BE717095A - - Google Patents
Info
- Publication number
- BE717095A BE717095A BE717095DA BE717095A BE 717095 A BE717095 A BE 717095A BE 717095D A BE717095D A BE 717095DA BE 717095 A BE717095 A BE 717095A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65312867A | 1967-07-13 | 1967-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE717095A true BE717095A (cg-RX-API-DMAC10.html) | 1968-12-02 |
Family
ID=24619594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE717095D BE717095A (cg-RX-API-DMAC10.html) | 1967-07-13 | 1968-06-25 |
Country Status (6)
| Country | Link |
|---|---|
| BE (1) | BE717095A (cg-RX-API-DMAC10.html) |
| CH (1) | CH476397A (cg-RX-API-DMAC10.html) |
| DE (1) | DE1764572A1 (cg-RX-API-DMAC10.html) |
| ES (1) | ES355851A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR1569479A (cg-RX-API-DMAC10.html) |
| GB (1) | GB1173117A (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3821785A (en) * | 1972-03-27 | 1974-06-28 | Signetics Corp | Semiconductor structure with bumps |
| IT1075077B (it) * | 1977-03-08 | 1985-04-22 | Ates Componenti Elettron | Metodo pr realizzare contatti su semiconduttori |
| US4307179A (en) * | 1980-07-03 | 1981-12-22 | International Business Machines Corporation | Planar metal interconnection system and process |
| GB2095904B (en) * | 1981-03-23 | 1985-11-27 | Gen Electric | Semiconductor device with built-up low resistance contact and laterally conducting second contact |
| FR2531302A1 (fr) * | 1982-07-30 | 1984-02-03 | Xerox Corp | Procedes de formation d'un circuit electrique a haute densite et d'elements d'interconnexion pour le circuit |
| IT1215268B (it) * | 1985-04-26 | 1990-01-31 | Ates Componenti Elettron | Apparecchio e metodo per il confezionamento perfezionato di dispositivi semiconduttori. |
-
1968
- 1968-06-19 FR FR1569479D patent/FR1569479A/fr not_active Expired
- 1968-06-20 GB GB29368/68A patent/GB1173117A/en not_active Expired
- 1968-06-25 BE BE717095D patent/BE717095A/xx unknown
- 1968-06-28 DE DE19681764572 patent/DE1764572A1/de active Pending
- 1968-07-04 CH CH1003168A patent/CH476397A/de not_active IP Right Cessation
- 1968-07-06 ES ES355851A patent/ES355851A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1569479A (cg-RX-API-DMAC10.html) | 1969-05-30 |
| CH476397A (de) | 1969-07-31 |
| ES355851A1 (es) | 1970-03-16 |
| GB1173117A (en) | 1969-12-03 |
| DE1764572A1 (de) | 1971-03-04 |