GB1156434A - Electronic Circuit Assembly - Google Patents

Electronic Circuit Assembly

Info

Publication number
GB1156434A
GB1156434A GB02629/68A GB1262968A GB1156434A GB 1156434 A GB1156434 A GB 1156434A GB 02629/68 A GB02629/68 A GB 02629/68A GB 1262968 A GB1262968 A GB 1262968A GB 1156434 A GB1156434 A GB 1156434A
Authority
GB
United Kingdom
Prior art keywords
melting point
stud
heat sink
circuit chips
wells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB02629/68A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1156434A publication Critical patent/GB1156434A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB02629/68A 1967-03-20 1968-03-15 Electronic Circuit Assembly Expired GB1156434A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US624549A US3405323A (en) 1967-03-20 1967-03-20 Apparatus for cooling electrical components

Publications (1)

Publication Number Publication Date
GB1156434A true GB1156434A (en) 1969-06-25

Family

ID=24502414

Family Applications (1)

Application Number Title Priority Date Filing Date
GB02629/68A Expired GB1156434A (en) 1967-03-20 1968-03-15 Electronic Circuit Assembly

Country Status (5)

Country Link
US (1) US3405323A (https=)
JP (1) JPS4710184B1 (https=)
DE (1) DE1574667A1 (https=)
FR (1) FR1553394A (https=)
GB (1) GB1156434A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135525A (en) * 1983-02-22 1984-08-30 Smiths Industries Plc Heat-dissipating chip carrier substrates
US4509096A (en) * 1983-02-22 1985-04-02 Smiths Industries Public Limited Company Chip-carrier substrates
GB2354116A (en) * 1999-09-10 2001-03-14 Llanelli Radiators Ltd Assembly for electrical/electronic components

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket
JPS5228547B2 (https=) * 1972-07-10 1977-07-27
US4396971A (en) * 1972-07-10 1983-08-02 Amdahl Corporation LSI Chip package and method
JPS51111289U (https=) * 1975-03-06 1976-09-08
DE3137034A1 (de) * 1981-09-17 1983-03-24 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum waermetausch an festen oberflaechen
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
EP0144579B1 (de) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen
US4603345A (en) * 1984-03-19 1986-07-29 Trilogy Computer Development Partners, Ltd. Module construction for semiconductor chip
FR2590005B1 (fr) * 1985-11-08 1987-12-11 Alsthom Cgee Systeme de composants semi-conducteurs de puissance refroidis par circulation d'un liquide
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4895005A (en) * 1988-12-29 1990-01-23 York International Corporation Motor terminal box mounted solid state starter
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
US6658736B1 (en) * 2002-08-09 2003-12-09 Unisys Corporation Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
PL1716624T3 (pl) * 2004-02-20 2009-07-31 Curamik Electronics Gmbh Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji
DE102010030155A1 (de) * 2010-06-16 2011-12-22 Behr Gmbh & Co. Kg Wärmetauscher und Verfahren zum Herstellen eines Wärmetauschers
CN102566605A (zh) * 2012-01-17 2012-07-11 华为技术有限公司 单板冷却装置
EP3086202A1 (en) * 2015-04-22 2016-10-26 Alcatel Lucent Thermal interface

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2829271A (en) * 1953-08-10 1958-04-01 Cormack E Boucher Heat conductive insulating support
US2845516A (en) * 1955-11-28 1958-07-29 Jones Louis Franklin Electric cable connector with soldered joints
US2937437A (en) * 1957-01-09 1960-05-24 Gen Dynamics Corp Method and apparatus for holding a work-piece
US2912624A (en) * 1957-07-29 1959-11-10 Itt Fluid cooled electronic chassis
NL262292A (https=) * 1960-04-08
NL301549A (https=) * 1962-12-17
US3275921A (en) * 1963-04-03 1966-09-27 Westinghouse Electric Corp Semiconductor rectifier assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135525A (en) * 1983-02-22 1984-08-30 Smiths Industries Plc Heat-dissipating chip carrier substrates
US4509096A (en) * 1983-02-22 1985-04-02 Smiths Industries Public Limited Company Chip-carrier substrates
GB2354116A (en) * 1999-09-10 2001-03-14 Llanelli Radiators Ltd Assembly for electrical/electronic components
GB2354116B (en) * 1999-09-10 2003-12-03 Llanelli Radiators Ltd Assembly for electrical/electronic components

Also Published As

Publication number Publication date
JPS4710184B1 (https=) 1972-03-27
FR1553394A (https=) 1969-01-10
US3405323A (en) 1968-10-08
DE1574667A1 (de) 1971-06-16

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