BR7305010D0 - Involucro para pastilhas de lsi e um processo para fabrica-lo - Google Patents

Involucro para pastilhas de lsi e um processo para fabrica-lo

Info

Publication number
BR7305010D0
BR7305010D0 BR5010/73A BR501073A BR7305010D0 BR 7305010 D0 BR7305010 D0 BR 7305010D0 BR 5010/73 A BR5010/73 A BR 5010/73A BR 501073 A BR501073 A BR 501073A BR 7305010 D0 BR7305010 D0 BR 7305010D0
Authority
BR
Brazil
Prior art keywords
manufacture
lsi package
package insulation
insulation
lsi
Prior art date
Application number
BR5010/73A
Other languages
English (en)
Inventor
R Brall
J Lasio
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Publication of BR7305010D0 publication Critical patent/BR7305010D0/pt

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Making Paper Articles (AREA)
  • Air Bags (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
BR5010/73A 1972-07-10 1973-07-05 Involucro para pastilhas de lsi e um processo para fabrica-lo BR7305010D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27044872A 1972-07-10 1972-07-10

Publications (1)

Publication Number Publication Date
BR7305010D0 true BR7305010D0 (pt) 1974-08-22

Family

ID=23031361

Family Applications (1)

Application Number Title Priority Date Filing Date
BR5010/73A BR7305010D0 (pt) 1972-07-10 1973-07-05 Involucro para pastilhas de lsi e um processo para fabrica-lo

Country Status (7)

Country Link
US (1) US4115837A (pt)
JP (1) JPS5228547B2 (pt)
AT (1) AT356713B (pt)
BR (1) BR7305010D0 (pt)
ES (1) ES417197A1 (pt)
IT (1) IT991087B (pt)
NO (1) NO143441C (pt)

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US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
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US4916515A (en) * 1985-06-03 1990-04-10 Levi Clifford A Microwave circuit integrating
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US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
US5159750A (en) * 1989-12-20 1992-11-03 National Semiconductor Corporation Method of connecting an IC component with another electrical component
DE69009429T2 (de) * 1989-12-29 1994-09-15 Sumitomo Electric Industries Kühlkörper mit verbesserter Lebensdauer und thermischer Leitfähigkeit.
JPH04164361A (ja) * 1990-10-29 1992-06-10 Nec Corp 樹脂封止型半導体装置
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
US7891836B2 (en) * 2004-10-22 2011-02-22 Koninklijke Philips Electronics N.V. Semiconductor light-emitting device with improved heatsinking
WO2013016335A2 (en) * 2011-07-25 2013-01-31 Interplex Industries, Inc. Lead frameless hermetic circuit package
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NO143441B (no) 1980-11-03
ES417197A1 (es) 1976-06-01
JPS4938575A (pt) 1974-04-10
IT991087B (it) 1975-07-30
JPS5228547B2 (pt) 1977-07-27
ATA594773A (de) 1979-10-15
NO143441C (no) 1981-02-11
US4115837A (en) 1978-09-19
AT356713B (de) 1980-05-27

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