GB1170897A - Improvements in or relating to Processes for Lapping and/or Polishing Semiconductor Plates. - Google Patents
Improvements in or relating to Processes for Lapping and/or Polishing Semiconductor Plates.Info
- Publication number
- GB1170897A GB1170897A GB00004/68A GB1000468A GB1170897A GB 1170897 A GB1170897 A GB 1170897A GB 00004/68 A GB00004/68 A GB 00004/68A GB 1000468 A GB1000468 A GB 1000468A GB 1170897 A GB1170897 A GB 1170897A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plates
- carrier
- lapping
- columns
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0108629 | 1967-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1170897A true GB1170897A (en) | 1969-11-19 |
Family
ID=7528929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB00004/68A Expired GB1170897A (en) | 1967-03-03 | 1968-03-01 | Improvements in or relating to Processes for Lapping and/or Polishing Semiconductor Plates. |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3562965A (https=) |
| DE (1) | DE1652170B2 (https=) |
| FR (1) | FR1564761A (https=) |
| GB (1) | GB1170897A (https=) |
| NL (1) | NL6801149A (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3805458A (en) * | 1972-12-22 | 1974-04-23 | Bell Telephone Labor Inc | Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers |
| US3803774A (en) * | 1972-12-22 | 1974-04-16 | Bell Telephone Labor Inc | Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping |
| DE2712521C2 (de) * | 1977-03-22 | 1987-03-05 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum Aufkitten von Scheiben |
| US4316757A (en) * | 1980-03-03 | 1982-02-23 | Monsanto Company | Method and apparatus for wax mounting of thin wafers for polishing |
| JP2648638B2 (ja) * | 1990-11-30 | 1997-09-03 | 三菱マテリアル株式会社 | ウェーハの接着方法およびその装置 |
| US6010392A (en) * | 1998-02-17 | 2000-01-04 | International Business Machines Corporation | Die thinning apparatus |
| US7121924B2 (en) | 2004-04-20 | 2006-10-17 | 3M Innovative Properties Company | Abrasive articles, and methods of making and using the same |
| US8124455B2 (en) * | 2005-04-02 | 2012-02-28 | Stats Chippac Ltd. | Wafer strength reinforcement system for ultra thin wafer thinning |
| TWI402906B (zh) * | 2007-06-25 | 2013-07-21 | 聖高拜陶器塑膠公司 | 單晶體之結晶性再定向之方法 |
| CN110370165B (zh) * | 2019-07-22 | 2021-07-13 | 吉林大学 | 一种耐磨损的行星研磨盘 |
-
1967
- 1967-03-03 DE DE1652170A patent/DE1652170B2/de active Pending
- 1967-12-26 US US693645A patent/US3562965A/en not_active Expired - Lifetime
-
1968
- 1968-01-25 NL NL6801149A patent/NL6801149A/xx unknown
- 1968-02-29 FR FR1564761D patent/FR1564761A/fr not_active Expired
- 1968-03-01 GB GB00004/68A patent/GB1170897A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3562965A (en) | 1971-02-16 |
| DE1652170B2 (de) | 1975-05-22 |
| DE1652170A1 (de) | 1971-02-25 |
| FR1564761A (https=) | 1969-04-25 |
| NL6801149A (https=) | 1968-09-04 |
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