FR1564761A - - Google Patents

Info

Publication number
FR1564761A
FR1564761A FR1564761DA FR1564761A FR 1564761 A FR1564761 A FR 1564761A FR 1564761D A FR1564761D A FR 1564761DA FR 1564761 A FR1564761 A FR 1564761A
Authority
FR
France
Prior art keywords
plates
carrier
columns
plane
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1564761A publication Critical patent/FR1564761A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02013—Grinding, lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR1564761D 1967-03-03 1968-02-29 Expired FR1564761A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0108629 1967-03-03

Publications (1)

Publication Number Publication Date
FR1564761A true FR1564761A (fr) 1969-04-25

Family

ID=7528929

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1564761D Expired FR1564761A (fr) 1967-03-03 1968-02-29

Country Status (5)

Country Link
US (1) US3562965A (fr)
DE (1) DE1652170B2 (fr)
FR (1) FR1564761A (fr)
GB (1) GB1170897A (fr)
NL (1) NL6801149A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2384589A1 (fr) * 1977-03-22 1978-10-20 Wacker Chemitronic Procede de collage au mastic de disques destines a etre polis

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805458A (en) * 1972-12-22 1974-04-23 Bell Telephone Labor Inc Technique for correcting the crystallographic orientation angle of crystals by double face lapping of overlapping layers
US3803774A (en) * 1972-12-22 1974-04-16 Bell Telephone Labor Inc Technique for correcting the crystallo-graphic orientation angle of crystals by the formation of mesas and double face lapping
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
US8124455B2 (en) * 2005-04-02 2012-02-28 Stats Chippac Ltd. Wafer strength reinforcement system for ultra thin wafer thinning
KR101230276B1 (ko) * 2007-06-25 2013-02-06 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 단결정체의 결정학적 재배향 방법
CN110370165B (zh) * 2019-07-22 2021-07-13 吉林大学 一种耐磨损的行星研磨盘

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2384589A1 (fr) * 1977-03-22 1978-10-20 Wacker Chemitronic Procede de collage au mastic de disques destines a etre polis

Also Published As

Publication number Publication date
DE1652170B2 (de) 1975-05-22
DE1652170A1 (de) 1971-02-25
US3562965A (en) 1971-02-16
NL6801149A (fr) 1968-09-04
GB1170897A (en) 1969-11-19

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Legal Events

Date Code Title Description
ST Notification of lapse