity of the periphery.

  The lead frame 12 in the present embodiment has a frame-side hole portion 121 (corresponding to the holding portion in the claims of the present invention) corresponding to the shape of the magnet-side protrusion 22a1 of the bias magnet 22a. The frame side hole 121 may be a through hole.

  When a magnetic sensor is manufactured using the lead frame 12 and the bias magnet 22a described above, first, as shown in FIGS. 16 (a) and 16 (b), the bias magnet 22a is inserted into the frame side hole 121 of the lead frame 12. The bias magnet 22a is disposed on the lead frame 12 (mounting portion) via an adhesive (not shown) so that the magnet-side protrusion 22a1 is inserted. Then, the adhesive is cured by heating in this state, and the bias magnet 22a is bonded to the lead frame 12 (mounting portion) (bonding step). The magnetic detection element is bonded to the lead frame 12 via an adhesive as in the above-described embodiment.

  Then, when the adhesive is cured and the bias magnet 22a and the magnetic detection element are fixed to the lead frame 12 (mounting portion), the lead frame 12 is divided into each mounting portion to form individual pieces (separation process).

  As described above, the lead frame 12 (mounting portion) and the bias magnet 22a include the frame-side hole 121 and the magnet-side protrusion 22a1 (holding portion) that hold the positional relationship between the lead frame 12 (mounting portion) and the bias magnet 22a. The bias magnets can be prevented from shifting due to magnetic interference between adjacent bias magnets. Therefore, since the interval between the mounting portions can be reduced, unnecessary portions of the lead frame 12 can be reduced and productivity can be improved.

  In the sixth and seventh embodiments described above, the example in which the holding portion is provided in both the lead frame and the bias magnet has been described. However, the present invention is not limited to this, and the lead frame is not limited thereto. The object of the present invention can be achieved if a holding portion is provided in at least one of the bias magnets. For example, a concave portion corresponding to the shape (outer peripheral shape) of the bias magnet may be provided in the lead frame as a holding portion, and the bias magnet may be inserted into the concave portion. Further, the lead frame may be provided with a protrusion corresponding to the shape (peripheral shape) of the bias magnet, and the bias magnet may be inserted into a region surrounded by the protrusion.

  In the above-described embodiment, the magnetic detection element and the bias magnet are described using the example of mounting on the same surface (surface in the same direction) of the lead frame, but the present invention is not limited to this. The object of the present invention can also be achieved by mounting on different surfaces (front surface and back surface) of the lead frame.

It is a top view which shows schematic structure in the manufacturing process of the magnetic sensor in the 1st Embodiment of this invention. It is II-II sectional drawing of FIG. FIG. 3 is a sectional view taken along line III-III in FIG. 1. It is IV-IV sectional drawing of FIG. (A)-(c) is a top view according to process which shows the manufacturing method of the magnetic sensor in the 1st Embodiment of this invention. It is a top view which shows schematic structure in the manufacturing process of the magnetic sensor in the 2nd Embodiment of this invention. It is VII-VII sectional drawing of FIG. It is a top view which shows schematic structure in the manufacturing process of the magnetic sensor in the 3rd Embodiment of this invention. It is IX-IX sectional drawing of FIG. It is a top view which shows schematic structure in the manufacturing process of the magnetic sensor in the 4th Embodiment of this invention. It is XI-XI sectional drawing of FIG. It is sectional drawing which shows schematic structure in the manufacturing process of the magnetic sensor in the 5th Embodiment of this invention. It is an enlarged plan view which shows schematic structure in the manufacturing process of the magnetic sensor in the 6th Embodiment of this invention. It is XIV-XIV sectional drawing of FIG. It is an enlarged plan view which shows schematic structure in the manufacturing process of the magnetic sensor in the 7th Embodiment of this invention. It is XVI-XVI sectional drawing of FIG.

Explanation of symbols

10-12 Lead frame, 20a-20c, 21a, 22a Bias magnet, 30a-30c Magnetic detection element, 40-44 Temporary fixing member, e1-e3 mounting part, 111 frame side protrusion, 21a1 magnet side hole, 121 frame Side hole, 21a1 Magnet side protrusion

Claims (12)

A method of manufacturing a magnetic sensor having a bias magnet and a sensor chip that are bonded and fixed to a support member,
For the support member having a plurality of mounting portions on which the pair of bias magnets and the sensor chip are mounted, the pair of bias magnets and the sensor chip are arranged on each mounting portion via an adhesive, and the support An adhesion step of adhering a member to the bias magnet and the sensor chip;
A dividing step of dividing the support member for each mounting portion on which a pair of the bias magnet and the sensor chip are mounted;
In the bonding step, a temporary fixing step of temporarily fixing the bias magnet and the support member with a temporary fixing member;
The manufacturing method of the magnetic sensor characterized by the above-mentioned.   The method of manufacturing a magnetic sensor according to claim 1, wherein the temporary fixing member is made of a magnetic material and is disposed at least at a position facing the bias magnet with the support member interposed therebetween.   The bias magnet and the sensor chip are arranged on the mounting portion such that one side faces each other, and the temporary fixing member is made of a magnetic material and faces the sensor chip of the bias magnet. The magnetic sensor according to claim 1, wherein the magnetic sensor is disposed on the same side as the side on which the bias magnet is disposed in the support member at a position where a side surface opposite to the side to be disposed is to be disposed. Method.   The temporary fixing member is made of a magnetic material, has a width corresponding to the interval between the bias magnets disposed in the plurality of mounting portions, and is disposed between positions where the bias magnets are to be disposed. The method of manufacturing a magnetic sensor according to claim 1.   The temporary fixing member is made of a magnetic material, and includes a hole corresponding to the shape of the bias magnet, and the bias magnet is disposed in each mounting portion via the adhesive in a state of being disposed in the hole. The method of manufacturing a magnetic sensor according to claim 1, wherein:   The adhesive is a thermosetting adhesive, the bonding step includes a heating step of heating the adhesive, and the temporary fixing member includes a hole corresponding to the shape of the bias magnet, 2. The magnetism according to claim 1, wherein the bias magnet disposed in the mounting portion is pressure-bonded to the support member in a state of being disposed in the hole portion by the temporary fixing member before the heating step. Sensor manufacturing method. A magnetic sensor having a bias magnet and a sensor chip that are bonded and fixed to a support member,
The support member has a plurality of mounting portions on which the pair of bias magnets and the sensor chip are mounted, and at least one of the mounting portion and the bias magnet maintains a positional relationship between the mounting portion and the bias magnet. Having a holding part to
A bonding step of arranging a pair of the bias magnet and the sensor chip on each mounting portion via an adhesive, and bonding the support member, the bias magnet, and the sensor chip;
A dividing step of dividing the support member for each mounting portion on which a pair of the bias magnet and the sensor chip are mounted;
The manufacturing method of the magnetic sensor characterized by the above-mentioned.   The method of manufacturing a magnetic sensor according to claim 7, wherein the holding part is a hole provided in the mounting part and a protrusion corresponding to the hole provided in the bias magnet.   The method of manufacturing a magnetic sensor according to claim 7, wherein the holding part is a hole provided in the bias magnet and a protrusion corresponding to the hole provided in the mounting part. A magnetic sensor having a bias magnet and a sensor chip fixedly bonded to a support member,
At least one of the support member and the bias magnet has a holding portion that holds a positional relationship between the mounting portion and the bias magnet.   The magnetic sensor according to claim 10, wherein the holding part is a hole provided in the support member and a protrusion corresponding to the hole provided in the bias magnet.   The magnetic sensor according to claim 10, wherein the holding part is a hole provided in the bias magnet and a protrusion corresponding to the hole provided in the support member.

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