GB1173117A - Improvements relating to Terminal Structures - Google Patents
Improvements relating to Terminal StructuresInfo
- Publication number
- GB1173117A GB1173117A GB29368/68A GB2936868A GB1173117A GB 1173117 A GB1173117 A GB 1173117A GB 29368/68 A GB29368/68 A GB 29368/68A GB 2936868 A GB2936868 A GB 2936868A GB 1173117 A GB1173117 A GB 1173117A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- chromium
- glass
- nickel
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65312867A | 1967-07-13 | 1967-07-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1173117A true GB1173117A (en) | 1969-12-03 |
Family
ID=24619594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB29368/68A Expired GB1173117A (en) | 1967-07-13 | 1968-06-20 | Improvements relating to Terminal Structures |
Country Status (6)
Country | Link |
---|---|
BE (1) | BE717095A (fr) |
CH (1) | CH476397A (fr) |
DE (1) | DE1764572A1 (fr) |
ES (1) | ES355851A1 (fr) |
FR (1) | FR1569479A (fr) |
GB (1) | GB1173117A (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0043458A2 (fr) * | 1980-07-03 | 1982-01-13 | International Business Machines Corporation | Procédé pour fabriquer un système de connection métallurgique |
GB2124830A (en) * | 1982-07-30 | 1984-02-22 | Xerox Corp | Electrical circuit assembly |
DE3614087A1 (de) * | 1985-04-26 | 1986-10-30 | Sgs Microelettronica S.P.A., Catania | Vorrichtung und verfahren zur verbesserten verkapselung von halbleitervorrichtungen |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3821785A (en) * | 1972-03-27 | 1974-06-28 | Signetics Corp | Semiconductor structure with bumps |
IT1075077B (it) * | 1977-03-08 | 1985-04-22 | Ates Componenti Elettron | Metodo pr realizzare contatti su semiconduttori |
GB2095904B (en) * | 1981-03-23 | 1985-11-27 | Gen Electric | Semiconductor device with built-up low resistance contact and laterally conducting second contact |
-
1968
- 1968-06-19 FR FR1569479D patent/FR1569479A/fr not_active Expired
- 1968-06-20 GB GB29368/68A patent/GB1173117A/en not_active Expired
- 1968-06-25 BE BE717095D patent/BE717095A/xx unknown
- 1968-06-28 DE DE19681764572 patent/DE1764572A1/de active Pending
- 1968-07-04 CH CH1003168A patent/CH476397A/de not_active IP Right Cessation
- 1968-07-06 ES ES355851A patent/ES355851A1/es not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0043458A2 (fr) * | 1980-07-03 | 1982-01-13 | International Business Machines Corporation | Procédé pour fabriquer un système de connection métallurgique |
EP0043458A3 (en) * | 1980-07-03 | 1982-06-16 | International Business Machines Corporation | Process for forming a metallurgy interconnection system |
GB2124830A (en) * | 1982-07-30 | 1984-02-22 | Xerox Corp | Electrical circuit assembly |
DE3614087A1 (de) * | 1985-04-26 | 1986-10-30 | Sgs Microelettronica S.P.A., Catania | Vorrichtung und verfahren zur verbesserten verkapselung von halbleitervorrichtungen |
GB2174543A (en) * | 1985-04-26 | 1986-11-05 | Sgs Microelettronica Spa | Improved packaging of semiconductor devices |
DE3614087C2 (de) * | 1985-04-26 | 1999-05-06 | Sgs Microelettronica Spa | Halbleitervorrichtungs-Baueinheit und Verfahren zum elektrischen Verbinden eines IC-Chips |
Also Published As
Publication number | Publication date |
---|---|
DE1764572A1 (de) | 1971-03-04 |
FR1569479A (fr) | 1969-05-30 |
ES355851A1 (es) | 1970-03-16 |
BE717095A (fr) | 1968-12-02 |
CH476397A (de) | 1969-07-31 |
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