GB1245710A - Case for containing a semiconductor element - Google Patents

Case for containing a semiconductor element

Info

Publication number
GB1245710A
GB1245710A GB62897/69A GB6289769A GB1245710A GB 1245710 A GB1245710 A GB 1245710A GB 62897/69 A GB62897/69 A GB 62897/69A GB 6289769 A GB6289769 A GB 6289769A GB 1245710 A GB1245710 A GB 1245710A
Authority
GB
United Kingdom
Prior art keywords
tracks
metallization
ceramic plate
power supply
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB62897/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1245710A publication Critical patent/GB1245710A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB62897/69A 1968-12-25 1969-12-24 Case for containing a semiconductor element Expired GB1245710A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9453868A JPS5332233B1 (enExample) 1968-12-25 1968-12-25

Publications (1)

Publication Number Publication Date
GB1245710A true GB1245710A (en) 1971-09-08

Family

ID=14113083

Family Applications (1)

Application Number Title Priority Date Filing Date
GB62897/69A Expired GB1245710A (en) 1968-12-25 1969-12-24 Case for containing a semiconductor element

Country Status (3)

Country Link
US (1) US3617817A (enExample)
JP (1) JPS5332233B1 (enExample)
GB (1) GB1245710A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
FR2514562A1 (fr) * 1981-10-09 1983-04-15 Thomson Csf Circuit hybride multicouche a condensateurs et liaisons internes
FR2521780A1 (fr) * 1982-01-15 1983-08-19 Avx Corp Dispositif a circuit integre presentant un moyen d'amortissement interne des signaux transitoires vis-a-vis de plusieurs sources d'alimentation electrique
EP0077818A4 (en) * 1981-05-06 1985-04-24 Western Electric Co PACKAGE FOR A SEMICONDUCTOR CHIP WITH A CAPACITOR AS AN INTEGRATED COMPONENT THEREOF.
US4593384A (en) * 1984-12-21 1986-06-03 Ncr Corporation Security device for the secure storage of sensitive data
GB2199988A (en) * 1987-01-12 1988-07-20 Intel Corp Multi-layer molded plastic ic package
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
US4891687A (en) * 1987-01-12 1990-01-02 Intel Corporation Multi-layer molded plastic IC package
GB2225171A (en) * 1988-10-20 1990-05-23 Hemscheidt Maschf Hermann Electrohydraulic control device for hydraulic self-advancing support units
WO1996041377A1 (en) * 1995-06-07 1996-12-19 The Panda Project High performance semiconductor die carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3730969A (en) * 1972-03-06 1973-05-01 Rca Corp Electronic device package
JPS5228547B2 (enExample) * 1972-07-10 1977-07-27
US4396971A (en) * 1972-07-10 1983-08-02 Amdahl Corporation LSI Chip package and method
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
JPS5629974Y2 (enExample) * 1975-04-02 1981-07-16
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
JPS52120768A (en) * 1976-04-05 1977-10-11 Nec Corp Semiconductor device
JPS557346U (enExample) * 1978-06-30 1980-01-18
US4226492A (en) * 1979-07-30 1980-10-07 Bell Telephone Laboratories, Incorporated Electrical interconnection apparatus
US5861670A (en) * 1979-10-04 1999-01-19 Fujitsu Limited Semiconductor device package
GB2083285B (en) * 1980-02-12 1984-08-15 Mostek Corp Over/under dual in-line chip package
US4527185A (en) * 1981-01-12 1985-07-02 Avx Corporation Integrated circuit device and subassembly
US5007083A (en) * 1981-03-17 1991-04-09 Constant James N Secure computer
US4451845A (en) * 1981-12-22 1984-05-29 Avx Corporation Lead frame device including ceramic encapsulated capacitor and IC chip
US4551747A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4626958A (en) * 1985-01-22 1986-12-02 Rogers Corporation Decoupling capacitor for Pin Grid Array package
US4658327A (en) * 1985-01-22 1987-04-14 Rogers Corporation Decoupling capacitor for surface mounted chip carrier
US4734818A (en) * 1985-01-22 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages
FR2576448B1 (fr) * 1985-01-22 1989-04-14 Rogers Corp Condensateur de decouplage pour assemblage avec disposition a grille de broches
US4734819A (en) * 1985-12-20 1988-03-29 Rogers Corporation Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package
US5170245A (en) * 1988-06-15 1992-12-08 International Business Machines Corp. Semiconductor device having metallic interconnects formed by grit blasting
US5196992A (en) * 1989-08-25 1993-03-23 Kabushiki Kaisha Toshiba Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin
US5218168A (en) * 1991-09-26 1993-06-08 Micron Technology, Inc. Leads over tab
JP2969237B2 (ja) * 1992-07-06 1999-11-02 日本特殊陶業株式会社 コンデンサー内蔵基板及びその製造方法
US5296736A (en) * 1992-12-21 1994-03-22 Motorola, Inc. Leveled non-coplanar semiconductor die contacts
JPH06334105A (ja) * 1993-05-24 1994-12-02 Shinko Electric Ind Co Ltd 多層リードフレーム
US5657811A (en) * 1993-06-04 1997-08-19 Pcc Composites, Inc. Cast-in hermetic electrical feed-throughs
US5525834A (en) * 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package
US5701032A (en) * 1994-10-17 1997-12-23 W. L. Gore & Associates, Inc. Integrated circuit package
US5959348A (en) * 1997-08-18 1999-09-28 International Business Machines Corporation Construction of PBGA substrate for flip chip packing
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
US6806563B2 (en) * 2003-03-20 2004-10-19 International Business Machines Corporation Composite capacitor and stiffener for chip carrier

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
EP0077818A4 (en) * 1981-05-06 1985-04-24 Western Electric Co PACKAGE FOR A SEMICONDUCTOR CHIP WITH A CAPACITOR AS AN INTEGRATED COMPONENT THEREOF.
FR2514562A1 (fr) * 1981-10-09 1983-04-15 Thomson Csf Circuit hybride multicouche a condensateurs et liaisons internes
FR2521780A1 (fr) * 1982-01-15 1983-08-19 Avx Corp Dispositif a circuit integre presentant un moyen d'amortissement interne des signaux transitoires vis-a-vis de plusieurs sources d'alimentation electrique
US4593384A (en) * 1984-12-21 1986-06-03 Ncr Corporation Security device for the secure storage of sensitive data
GB2199988B (en) * 1987-01-12 1990-04-25 Intel Corp Multi-layer molded plastic ic package
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
US4891687A (en) * 1987-01-12 1990-01-02 Intel Corporation Multi-layer molded plastic IC package
GB2199988A (en) * 1987-01-12 1988-07-20 Intel Corp Multi-layer molded plastic ic package
GB2225171A (en) * 1988-10-20 1990-05-23 Hemscheidt Maschf Hermann Electrohydraulic control device for hydraulic self-advancing support units
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6828511B2 (en) 1994-03-11 2004-12-07 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
WO1996041377A1 (en) * 1995-06-07 1996-12-19 The Panda Project High performance semiconductor die carrier

Also Published As

Publication number Publication date
JPS5332233B1 (enExample) 1978-09-07
US3617817A (en) 1971-11-02

Similar Documents

Publication Publication Date Title
GB1245710A (en) Case for containing a semiconductor element
US4410905A (en) Power, ground and decoupling structure for chip carriers
US4839717A (en) Ceramic package for high frequency semiconductor devices
KR830002552B1 (ko) 이중 공동반도체 칩캐리어
US3784884A (en) Low parasitic microwave package
US5272590A (en) Integrated circuit package having an internal cavity for incorporating decoupling capacitor
US5331514A (en) Integrated-circuit package
US3683241A (en) Radio frequency transistor package
EP0357758B1 (en) Hermetic package for integrated circuit chips
US4989117A (en) Molded integrated circuit package incorporating thin decoupling capacitor
JPS58124259A (ja) リードフレームアセンブリ
GB1073910A (en) Improvements in and relating to electrical connections to a solid state device
US3753056A (en) Microwave semiconductor device
JPH0278264A (ja) ピン格子配列パッケージ構造
GB1251454A (enExample)
US3864727A (en) Semiconductor device
GB1227653A (enExample)
US4714981A (en) Cover for a semiconductor package
JP2646091B2 (ja) 電子部品用基体
GB1127736A (en) Microwave semiconductor device package
JPH07142283A (ja) コンデンサ及びこれを用いた実装構造
JPS63209198A (ja) 半導体装置
GB1191093A (en) Improvement of the Electrode Lead-Out Structure of a Semiconductor Device
JPH0645401A (ja) 半導体装置用パッケージ
JPS6250063B2 (enExample)