NL262292A - - Google Patents
Info
- Publication number
- NL262292A NL262292A NL262292DA NL262292A NL 262292 A NL262292 A NL 262292A NL 262292D A NL262292D A NL 262292DA NL 262292 A NL262292 A NL 262292A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES67967A DE1166383B (de) | 1960-04-08 | 1960-04-08 | Halbleiteranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL262292A true NL262292A (https=) |
Family
ID=7499943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL262292D NL262292A (https=) | 1960-04-08 |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE1166383B (https=) |
| GB (1) | GB914034A (https=) |
| NL (1) | NL262292A (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3408451A (en) * | 1965-09-01 | 1968-10-29 | Texas Instruments Inc | Electrical device package |
| US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
| US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
| US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
| US3800190A (en) * | 1970-11-02 | 1974-03-26 | Bbc Brown Boveri & Cie | Cooling system for power semiconductor devices |
| US4258383A (en) * | 1978-12-22 | 1981-03-24 | Rca Corporation | Minimum pressure drop liquid cooled structure for a semiconductor device |
| US7348665B2 (en) * | 2004-08-13 | 2008-03-25 | Intel Corporation | Liquid metal thermal interface for an integrated circuit device |
| EP4376074A1 (en) * | 2022-11-25 | 2024-05-29 | Infineon Technologies AG | Conductor rail, and power semiconductor module arrangement comprising a conductor rail |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1041600B (de) * | 1956-10-02 | 1958-10-23 | Siemens Ag | In einem metallischen Gehaeuse eingebautes, waermeempfindliches, elektrisches Halbleiterbauelement, wie Leistungstransistor oder Richtleiter |
| DE1030462B (de) * | 1956-11-10 | 1958-05-22 | Bosch Gmbh Robert | Halbleitergleichrichter fuer hohe Stromstaerken |
-
0
- NL NL262292D patent/NL262292A/xx unknown
-
1960
- 1960-04-08 DE DES67967A patent/DE1166383B/de active Pending
-
1961
- 1961-04-10 GB GB12915/61A patent/GB914034A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB914034A (en) | 1962-12-28 |
| DE1166383B (de) | 1964-03-26 |