JPS5228547B2 - - Google Patents
Info
- Publication number
- JPS5228547B2 JPS5228547B2 JP47114643A JP11464372A JPS5228547B2 JP S5228547 B2 JPS5228547 B2 JP S5228547B2 JP 47114643 A JP47114643 A JP 47114643A JP 11464372 A JP11464372 A JP 11464372A JP S5228547 B2 JPS5228547 B2 JP S5228547B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27044872A | 1972-07-10 | 1972-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4938575A JPS4938575A (https=) | 1974-04-10 |
| JPS5228547B2 true JPS5228547B2 (https=) | 1977-07-27 |
Family
ID=23031361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47114643A Expired JPS5228547B2 (https=) | 1972-07-10 | 1972-11-14 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4115837A (https=) |
| JP (1) | JPS5228547B2 (https=) |
| AT (1) | AT356713B (https=) |
| BR (1) | BR7305010D0 (https=) |
| ES (1) | ES417197A1 (https=) |
| IT (1) | IT991087B (https=) |
| NO (1) | NO143441C (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433830Y2 (https=) * | 1974-05-31 | 1979-10-17 | ||
| JPS5213772A (en) * | 1975-07-22 | 1977-02-02 | Kyocera Corp | Ic package |
| JPS5236472A (en) * | 1975-09-17 | 1977-03-19 | Mitsubishi Electric Corp | Semiconductor unit |
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| DE3061383D1 (en) * | 1979-02-19 | 1983-01-27 | Fujitsu Ltd | Semiconductor device and method for manufacturing the same |
| US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
| US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| EP0054069A1 (en) * | 1980-06-19 | 1982-06-23 | Digital Equipment Corporation | Heat pin integrated circuit packaging |
| JPS59139652A (ja) * | 1983-12-02 | 1984-08-10 | Hitachi Ltd | 電子回路装置の実装構造 |
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| DE3567771D1 (en) * | 1984-11-02 | 1989-02-23 | Siemens Ag | Wave resistance-adapted chip support for a microwave semiconductor |
| US4916515A (en) * | 1985-06-03 | 1990-04-10 | Levi Clifford A | Microwave circuit integrating |
| JPS63181399A (ja) * | 1987-01-22 | 1988-07-26 | 日本特殊陶業株式会社 | 高熱伝導性厚膜多層配線基板 |
| US5159750A (en) * | 1989-12-20 | 1992-11-03 | National Semiconductor Corporation | Method of connecting an IC component with another electrical component |
| US5008734A (en) * | 1989-12-20 | 1991-04-16 | National Semiconductor Corporation | Stadium-stepped package for an integrated circuit with air dielectric |
| EP0435155B1 (en) * | 1989-12-29 | 1994-06-01 | Sumitomo Electric Industries, Ltd. | Radiating fin having improved life and thermal conductivity |
| JPH04164361A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 樹脂封止型半導体装置 |
| US5325268A (en) * | 1993-01-28 | 1994-06-28 | National Semiconductor Corporation | Interconnector for a multi-chip module or package |
| KR101243691B1 (ko) * | 2004-10-22 | 2013-03-14 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 열싱크가 향상된 반도체 발광 장치 |
| US20130187286A1 (en) * | 2011-07-25 | 2013-07-25 | Richard Schneider | Lead frameless hermetic circuit package |
| US10374387B2 (en) * | 2017-11-10 | 2019-08-06 | Finisar Corporation | High power cavity package for light emitters |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202925C (https=) * | 1969-04-30 | 1900-01-01 | ||
| US3277957A (en) * | 1964-04-03 | 1966-10-11 | Westinghouse Electric Corp | Heat transfer apparatus for electronic component |
| US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
| JPS5332233B1 (https=) * | 1968-12-25 | 1978-09-07 | ||
| US3634600A (en) * | 1969-07-22 | 1972-01-11 | Ceramic Metal Systems Inc | Ceramic package |
| US3601522A (en) * | 1970-06-18 | 1971-08-24 | American Lava Corp | Composite ceramic package breakaway notch |
-
1972
- 1972-11-14 JP JP47114643A patent/JPS5228547B2/ja not_active Expired
-
1973
- 1973-07-05 BR BR5010/73A patent/BR7305010D0/pt unknown
- 1973-07-05 AT AT594773A patent/AT356713B/de not_active IP Right Cessation
- 1973-07-09 NO NO2813/73A patent/NO143441C/no unknown
- 1973-07-09 IT IT26386/73A patent/IT991087B/it active
- 1973-07-10 ES ES417197A patent/ES417197A1/es not_active Expired
-
1974
- 1974-12-20 US US05/534,853 patent/US4115837A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ATA594773A (de) | 1979-10-15 |
| US4115837A (en) | 1978-09-19 |
| ES417197A1 (es) | 1976-06-01 |
| BR7305010D0 (pt) | 1974-08-22 |
| JPS4938575A (https=) | 1974-04-10 |
| NO143441B (no) | 1980-11-03 |
| NO143441C (no) | 1981-02-11 |
| AT356713B (de) | 1980-05-27 |
| IT991087B (it) | 1975-07-30 |