GB1017779A - Improvements in or relating to methods of producing metallised apertures in printed-wiring boards - Google Patents

Improvements in or relating to methods of producing metallised apertures in printed-wiring boards

Info

Publication number
GB1017779A
GB1017779A GB33491/62A GB3349162A GB1017779A GB 1017779 A GB1017779 A GB 1017779A GB 33491/62 A GB33491/62 A GB 33491/62A GB 3349162 A GB3349162 A GB 3349162A GB 1017779 A GB1017779 A GB 1017779A
Authority
GB
United Kingdom
Prior art keywords
board
apertures
mask
printed
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB33491/62A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1017779A publication Critical patent/GB1017779A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB33491/62A 1961-09-05 1962-08-31 Improvements in or relating to methods of producing metallised apertures in printed-wiring boards Expired GB1017779A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL268976 1961-09-05

Publications (1)

Publication Number Publication Date
GB1017779A true GB1017779A (en) 1966-01-19

Family

ID=19753267

Family Applications (1)

Application Number Title Priority Date Filing Date
GB33491/62A Expired GB1017779A (en) 1961-09-05 1962-08-31 Improvements in or relating to methods of producing metallised apertures in printed-wiring boards

Country Status (4)

Country Link
US (1) US3261769A (enExample)
ES (1) ES280505A1 (enExample)
GB (1) GB1017779A (enExample)
NL (2) NL125517C (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2237580A (en) * 1989-11-03 1991-05-08 Marconi Gec Ltd A method for plating a hole and adjacent surface portion of a printed circuit board
CN103231583A (zh) * 2013-04-24 2013-08-07 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用定位撑脚
CN103240959A (zh) * 2013-04-23 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑销
CN103240960A (zh) * 2013-04-24 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑脚

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3340607A (en) * 1964-11-12 1967-09-12 Melpar Inc Multilayer printed circuits
US3396459A (en) * 1964-11-25 1968-08-13 Gen Dynamics Corp Method of fabricating electrical connectors
US3429036A (en) * 1965-04-08 1969-02-25 Gen Dynamics Corp Method of manufacturing electrical connectors
US3429038A (en) * 1966-08-01 1969-02-25 Gen Dynamics Corp Method of manufacturing electrical intraconnectors
US3429037A (en) * 1966-08-01 1969-02-25 Gen Dynamics Corp Method of making tubular solder connectors
US3431641A (en) * 1966-08-01 1969-03-11 Gen Dynamics Corp Method of manufacturing electrical connectors
US3429786A (en) * 1966-10-21 1969-02-25 Gen Dynamics Corp Controlled electroplating process
US3462832A (en) * 1966-10-24 1969-08-26 Gen Dynamics Corp Process for fabricating high density multilayer electrical interconnections
US4911796A (en) * 1985-04-16 1990-03-27 Protocad, Inc. Plated through-holes in a printed circuit board
CN104213170A (zh) * 2014-09-16 2014-12-17 四川海英电子科技有限公司 高阶高密度电路板镀铜方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA598722A (en) * 1960-05-24 H. Scheer Frederick Plating in holes
GB840544A (en) * 1955-08-11 1960-07-06 Telefunken Gmbh Improvements in or relating to methods of forming conducting elements on insulating supports
US3071521A (en) * 1959-07-21 1963-01-01 Burrougbs Corp Method and apparatus for electrolytic treatment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2237580A (en) * 1989-11-03 1991-05-08 Marconi Gec Ltd A method for plating a hole and adjacent surface portion of a printed circuit board
CN103240959A (zh) * 2013-04-23 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑销
CN103231583A (zh) * 2013-04-24 2013-08-07 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用定位撑脚
CN103240960A (zh) * 2013-04-24 2013-08-14 昆山翰辉电子科技有限公司 印刷电路板油墨印刷用防粘黏定位支撑脚

Also Published As

Publication number Publication date
NL125517C (enExample)
ES280505A1 (es) 1963-03-01
NL268976A (enExample)
US3261769A (en) 1966-07-19

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