GB1173117A - Improvements relating to Terminal Structures - Google Patents

Improvements relating to Terminal Structures

Info

Publication number
GB1173117A
GB1173117A GB29368/68A GB2936868A GB1173117A GB 1173117 A GB1173117 A GB 1173117A GB 29368/68 A GB29368/68 A GB 29368/68A GB 2936868 A GB2936868 A GB 2936868A GB 1173117 A GB1173117 A GB 1173117A
Authority
GB
United Kingdom
Prior art keywords
layer
chromium
glass
nickel
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB29368/68A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1173117A publication Critical patent/GB1173117A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Die Bonding (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
GB29368/68A 1967-07-13 1968-06-20 Improvements relating to Terminal Structures Expired GB1173117A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65312867A 1967-07-13 1967-07-13

Publications (1)

Publication Number Publication Date
GB1173117A true GB1173117A (en) 1969-12-03

Family

ID=24619594

Family Applications (1)

Application Number Title Priority Date Filing Date
GB29368/68A Expired GB1173117A (en) 1967-07-13 1968-06-20 Improvements relating to Terminal Structures

Country Status (6)

Country Link
BE (1) BE717095A (cg-RX-API-DMAC10.html)
CH (1) CH476397A (cg-RX-API-DMAC10.html)
DE (1) DE1764572A1 (cg-RX-API-DMAC10.html)
ES (1) ES355851A1 (cg-RX-API-DMAC10.html)
FR (1) FR1569479A (cg-RX-API-DMAC10.html)
GB (1) GB1173117A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0043458A3 (en) * 1980-07-03 1982-06-16 International Business Machines Corporation Process for forming a metallurgy interconnection system
GB2124830A (en) * 1982-07-30 1984-02-22 Xerox Corp Electrical circuit assembly
DE3614087A1 (de) * 1985-04-26 1986-10-30 Sgs Microelettronica S.P.A., Catania Vorrichtung und verfahren zur verbesserten verkapselung von halbleitervorrichtungen

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821785A (en) * 1972-03-27 1974-06-28 Signetics Corp Semiconductor structure with bumps
IT1075077B (it) * 1977-03-08 1985-04-22 Ates Componenti Elettron Metodo pr realizzare contatti su semiconduttori
GB2095904B (en) * 1981-03-23 1985-11-27 Gen Electric Semiconductor device with built-up low resistance contact and laterally conducting second contact

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0043458A3 (en) * 1980-07-03 1982-06-16 International Business Machines Corporation Process for forming a metallurgy interconnection system
GB2124830A (en) * 1982-07-30 1984-02-22 Xerox Corp Electrical circuit assembly
DE3614087A1 (de) * 1985-04-26 1986-10-30 Sgs Microelettronica S.P.A., Catania Vorrichtung und verfahren zur verbesserten verkapselung von halbleitervorrichtungen
GB2174543A (en) * 1985-04-26 1986-11-05 Sgs Microelettronica Spa Improved packaging of semiconductor devices
DE3614087C2 (de) * 1985-04-26 1999-05-06 Sgs Microelettronica Spa Halbleitervorrichtungs-Baueinheit und Verfahren zum elektrischen Verbinden eines IC-Chips

Also Published As

Publication number Publication date
FR1569479A (cg-RX-API-DMAC10.html) 1969-05-30
CH476397A (de) 1969-07-31
ES355851A1 (es) 1970-03-16
BE717095A (cg-RX-API-DMAC10.html) 1968-12-02
DE1764572A1 (de) 1971-03-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees