GB1186218A - Improvements in or relating to Printed Circuits. - Google Patents

Improvements in or relating to Printed Circuits.

Info

Publication number
GB1186218A
GB1186218A GB2661467A GB2661467A GB1186218A GB 1186218 A GB1186218 A GB 1186218A GB 2661467 A GB2661467 A GB 2661467A GB 2661467 A GB2661467 A GB 2661467A GB 1186218 A GB1186218 A GB 1186218A
Authority
GB
United Kingdom
Prior art keywords
laminate
resin
june
polymer layer
fibre fabric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2661467A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynamit Nobel AG
Original Assignee
Dynamit Nobel AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1966D0033571 external-priority patent/DE1943453U/en
Application filed by Dynamit Nobel AG filed Critical Dynamit Nobel AG
Publication of GB1186218A publication Critical patent/GB1186218A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)

Abstract

1,186,218. Coated sheet material. DYNAMIT NOBEL A.G. 8 June, 1967 [8 June, 1966 (2)], No. 26614/67. Heading B2E. [Also in Divisions B5 and H1] A substrate for use in the manufacture of a printed circuit comprises a laminate of a plurality of resin-impregnated sheets, a surface of which laminate is covered with a layer of an acrylonitrile-butadiene-styrene polymer or of poly-4-methyl pentene. The laminate may be formed from cellulose paper, cotton fabric, glass fibre fabric, or synthetic fibre fabric impregnated with a phenol-formaldehyde resin, an epoxide resin or an unsaturated polyester resin. The polymer layer may be applied to the laminate by dipping, spraying, or casting. The surface of the polymer layer is roughened, e.g. by treatment with chromosulphuric acid, before a metal (e.g. copper) foil pattern is applied thereto, e.g. by electrodeposition.
GB2661467A 1966-06-08 1967-06-08 Improvements in or relating to Printed Circuits. Expired GB1186218A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED0050272 1966-06-08
DE1966D0033571 DE1943453U (en) 1966-06-08 1966-06-08 CARRIER ELEMENT FOR PRINTED CIRCUITS.

Publications (1)

Publication Number Publication Date
GB1186218A true GB1186218A (en) 1970-04-02

Family

ID=25971103

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2661467A Expired GB1186218A (en) 1966-06-08 1967-06-08 Improvements in or relating to Printed Circuits.

Country Status (1)

Country Link
GB (1) GB1186218A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2216435A (en) * 1988-03-25 1989-10-11 Junkosha Co Ltd Prepreg sheet
FR2651953A1 (en) * 1989-09-12 1991-03-15 France Etat METALLIC SUPPORT BASED ON POLYMETHYLPENTENE AND METHOD OF MANUFACTURING THE SAME.
FR2753724A1 (en) * 1996-09-23 1998-03-27 Avi Peschard Treatment of poly:methyl:pentene surface before metallisation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2216435A (en) * 1988-03-25 1989-10-11 Junkosha Co Ltd Prepreg sheet
FR2651953A1 (en) * 1989-09-12 1991-03-15 France Etat METALLIC SUPPORT BASED ON POLYMETHYLPENTENE AND METHOD OF MANUFACTURING THE SAME.
EP0418148A1 (en) * 1989-09-12 1991-03-20 France Telecom Method of making a polymethylpentene based metallized support
FR2753724A1 (en) * 1996-09-23 1998-03-27 Avi Peschard Treatment of poly:methyl:pentene surface before metallisation

Similar Documents

Publication Publication Date Title
ES8407525A1 (en) Compositions convertible to reinforced conductive components and articles incorporating same.
GB1186218A (en) Improvements in or relating to Printed Circuits.
JPS5537314A (en) Method of forming high molecular organic thin film
DE1243746B (en) Process for the production of a printed circuit on a carrier plate, the surface of which deviates from a plane
GB1418949A (en) Electrical component assemblies
ES309289A1 (en) Process and machine for the continuous application of protective or decorative coverings
GB1397615A (en) Method of manufacturing a base for a printed electrical circuit
GB1207723A (en) Metal coating selected areas of a substrate
JPS5722014A (en) Production of thermosetting resin decorative board
JPS5687676A (en) Production of copper foil
GB1005619A (en) Improvements in and relating to the deposition of copper on non-conductive surfaces
GB829354A (en) Improvements in or relating to electrical circuits
AT268424B (en) Laminate carrier element
JPS5326879A (en) Laminated sheet
IL29908A (en) Laminated sheet material
JPS51119780A (en) A composite sheet
JPS5430263A (en) Production of decorative material
GB1364755A (en) Reinforced plastics carrier for printed circuits
JPS6340215A (en) Laminate plate for electricity
GB999035A (en) Copper faced laminated fibrous sheets
JPS5649735A (en) Production of laminated sheet
JPS57135116A (en) Manufacture of laminated sheet
JPS6461240A (en) Laminate for electric use
GB813825A (en) Improvements in and relating to printed resistors
CH495682A (en) Phenolic-epoxy-or polyester paper glass fibre etc

Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees