Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
  • H10P72/04—Apparatus for manufacture or treatment
  • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
  • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Dicing (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=7521497

Family Applications (1)

Country Status (3)

• 1966
  • 1966-07-25 BE BE684563D patent/BE684563A/xx unknown
  • 1966-07-28 NL NL6610661A patent/NL6610661A/xx unknown
  • 1966-07-28 GB GB34048/66A patent/GB1103067A/en not_active Expired

Also Published As

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