GB2354116A - Assembly for electrical/electronic components - Google Patents

Assembly for electrical/electronic components Download PDF

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Publication number
GB2354116A
GB2354116A GB9921307A GB9921307A GB2354116A GB 2354116 A GB2354116 A GB 2354116A GB 9921307 A GB9921307 A GB 9921307A GB 9921307 A GB9921307 A GB 9921307A GB 2354116 A GB2354116 A GB 2354116A
Authority
GB
United Kingdom
Prior art keywords
component
electrical
assembly according
assembly
component carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9921307A
Other versions
GB9921307D0 (en
GB2354116B (en
Inventor
Gareth Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Automotive Systems UK Ltd
Original Assignee
Llanelli Radiators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Llanelli Radiators Ltd filed Critical Llanelli Radiators Ltd
Priority to GB9921307A priority Critical patent/GB2354116B/en
Publication of GB9921307D0 publication Critical patent/GB9921307D0/en
Priority to EP00956698A priority patent/EP1254481A2/en
Priority to PCT/GB2000/003348 priority patent/WO2001020674A2/en
Priority to AU68565/00A priority patent/AU6856500A/en
Publication of GB2354116A publication Critical patent/GB2354116A/en
Application granted granted Critical
Publication of GB2354116B publication Critical patent/GB2354116B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An assembly for electrical/electronic components 10 has one or more component carriers 6 arranged to mate with a receiving station 3 provided in a heatsink body 2 and be in thermal communication contact with the heatsink body. Electrical or electronic components 10 are carried by the component carrier and an electrical contact arrangement 11,13 for a respective component/component carrier sub-assembly, is configured for connection to an electric/electronic circuit 14. The circuit 14 may be operable in different modes depending on the nature and/or arrangement of the components 10.

Description

2354116 Assembly for Electrical/Electronic ComT)onents The present
invention relates to an assembly for electrical/electronic components.
Increasingly electronic systems are prevalent in automotive and other products. The need for convenient maintenance and ease of upgradability is critical to maintain continuity of use, and reduce operating costs. Problems with current assemblies and systems exist. For example in the situation of a component installed onto a printed circuit board and fitted with a heatsink, if the component fails, the service engineer has to disassemble the main unit, detach the component from the heatsink and desolder the part from the circuit board. The resultant effect of this could be reduced reliability of the circuit board due to heat damage, damaged conductor tracks, lifted pads, heat stressed electronics etc.
An improved assembly has now been devised.
According to a first aspect, the invention provides an assembly for electrical/electronic components, the assembly comprising:
i) a heatsink body including a plurality of receiving stations; ii) one or more component carriers arranged to mate with a respective receiving station and be in thermal communication contact with the heatsink body; iii) a respective electrical and/or electronic component carried by a respective component carrier; and, iv) an electrical contact arrangement for a respective component/component carrier sub assembly, the electrical contact arrangement configured for connection to an electric/electronic circuit.
Separate receiving stations desirably have substantially uniform receiving configurations, a respective component carrier arranged to mate with a plurality of respective receiving stations. In this way uniformly configured component carriers may be mated with different uniformly configured receiving stations depending upon system requirements. Various different components may also be carried by standard, uniformly configured component carriers permitting different components to be easily interchanged or replaced.
Beneficially, the assembly further comprises an electrical/electronic circuit positioned adjacent the component/component carrier sub assembly arrangement, the electrical contact arrangement of respective component /component carrier sub-assemblies, contacting with the electrical /electronic circuit (preferably when the component carriers are fully mated with respective receiving stations).
The electrical contact between the electrical contact arrangement of respective component/component carrier sub assemblies, and the electrical/electronic circuit is preferably non-soldered/non-fused contact. This provides enhanced ease of replacement/interchangeability of component/component carrier sub-assemblies, and minimises the risk of circuit damage during disassembly and replacement.
The electrical/electronic circuit is preferably configured to be operable in different operational set-up configurations, desirably depending upon:
i) the nature of the electrical/electronic component or components comprising the assembly; and/or ii) the placement configuration of component/ component carrier sub-assemblies in respective receiving stations of the heatsink body.
Beneficially, in a first set-up operational configuration, one or more portions of the circuit are operationally redundant and in a second set-up operational configuration other portions of the circuit operationally are redundant.
This facility enables a single master circuit to be used for a number of different operational requirements. The use to which the circuit can be put depends upon the components used in the component/ component carrier sub assembly, and the placement configuration in the receiving stations of the heatsink body.
The receiving stations are preferably provided in a row along the heatsink body.
The component carriers are desirably arranged to be a push or slide fit with a respective receiving station.
Preferably, the receiving stations comprise a recess, slot or channel within which the respective component carriers are received. In a preferred embodiment, the receiving stations comprise respective seats within which the respective component carriers are seated.
Beneficially, the component carriers may be mated with and is retracted from respective receiving stations in common mating and retraction directions. Preferably, when mated with respective receiving stations, respective component carriers are accessible from a common access side of the heatsink body for removal (retraction) and replacement.
Such an arrangement provides enhanced access to components for replacement or inspection.
The component carrier and respective receiving station preferably include respective complementary engaging receiving formations arranged to enhance retention of the component carrier with the receiving station when the component carrier is mated with the receiving station. A sliding tongue and groove configuration is suitable for this purpose.
The component carrier preferably includes an internal cavity for receiving the electrical/electronic component.
The component carrier beneficially includes a highly heat conductive heat transfer surface arranged to dissipate heat from the component to the heat sink body. The heat conductive heat transfer surface of the component carrier is preferably substantially planar.
The heatsink body beneficially includes heat dissipation means arranged to enhance heat dissipation from the heatsink body to atmosphere. The heat dissipation means preferably comprises a heat dissipation zone of greater atmosphere contacting surface area per unit volume of the heatsink than other areas. The heat dissipation means desirably includes heat dissipation formations such as fins louvres or the like.
In a preferred embodiment the receiving stations are provided in a row along the heatsink body, the heat dissipation means comprising a heat dissipation zone extending adjacent the row of receiving stations.
The heatsink body preferably comprises a monolithic body (preferably metallic) of heat conductive material.
0 An important aspect of the invention is also the facility for a 'standard' circuit to be utilised to perform different output functions dependant upon the assembly design. Accordingly, a further aspect of the invention provides an assembly for electrical/electronic components, the assembly comprising:
i) a retainer body including a plurality of receiving stations; ii) one or more component carriers arranged to mate 5 with a respective receiving station; iii) a respective electrical and/or electronic component carried by a respective component carrier; iv) an electrical contact arrangement for a respective component/component carrier subassembly; V) an electrical/electronic circuit positioned adjacent the component/component carrier sub assembly arrangement, the electrical contact arrangement of respective component/component carrier sub-assemblies contacting with the electrical/electronic circuit, the electrical electronic circuit being configured to be operable in different operational modes depending upon:
i) the nature of the electrical/electronic component or components comprising the assembly; and/or ii) the placement configuration of component/ component carrier sub assemblies in respective receiving stations of the heatsink body, wherein in a first operational configuration, certain portions of the circuit are operationally redundant and in an alternative operational configuration other conductive tracks of the circuit are redundant.
The invention will now be further described in a specific embodiment, by way of example only, and with reference to the accompanying drawings, in which:
Figure 1 is a perspective view of an exemplary embodiment of an assembly according to the invention in an un assembled condition; Figure 2 is a perspective view of the assembly of figure 1, partially assembled; Figure 3 is a schematic sectioned view of a component/component carrier sub-assembly; and, Figure 4 is a schematic sectioned view of an alternative embodiment of component/component carrier sub-assembly.
Referring to the drawings, an exemplary assembly 1 according to the invention includes a main heatsink body 2, of cast or extruded metal profile including a row of seating recesses 3 each arranged to receive a corresponding respective mini-heatsink component carrier 4 (as will be described in detail below).
Adjacent the row of seating recesses 3 there is formed a heat dissipation zone comprising an array of spaced fins 5.
The respective mini-heatsink component carriers 4 include a thermally conductive heat transfer surface 6 which, in use, thermally abuts the rear wall of respective seating recesses 3.
Marginal tongue portions 7 of the component carrier 4 are shaped and dimensioned to be a sliding fit in complementary marginal groove portions 8 adjacent the rear wall of the respective seating recess 3. The component carriers 4 are introduced to be matingly received in the seating recesses 3 by means of sliding engagement (in the direction of arrow A in Figure 2). The tongue 7 and groove 8 arrangement serves to aid retention of the component carrier 4 within the respective seating recess 3.
As will be readily appreciated from the drawings, the respective component carriers 4 are of uniform, standard, configuration (and therefore interchangeable) and arranged to be received in the complimentary standard configuration seating recesses 3 provided on the main heatsink body 2.
Referring now to Figures 3 and 4, there are shown alternative arrangements of electronic component within respective internal cavities 9 of the standard, uniform configuration component carriers 4. In the embodiment shown in Figure 3, the electronic component 10 is connected to a two-pin terminal arrangement 11 provided for the component 10/component carrier 4 sub-assembly. The two-pin terminal arrangement 11 supported on terminal carrier 12 is arranged (when the component carrier 4 is mated within the respective seating recess 3) to contact respective circuit contacts 13 provided on an electrical /electronic circuit mounted directly below the row of recesses 3. In this way, the electrical/electronic circuit 14 operationally includes the component 10 carried by component carrier 4 (when the component carrier 4 is fully mated within the seating recess 3). A lip 15 (provided with a screw through bore) locates within corresponding receiving recess provided for each seating recess 3 on the upper surface 16 of heatsink body 2 to ensure accurate seating and location. A fixing screw 17 is provided to ensure secure location; the fixing screw is easily removable for permitting selective removal of the component carrier 4 for replacement, component inspection or the like.
An important feature of the arrangement is that good contact between the terminals 11 of the terminal carrier 12 and the terminals 13 is ensured, without the need for soldering. This ensures that soldered links are not required to be created when introducing components, nor is there a requirement to break soldered links when replacing or inspecting components.
Referring to the component carrier 4/component 20 sub assembly shown in Figure 4, the recess 9 receives and locates an integrated circuit semiconductor component 20.
A multi-pin terminal array 11 is provided for the terminal carrier element 12, and the required connections are included between the input/output to the integrated circuit and the terminal array 11. The terminal array 11 is configured to contact with the corresponding multi contact array 13 on the underlying circuit board 14.
In both embodiments shown, heat is conducted from the component 10/20 to the heat transfer wall 6 for subsequent dissipation to the main heatsink 2 and ultimately, dissipation to the atmosphere via heat transfer fins 5.
The invention provides the possibility of interchangeable, modular component carrying units 4 to be used to "buildup" a modular circuit having the desired/required characteristics for predetermined function performance.
The underlying circuit board 14 may be provided with a is multi-purpose circuit or link track (including a number of different connection terminal arrays 13). Certain portions of the track may be redundant for certain applications, in which case no component /component carrier sub-assembly (or a sub-assembly with dummy contacts) will be provided to contact with the relevant connection terminal arrays 13.
Other portions of the circuit will be active and respective terminal arrays 13 in active portions of the circuit will be contacted by terminals 11 connecting with active components 10/20 carried by respective component carriers 4 positioned in the seating recesses 3 of the main heatsink body 2.
In view of the modularity of the system with commonality of configuration of the component carriers 4 and seating recesses 3, the system is extremely flexible in terms of adaptability of use, and also provides ease of component removal from the main heatsink body 2 for inspection and/or replacement.
Specific advantages of the invention are as follows:
s i) The assembly may be used with any semiconductor or other component to reduce maintenance and service time of electronic equipment where heatsinks are present.
ii) The assembly eliminates the need to solder the semiconductor or other component directly to a main circuit board.
is iii) The assembly can be used to insert various customised circuits into a system withoutthe need to re-engineer the main circuit board.
iv) The use of a modular assembly permits a number of miniature heatsinks to be located on one main heatsink.
V) The assembly is able particularly suited for use in confined spaces, since the only limiting factor for undertaking maintenance is being able to see the top of the required miniature heatsink. This gives the benefit, that the main unit will not have to be removed from its installation position for maintenance, repair or the like.
vi) over the life of the product, the assembly offers a potential cost saving.
vii) The assembly offers improved product quality as the main unit will not require dismantling.
The invention is particularly suited for implementation in electrical/electronic systems for automotive use where space is at a premium (within the engine compartment/dash area) and also the interchangeability of components can be useful where different performance characteristics are required for different models of vehicle and the like. The arrangement of heat transfer to the heatsink is also important in vehicle applications where heat shielding of electronic components is important because of the high level of heat energy produced within the vehicle engine compartment.

Claims (1)

  1. Claims:
    1. An assembly for electrical/electronic components, the assembly comprising:
    i) a heatsink body including a plurality of receiving stations; one or more component carriers arranged to mate with a respective receiving station and be in thermal communication contact with the heatsink body; iii) a respective electrical and/or electronic component carried by a respective component carrier; and, iv) an electrical contact arrangement for a respective component/component carrier sub assembly, the electrical contact arrangement configured for connection to an electric/electronic circuit.
    2. An assembly according to claim 1, wherein separate receiving stations have substantially uniform receiving configurations, a respective component carrier being arranged to mate with a plurality of respective receiving stations.
    3. An assembly according to claim 1 or claim 2 further comprising an electrical /electronic circuit positioned adjacent the component /component carrier sub assembly arrangement, the electrical contact arrangement of respective component/component carrier sub-assemblies, contacting with the electrical/electronic circuit.
    4. An assembly according to claim 3, wherein the electrical contact arrangement of respective component/component carrier sub-assemblies, contact with the electrical/electronic circuit when the component carriers are fully mated with respective receiving stations.
    S. An assembly according to claim 3 or claim 4, wherein the electrical contact between the electrical contact arrangement of respective component/component carrier sub-assemblies, and the electrical/electronic circuit is non-soldered/non-fused contact.
    6. An assembly according to any of claims 3 to 5, wherein the electrical electronic circuit is configured to be operable in different operational modes depending upon:
    i) the nature of the electrical /electronic component or components comprising the assembly; and/or ii) the placement configuration of component/ component carrier sub assemblies in respective receiving stations of the heatsink body.
    7. An assembly according to claim 6, wherein in a first set-up operational configuration, one or more portions of the circuit are operationally redundant and in a second set-up operational configuration other portions of the circuit operationally are redundant.
    8. An assembly according to any preceding claim, wherein the receiving stations are provided in a row along the heatsink body.
    9. An assembly according to any preceding claim, wherein the component carriers are arranged to be a push or slide fit with a respective receiving station.
    10. An assembly according to any preceding claim, wherein the receiving stations comprise a recess, slot or channel within which the respective component carriers are received.
    11. An assembly according to any preceding claim, wherein the receiving stations comprise respective seats within which the respective component carriers are seated.
    12. An assembly according to any preceding claim, wherein the component carriers are mated with and retracted from respective receiving stations in common mating and retraction directions.
    13. An assembly according to claim 12, wherein when mated with respective receiving stations, respective component carriers are accessible from a common access side of the heatsink body.
    14. An assembly according to any preceding claim, wherein the component carrier and respective receiving station include respective complementary engaging receiving formations arranged to enhance retention of the component carrier with the receiving station when the component carrier is mated with the receiving station.
    is. An assembly according to any preceding claim, wherein securing means is provided arranged to secure respective receiving stations and component carriers when fully mated.
    is 16. An assembly according to claim 15 wherein the securing means comprises a mechanical fixing.
    17. An assembly according to any preceding claim wherein the component carrier includes an internal cavity for receiving the electrical/electronic component.
    18. An assembly according to any preceding claim, wherein the component carrier includes a heat conductive heat transfer surface arranged to dissipate heat from the component to the heat sink body.
    19. An assembly according to claim 18, wherein the heat conductive heat transfer surface of the component carrier is substantially planar.
    20. An assembly according to any preceding claim, wherein the heatsink body includes heat dissipation means arranged to enhance heat dissipation from the heatsink body to atmosphere.
    21. An assembly according to claim 20, wherein the heat dissipation means comprises a heat dissipation zone of greater atmosphere contacting surface area per unit volume of the heatsink than other areas.
    22. An assembly according to claim 20 or 21, wherein the heat dissipation means includes heat dissipation formations such as fins louvres or the like.
    23. An assembly according to any of claims 20to 22, wherein the receiving stations are provided in a row along the heatsink body, the heat dissipation means comprises a heat dissipation zone extending adjacent the row of receiving stations.
    24. An assembly according to any preceding claim, wherein the heatsink body comprises a monolithic body of heat conductive material.
    25.' An assembly according to any preceding claim, wherein the heatsink body comprises a metallic material.
    26. An assembly for electrical/electronic components, the assembly comprising:
    i) a retainer body including a plurality of receiving stations; ii) one or more component carriers arranged to mate with a respective receiving station; iii) a respective electrical and/or electronic component carried by a respective component carrier; iv) an electrical contact arrangement for a respective component/component carrier sub assembly; V) an electrical/electronic circuit positioned adjacent the component /component carrier sub assembly arrangement, the electrical contact arrangement of respective component/component carrier sub-assemblies contacting with the electrical/electronic circuit, the electrical electronic circuit being configured to be operable in different operational modes depending upon:
    i) the nature of the electrical/electronic component or components comprising the assembly; and/or ii) the placement configuration of component/ component carrier sub assemblies in respective receiving stations of the heatsink body, wherein in a first operational configuration, certain portions of the circuit are operationally redundant and in an alternative operational configuration other conductive tracks of the circuit are redundant.
    27. An assembly substantially as herein described with reference to the accompanying drawings.
GB9921307A 1999-09-10 1999-09-10 Assembly for electrical/electronic components Expired - Lifetime GB2354116B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9921307A GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components
EP00956698A EP1254481A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components
PCT/GB2000/003348 WO2001020674A2 (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components
AU68565/00A AU6856500A (en) 1999-09-10 2000-08-31 Assembly for electrical/electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9921307A GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components

Publications (3)

Publication Number Publication Date
GB9921307D0 GB9921307D0 (en) 1999-11-10
GB2354116A true GB2354116A (en) 2001-03-14
GB2354116B GB2354116B (en) 2003-12-03

Family

ID=10860626

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9921307A Expired - Lifetime GB2354116B (en) 1999-09-10 1999-09-10 Assembly for electrical/electronic components

Country Status (4)

Country Link
EP (1) EP1254481A2 (en)
AU (1) AU6856500A (en)
GB (1) GB2354116B (en)
WO (1) WO2001020674A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244791B4 (en) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Device for cooling electronic components
DE102016212289A1 (en) 2016-07-06 2018-01-11 Conti Temic Microelectronic Gmbh Power electronics arrangement

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156434A (en) * 1967-03-20 1969-06-25 Ibm Electronic Circuit Assembly
GB1343868A (en) * 1971-05-05 1974-01-16 Soncini G Apparatus for the construction of electric circuits
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
EP0124029A2 (en) * 1983-04-29 1984-11-07 Siemens Aktiengesellschaft Well-coolable modular circuit carrying an electrical component
US4764847A (en) * 1985-12-04 1988-08-16 Vdo Adolf Schindling Ag Support plate for electronic components
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5179503A (en) * 1991-04-19 1993-01-12 United Technologies Automotive, Inc. Modular automobile power distribution box

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Publication number Priority date Publication date Assignee Title
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
EP0079238B1 (en) * 1981-11-10 1988-04-06 Fujitsu Limited Semiconductor devices provided with heat-dissipating means
US5018050A (en) * 1987-11-17 1991-05-21 Omron Tateisi Electronics Co. Solid state relay
US5463530A (en) * 1993-02-05 1995-10-31 The Bergquist Company Dual sided laminated semiconductor mounting
US5598322A (en) * 1994-09-27 1997-01-28 Watlow Winona, Inc. Power control system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156434A (en) * 1967-03-20 1969-06-25 Ibm Electronic Circuit Assembly
GB1343868A (en) * 1971-05-05 1974-01-16 Soncini G Apparatus for the construction of electric circuits
US3909679A (en) * 1974-11-07 1975-09-30 Rock Ola Mfg Corp Cabinet and heat sink for amplifier components
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
EP0124029A2 (en) * 1983-04-29 1984-11-07 Siemens Aktiengesellschaft Well-coolable modular circuit carrying an electrical component
US4764847A (en) * 1985-12-04 1988-08-16 Vdo Adolf Schindling Ag Support plate for electronic components
US4872102A (en) * 1986-04-28 1989-10-03 Dimensions Unlimited, Inc. D.C. to A.C. inverter having improved structure providing improved thermal dissipation
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US5179503A (en) * 1991-04-19 1993-01-12 United Technologies Automotive, Inc. Modular automobile power distribution box

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10244791B4 (en) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Device for cooling electronic components
DE102016212289A1 (en) 2016-07-06 2018-01-11 Conti Temic Microelectronic Gmbh Power electronics arrangement
DE102016212289B4 (en) 2016-07-06 2018-08-02 Conti Temic Microelectronic Gmbh Power electronics assembly with extruded cooling and protection element

Also Published As

Publication number Publication date
GB9921307D0 (en) 1999-11-10
GB2354116B (en) 2003-12-03
EP1254481A2 (en) 2002-11-06
WO2001020674A3 (en) 2001-09-27
AU6856500A (en) 2001-04-17
WO2001020674A2 (en) 2001-03-22

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PE20 Patent expired after termination of 20 years

Expiry date: 20190909