GB1251285A - - Google Patents
Info
- Publication number
- GB1251285A GB1251285A GB1251285DA GB1251285A GB 1251285 A GB1251285 A GB 1251285A GB 1251285D A GB1251285D A GB 1251285DA GB 1251285 A GB1251285 A GB 1251285A
- Authority
- GB
- United Kingdom
- Prior art keywords
- catalyzing
- adhesive layer
- rubber
- layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 229920000742 Cotton Polymers 0.000 abstract 1
- 229920000459 Nitrile rubber Polymers 0.000 abstract 1
- 101150003085 Pdcl gene Proteins 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 abstract 1
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 abstract 1
- 229920005549 butyl rubber Polymers 0.000 abstract 1
- HBWKVDXNTCJIOW-UHFFFAOYSA-L cadmium(2+);2-hydroxypropanoate Chemical compound [Cd+2].CC(O)C([O-])=O.CC(O)C([O-])=O HBWKVDXNTCJIOW-UHFFFAOYSA-L 0.000 abstract 1
- 229910052791 calcium Inorganic materials 0.000 abstract 1
- 239000011575 calcium Substances 0.000 abstract 1
- MKJXYGKVIBWPFZ-UHFFFAOYSA-L calcium lactate Chemical compound [Ca+2].CC(O)C([O-])=O.CC(O)C([O-])=O MKJXYGKVIBWPFZ-UHFFFAOYSA-L 0.000 abstract 1
- 229960002401 calcium lactate Drugs 0.000 abstract 1
- 239000001527 calcium lactate Substances 0.000 abstract 1
- 235000011086 calcium lactate Nutrition 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004310 lactic acid Substances 0.000 abstract 1
- 235000014655 lactic acid Nutrition 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 229920000728 polyester Polymers 0.000 abstract 1
- 229920001225 polyester resin Polymers 0.000 abstract 1
- 239000004645 polyester resin Substances 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000007788 roughening Methods 0.000 abstract 1
- 239000005060 rubber Substances 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 150000004760 silicates Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 229920003051 synthetic elastomer Polymers 0.000 abstract 1
- 239000005061 synthetic rubber Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6808469A NL6808469A (enrdf_load_stackoverflow) | 1968-06-15 | 1968-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1251285A true GB1251285A (enrdf_load_stackoverflow) | 1971-10-27 |
Family
ID=19803904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1251285D Expired GB1251285A (enrdf_load_stackoverflow) | 1968-06-15 | 1969-06-12 |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE734635A (enrdf_load_stackoverflow) |
| DE (1) | DE1926669B2 (enrdf_load_stackoverflow) |
| FR (1) | FR2010984A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1251285A (enrdf_load_stackoverflow) |
| NL (1) | NL6808469A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1980002222A1 (en) * | 1979-04-11 | 1980-10-16 | Neselco As | A method for drysensitization of an insulating surface and a powder for use with the method |
| GB2196992A (en) * | 1986-09-19 | 1988-05-11 | Firan Corp | Production of circuit boards by coating with metal |
| CN115464576A (zh) * | 2022-09-06 | 2022-12-13 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2131205C3 (de) * | 1971-06-23 | 1981-07-30 | International Electronic Research Corp., Burbank, Calif. | Verfahren zur Herstellung einer gedruckten Schaltung mit einem Metallkern |
| US4029845A (en) * | 1974-08-15 | 1977-06-14 | Sumitomo Bakelite Company, Limited | Printed circuit base board and method for manufacturing same |
| DE3006117C2 (de) * | 1980-02-19 | 1981-11-26 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen |
| DE3145721A1 (de) * | 1981-11-19 | 1983-05-26 | Helmuth 2058 Lauenburg Schmoock | Verfahren zum herstellen von gedruckten schaltungen |
-
1968
- 1968-06-15 NL NL6808469A patent/NL6808469A/xx unknown
-
1969
- 1969-05-24 DE DE19691926669 patent/DE1926669B2/de not_active Ceased
- 1969-06-12 GB GB1251285D patent/GB1251285A/en not_active Expired
- 1969-06-16 FR FR6919947A patent/FR2010984A1/fr not_active Withdrawn
- 1969-06-16 BE BE734635D patent/BE734635A/xx not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1980002222A1 (en) * | 1979-04-11 | 1980-10-16 | Neselco As | A method for drysensitization of an insulating surface and a powder for use with the method |
| GB2196992A (en) * | 1986-09-19 | 1988-05-11 | Firan Corp | Production of circuit boards by coating with metal |
| AU608245B2 (en) * | 1986-09-19 | 1991-03-28 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
| GB2196992B (en) * | 1986-09-19 | 1991-05-01 | Firan Corp | Production of circuit boards and circuit boards so produced |
| CN115464576A (zh) * | 2022-09-06 | 2022-12-13 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
| CN115464576B (zh) * | 2022-09-06 | 2023-11-17 | 南通市辉鑫玻璃纤维有限公司 | 一种高预应力玻璃纤维砂轮网片的生产工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1926669A1 (de) | 1969-12-18 |
| DE1926669B2 (de) | 1977-09-29 |
| BE734635A (enrdf_load_stackoverflow) | 1969-12-16 |
| FR2010984A1 (enrdf_load_stackoverflow) | 1970-02-20 |
| NL6808469A (enrdf_load_stackoverflow) | 1969-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3625758A (en) | Base material and method for the manufacture of printed circuits | |
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| GB1143899A (en) | Improvements relating to the manufacture of printed circuits | |
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| GB1251285A (enrdf_load_stackoverflow) | ||
| US3758304A (en) | Method of producing electrically conductive metal layers | |
| JPS6350878B2 (enrdf_load_stackoverflow) | ||
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| ES487017A1 (es) | Metodo de fabricacion de dispositivos de circuito impreso | |
| JPS647592A (en) | Manufacture of printed wiring board | |
| GB1397615A (en) | Method of manufacturing a base for a printed electrical circuit | |
| GB1337338A (en) | Process for making printed circuit boards and products obtained by said process | |
| GB1332041A (en) | Process for forming a conductive coating on a substrate | |
| GB2006831A (en) | Depositing film resistors by electroless coating | |
| JPH0449795B2 (enrdf_load_stackoverflow) | ||
| JPS5877286A (ja) | プリント配線板の製造方法 | |
| GB1343212A (en) | Treatmetn of resin substrates for the reception of metal doposits | |
| JPS5856493A (ja) | 印刷配線板の製造方法 | |
| GB1321010A (en) | Method of manufacturing metal core printed circuit board | |
| JPS5967692A (ja) | 印刷配線板の製造方法 | |
| JPS56136863A (en) | Adhesive for printed circuit board | |
| ES393217A1 (es) | Procedimiento para proporcionar una adhesion mejorada entreuna capa metalica conductora y un sustrato no conductor en una placa de circuito impreso. | |
| JPH0248155B2 (ja) | Insatsuhaisenbannoseizohoho | |
| JPS6476794A (en) | Manufacture of printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |