DE1574667A1 - Kuehlanordnung fuer elektronische Bauelemente - Google Patents

Kuehlanordnung fuer elektronische Bauelemente

Info

Publication number
DE1574667A1
DE1574667A1 DE19681574667 DE1574667A DE1574667A1 DE 1574667 A1 DE1574667 A1 DE 1574667A1 DE 19681574667 DE19681574667 DE 19681574667 DE 1574667 A DE1574667 A DE 1574667A DE 1574667 A1 DE1574667 A1 DE 1574667A1
Authority
DE
Germany
Prior art keywords
cooling arrangement
heat exchanger
arrangement according
electronic components
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19681574667
Other languages
German (de)
English (en)
Inventor
Surty Rohinton Jehangir
Jak Taranto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE1574667A1 publication Critical patent/DE1574667A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19681574667 1967-03-20 1968-03-19 Kuehlanordnung fuer elektronische Bauelemente Pending DE1574667A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US624549A US3405323A (en) 1967-03-20 1967-03-20 Apparatus for cooling electrical components

Publications (1)

Publication Number Publication Date
DE1574667A1 true DE1574667A1 (de) 1971-06-16

Family

ID=24502414

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681574667 Pending DE1574667A1 (de) 1967-03-20 1968-03-19 Kuehlanordnung fuer elektronische Bauelemente

Country Status (5)

Country Link
US (1) US3405323A (https=)
JP (1) JPS4710184B1 (https=)
DE (1) DE1574667A1 (https=)
FR (1) FR1553394A (https=)
GB (1) GB1156434A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030155A1 (de) * 2010-06-16 2011-12-22 Behr Gmbh & Co. Kg Wärmetauscher und Verfahren zum Herstellen eines Wärmetauschers

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket
JPS5228547B2 (https=) * 1972-07-10 1977-07-27
US4396971A (en) * 1972-07-10 1983-08-02 Amdahl Corporation LSI Chip package and method
JPS51111289U (https=) * 1975-03-06 1976-09-08
DE3137034A1 (de) * 1981-09-17 1983-03-24 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum waermetausch an festen oberflaechen
US4551787A (en) * 1983-02-07 1985-11-05 Sperry Corporation Apparatus for use in cooling integrated circuit chips
GB2135525B (en) * 1983-02-22 1986-06-18 Smiths Industries Plc Heat-dissipating chip carrier substrates
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
EP0144579B1 (de) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen
US4603345A (en) * 1984-03-19 1986-07-29 Trilogy Computer Development Partners, Ltd. Module construction for semiconductor chip
FR2590005B1 (fr) * 1985-11-08 1987-12-11 Alsthom Cgee Systeme de composants semi-conducteurs de puissance refroidis par circulation d'un liquide
US4942497A (en) * 1987-07-24 1990-07-17 Nec Corporation Cooling structure for heat generating electronic components mounted on a substrate
US4895005A (en) * 1988-12-29 1990-01-23 York International Corporation Motor terminal box mounted solid state starter
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5265670A (en) * 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
GB2354116B (en) * 1999-09-10 2003-12-03 Llanelli Radiators Ltd Assembly for electrical/electronic components
US6658736B1 (en) * 2002-08-09 2003-12-09 Unisys Corporation Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
PL1716624T3 (pl) * 2004-02-20 2009-07-31 Curamik Electronics Gmbh Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji
CN102566605A (zh) * 2012-01-17 2012-07-11 华为技术有限公司 单板冷却装置
EP3086202A1 (en) * 2015-04-22 2016-10-26 Alcatel Lucent Thermal interface

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2829271A (en) * 1953-08-10 1958-04-01 Cormack E Boucher Heat conductive insulating support
US2845516A (en) * 1955-11-28 1958-07-29 Jones Louis Franklin Electric cable connector with soldered joints
US2937437A (en) * 1957-01-09 1960-05-24 Gen Dynamics Corp Method and apparatus for holding a work-piece
US2912624A (en) * 1957-07-29 1959-11-10 Itt Fluid cooled electronic chassis
NL262292A (https=) * 1960-04-08
NL301549A (https=) * 1962-12-17
US3275921A (en) * 1963-04-03 1966-09-27 Westinghouse Electric Corp Semiconductor rectifier assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010030155A1 (de) * 2010-06-16 2011-12-22 Behr Gmbh & Co. Kg Wärmetauscher und Verfahren zum Herstellen eines Wärmetauschers

Also Published As

Publication number Publication date
JPS4710184B1 (https=) 1972-03-27
GB1156434A (en) 1969-06-25
FR1553394A (https=) 1969-01-10
US3405323A (en) 1968-10-08

Similar Documents

Publication Publication Date Title
DE1574667A1 (de) Kuehlanordnung fuer elektronische Bauelemente
DE602005005859T2 (de) Kühlsystem und -verfahren
DE69920842T2 (de) Flüssigkeitsgekühltes elektronisches Gerät
DE112020003635T5 (de) Wiedereintritt-Strömungskälteplatte
DE3044314C2 (de) Gehäuse zur Aufnahme von mit Wärme erzeugenden elektronischen Bauteilen bestückten gedruckten Schaltungen
DE2825582C2 (de) Kühlvorrichtung für Halbleiterelemente
DE4121534C2 (de) Kühlvorrichtung
DE602005002507T2 (de) Integriertes Kühlsystem für elektronische Geräte
DE69005342T2 (de) Zwischenstruktur zur Wärmeableitung vom elektrischen Modul.
DE68918156T2 (de) Flache Kühlungsstruktur für integrierte Schaltung.
DE60311910T2 (de) Leiterplatte mit einem Wärmerohr
DE19734054C2 (de) Mit einer Kühleinrichtung versehene gedruckte Leiterplatte
DE3886384T2 (de) Selbstausrichtende anordnung für flüssigkeitskühlung.
DE4401607C2 (de) Kühleinheit für Leistungshalbleiter
DE69502264T2 (de) Körper und Verbindung zur Kühlung eines elektronischen Bausteines durch eine von ihm elektrisch isolierte Flüssigkeit
DE1751585A1 (de) Waermeaustauscher mit mehreren Fluessigkeiten
DE102018132143A1 (de) Leiterplatte, chip-kühlgehäuse, baugruppe und verfahren zum kühlen eines halbleiterchips
DE102012219693A1 (de) Dimm-flüssigkeitskühlsystem, das durch benutzer gewartet werden kann
DE8114325U1 (de) Wärmeableitungsvorrichtung
DE112007003652T5 (de) Kühlmantel zum Kühlen eines elektronischen Bauelements auf einer Platte
DE112025000085T5 (de) Wärmeableitungsvorrichtung und Kommunikationsgerät
EP1275278A1 (de) Kühlvorrichtung zur kühlung von bauelementen der leistungselektronik mit einem mikrowärmeübertrager
DE102015108426B4 (de) Vorrichtung zur Kühlung einer Batterie
EP0234021B1 (de) Vorrichtung für eine Flüssigkeitskühlung eines elektrischen Bauelementes, insbesondere Halbleiter-Bauelementes
DE102020213849A1 (de) Flüssigkeits-Kühlkörper, insbesondere zur Kühlung von Leistungselektronik-Bauelementen