PL1716624T3 - Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji - Google Patents

Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji

Info

Publication number
PL1716624T3
PL1716624T3 PL05714918T PL05714918T PL1716624T3 PL 1716624 T3 PL1716624 T3 PL 1716624T3 PL 05714918 T PL05714918 T PL 05714918T PL 05714918 T PL05714918 T PL 05714918T PL 1716624 T3 PL1716624 T3 PL 1716624T3
Authority
PL
Poland
Prior art keywords
stacks
plates
production
elements composed
cooler elements
Prior art date
Application number
PL05714918T
Other languages
English (en)
Inventor
Jürgen Schulz-Harder
Original Assignee
Curamik Electronics Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102004012232A external-priority patent/DE102004012232B4/de
Application filed by Curamik Electronics Gmbh filed Critical Curamik Electronics Gmbh
Publication of PL1716624T3 publication Critical patent/PL1716624T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Semiconductor Lasers (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
PL05714918T 2004-02-20 2005-02-02 Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji PL1716624T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004008836 2004-02-20
DE102004012232A DE102004012232B4 (de) 2004-02-20 2004-03-12 Verfahren zum Herstellen von Plattenstapeln, insbesondere zum Herstellen von aus wenigstens einem Plattenstapel bestehenden Kühlern
EP05714918A EP1716624B1 (de) 2004-02-20 2005-02-02 Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen
PCT/DE2005/000163 WO2005081371A2 (de) 2004-02-20 2005-02-02 Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen

Publications (1)

Publication Number Publication Date
PL1716624T3 true PL1716624T3 (pl) 2009-07-31

Family

ID=34888810

Family Applications (1)

Application Number Title Priority Date Filing Date
PL05714918T PL1716624T3 (pl) 2004-02-20 2005-02-02 Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji

Country Status (5)

Country Link
US (1) US8056230B2 (pl)
EP (1) EP1716624B1 (pl)
JP (1) JP4465364B2 (pl)
PL (1) PL1716624T3 (pl)
WO (1) WO2005081371A2 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1672690B2 (de) † 2004-12-20 2024-10-30 IQ evolution GmbH Mikrokühlkörper
JP5183935B2 (ja) * 2007-02-26 2013-04-17 Ｃｋｄ株式会社 流路ブロックの製造方法
JP2008300596A (ja) 2007-05-31 2008-12-11 Sony Corp ヒートシンクおよび半導体レーザ装置
US9194189B2 (en) 2011-09-19 2015-11-24 Baker Hughes Incorporated Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element
DE102013113734B4 (de) 2013-12-10 2018-03-08 Rogers Germany Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102013113736B4 (de) 2013-12-10 2019-11-14 Rogers Germany Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102014106694B3 (de) * 2014-05-13 2015-04-02 Rogers Germany Gmbh Verfahren zur Metallisierung zumindest eines plattenförmigen Keramiksubstrates sowie Metall-Keramik-Substrat
US10000423B1 (en) 2016-03-31 2018-06-19 Ixys, Llc Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier
DE102020104493B4 (de) * 2020-02-20 2022-08-04 Rogers Germany Gmbh Verfahren zur Herstellung eines Kühlelements und Kühlelement hergestellt mit einem solchen Verfahren
KR102624495B1 (ko) 2021-06-25 2024-01-11 포샨 후아즈 어드밴스드 머티리얼즈 컴퍼니 리미티드 마이크로채널 히트싱크 및 이의 제조방법
CN113587692B (zh) * 2021-06-25 2022-06-14 佛山华智新材料有限公司 微通道热沉及其制造方法
CN114284857B (zh) * 2021-11-25 2023-11-17 佛山华智新材料有限公司 次级热沉与液冷热沉集成方法、集成热沉及应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2726681A (en) * 1950-09-18 1955-12-13 Brown Fintube Co Internally finned tube
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3904101A (en) * 1974-10-10 1975-09-09 Gen Electric Method of bonding a sheet cladding to a concave-convex substrate
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5836506A (en) * 1995-04-21 1998-11-17 Sony Corporation Sputter target/backing plate assembly and method of making same
GB9716288D0 (en) * 1997-08-02 1997-10-08 Rolls Laval Heat Exchangers Li Improvements in or relating to heat exchanger manufacture
JP3858484B2 (ja) 1998-11-24 2006-12-13 松下電器産業株式会社 積層式熱交換器
JP3681581B2 (ja) 1999-07-30 2005-08-10 ファナック株式会社 冷却装置とそれを備えた面発光装置
JP2003008273A (ja) 2001-06-25 2003-01-10 Fanuc Ltd 冷却装置及び光源装置
US6737017B2 (en) * 2002-06-14 2004-05-18 General Electric Company Method for preparing metallic alloy articles without melting
EP1555079B1 (de) * 2004-01-12 2008-07-23 Electrovac AG Verfahren zum Herstellen von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen, mit Fügemittel auf Innenflächen der Plattendurchbrüchen oder -öffnungen

Also Published As

Publication number Publication date
EP1716624B1 (de) 2009-01-28
JP2007522942A (ja) 2007-08-16
US8056230B2 (en) 2011-11-15
US20070157469A1 (en) 2007-07-12
WO2005081371A3 (de) 2006-04-13
WO2005081371A2 (de) 2005-09-01
EP1716624A2 (de) 2006-11-02
JP4465364B2 (ja) 2010-05-19

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