GB1103067A - The division of semiconductor wafers into wafers of smaller face area - Google Patents

The division of semiconductor wafers into wafers of smaller face area

Info

Publication number
GB1103067A
GB1103067A GB34048/66A GB3404866A GB1103067A GB 1103067 A GB1103067 A GB 1103067A GB 34048/66 A GB34048/66 A GB 34048/66A GB 3404866 A GB3404866 A GB 3404866A GB 1103067 A GB1103067 A GB 1103067A
Authority
GB
United Kingdom
Prior art keywords
wafer
tools
holder
wafers
scoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34048/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1103067A publication Critical patent/GB1103067A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
GB34048/66A 1965-07-28 1966-07-28 The division of semiconductor wafers into wafers of smaller face area Expired GB1103067A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0098475 1965-07-28

Publications (1)

Publication Number Publication Date
GB1103067A true GB1103067A (en) 1968-02-14

Family

ID=7521497

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34048/66A Expired GB1103067A (en) 1965-07-28 1966-07-28 The division of semiconductor wafers into wafers of smaller face area

Country Status (3)

Country Link
BE (1) BE684563A (cg-RX-API-DMAC10.html)
GB (1) GB1103067A (cg-RX-API-DMAC10.html)
NL (1) NL6610661A (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
BE684563A (cg-RX-API-DMAC10.html) 1967-01-03
NL6610661A (cg-RX-API-DMAC10.html) 1967-01-30

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