PL1716624T3 - Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji - Google Patents
Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcjiInfo
- Publication number
- PL1716624T3 PL1716624T3 PL05714918T PL05714918T PL1716624T3 PL 1716624 T3 PL1716624 T3 PL 1716624T3 PL 05714918 T PL05714918 T PL 05714918T PL 05714918 T PL05714918 T PL 05714918T PL 1716624 T3 PL1716624 T3 PL 1716624T3
- Authority
- PL
- Poland
- Prior art keywords
- stacks
- plates
- production
- elements composed
- cooler elements
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49366—Sheet joined to sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004008836 | 2004-02-20 | ||
DE102004012232A DE102004012232B4 (de) | 2004-02-20 | 2004-03-12 | Verfahren zum Herstellen von Plattenstapeln, insbesondere zum Herstellen von aus wenigstens einem Plattenstapel bestehenden Kühlern |
PCT/DE2005/000163 WO2005081371A2 (de) | 2004-02-20 | 2005-02-02 | Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen |
EP05714918A EP1716624B1 (de) | 2004-02-20 | 2005-02-02 | Verfahren zum herstellen von plattenstapeln, insbesondere von aus plattenstapeln bestehenden kühlern oder kühlerelementen |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1716624T3 true PL1716624T3 (pl) | 2009-07-31 |
Family
ID=34888810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL05714918T PL1716624T3 (pl) | 2004-02-20 | 2005-02-02 | Sposób wytwarzania sekcji płyt, w szczególności chłodnic lub elementów chłodzących sekcji |
Country Status (5)
Country | Link |
---|---|
US (1) | US8056230B2 (pl) |
EP (1) | EP1716624B1 (pl) |
JP (1) | JP4465364B2 (pl) |
PL (1) | PL1716624T3 (pl) |
WO (1) | WO2005081371A2 (pl) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5183935B2 (ja) * | 2007-02-26 | 2013-04-17 | Ckd株式会社 | 流路ブロックの製造方法 |
JP2008300596A (ja) | 2007-05-31 | 2008-12-11 | Sony Corp | ヒートシンクおよび半導体レーザ装置 |
US9194189B2 (en) | 2011-09-19 | 2015-11-24 | Baker Hughes Incorporated | Methods of forming a cutting element for an earth-boring tool, a related cutting element, and an earth-boring tool including such a cutting element |
DE102013113736B4 (de) | 2013-12-10 | 2019-11-14 | Rogers Germany Gmbh | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
DE102013113734B4 (de) | 2013-12-10 | 2018-03-08 | Rogers Germany Gmbh | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
DE102014106694B3 (de) * | 2014-05-13 | 2015-04-02 | Rogers Germany Gmbh | Verfahren zur Metallisierung zumindest eines plattenförmigen Keramiksubstrates sowie Metall-Keramik-Substrat |
US10000423B1 (en) | 2016-03-31 | 2018-06-19 | Ixys, Llc | Direct metal bonding on carbon-covered ceramic contact projections of a ceramic carrier |
DE102020104493B4 (de) * | 2020-02-20 | 2022-08-04 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Kühlelements und Kühlelement hergestellt mit einem solchen Verfahren |
CN113587692B (zh) * | 2021-06-25 | 2022-06-14 | 佛山华智新材料有限公司 | 微通道热沉及其制造方法 |
CN114284857B (zh) * | 2021-11-25 | 2023-11-17 | 佛山华智新材料有限公司 | 次级热沉与液冷热沉集成方法、集成热沉及应用 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2726681A (en) * | 1950-09-18 | 1955-12-13 | Brown Fintube Co | Internally finned tube |
US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
US3904101A (en) * | 1974-10-10 | 1975-09-09 | Gen Electric | Method of bonding a sheet cladding to a concave-convex substrate |
US5727618A (en) * | 1993-08-23 | 1998-03-17 | Sdl Inc | Modular microchannel heat exchanger |
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
GB9716288D0 (en) * | 1997-08-02 | 1997-10-08 | Rolls Laval Heat Exchangers Li | Improvements in or relating to heat exchanger manufacture |
JP3858484B2 (ja) * | 1998-11-24 | 2006-12-13 | 松下電器産業株式会社 | 積層式熱交換器 |
JP3681581B2 (ja) | 1999-07-30 | 2005-08-10 | ファナック株式会社 | 冷却装置とそれを備えた面発光装置 |
JP2003008273A (ja) * | 2001-06-25 | 2003-01-10 | Fanuc Ltd | 冷却装置及び光源装置 |
US6737017B2 (en) * | 2002-06-14 | 2004-05-18 | General Electric Company | Method for preparing metallic alloy articles without melting |
EP1555079B1 (de) * | 2004-01-12 | 2008-07-23 | Electrovac AG | Verfahren zum Herstellen von aus Plattenstapeln bestehenden Kühlern oder Kühlerelementen, mit Fügemittel auf Innenflächen der Plattendurchbrüchen oder -öffnungen |
-
2005
- 2005-02-02 WO PCT/DE2005/000163 patent/WO2005081371A2/de active Application Filing
- 2005-02-02 PL PL05714918T patent/PL1716624T3/pl unknown
- 2005-02-02 US US10/589,698 patent/US8056230B2/en not_active Expired - Fee Related
- 2005-02-02 JP JP2006553423A patent/JP4465364B2/ja not_active Expired - Fee Related
- 2005-02-02 EP EP05714918A patent/EP1716624B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
JP4465364B2 (ja) | 2010-05-19 |
WO2005081371A2 (de) | 2005-09-01 |
WO2005081371A3 (de) | 2006-04-13 |
JP2007522942A (ja) | 2007-08-16 |
EP1716624A2 (de) | 2006-11-02 |
US8056230B2 (en) | 2011-11-15 |
EP1716624B1 (de) | 2009-01-28 |
US20070157469A1 (en) | 2007-07-12 |
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