GB840544A - Improvements in or relating to methods of forming conducting elements on insulating supports - Google Patents

Improvements in or relating to methods of forming conducting elements on insulating supports

Info

Publication number
GB840544A
GB840544A GB24402/56A GB2440256A GB840544A GB 840544 A GB840544 A GB 840544A GB 24402/56 A GB24402/56 A GB 24402/56A GB 2440256 A GB2440256 A GB 2440256A GB 840544 A GB840544 A GB 840544A
Authority
GB
United Kingdom
Prior art keywords
raised portions
pattern
areas
conducting layer
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24402/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken AG
Original Assignee
Telefunken AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken AG filed Critical Telefunken AG
Publication of GB840544A publication Critical patent/GB840544A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks

Abstract

840,544. Forming printed circuits by etching or electrodeposition. TELEFUNKEN G.m.b.H. Aug. 9, 1956 [Aug. 11, 1955], No. 24402/56. Class 41. [Also in Group XVI] In a method of forming conducting elements on an insulating support the support is provided with a conducting layer thereon, a member having a pattern of raised portions on the operating face thereof is pressed against the conducting layer, and an etching fluid or electrolyte is introduced between the raised portions. In one embodiment the fluid is such that the areas of the conducting layer intermediate between the raised portions are removed whilst the areas of the conducting layer in contact with the raised portions are not removed, whereby a pattern of conducting elements corresponding to the pattern of raised portions remains on the insulating support. The member is provided with raised portions 2, 3, 4, 5, Fig. 1, corresponding to the circuit pattern of a printed circuit panel it is desired to produce, and the fluid is introduced into the space between the raised portions through a channel 7. Outlet channels 8 and 9 for fluid are provided. The member may comprise a base portion 10 of rubber and an upper portion 11 of synthetic material. In an alternative embodiment the raised portions on the member correspond to the areas intermediate the desired pattern and an electrolyte is introduced between the raised portions capable of depositing a conductive layer in the areas of the desired pattern. After removal of the member the conducting layer in the intermediate areas is removed.
GB24402/56A 1955-08-11 1956-08-09 Improvements in or relating to methods of forming conducting elements on insulating supports Expired GB840544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE840544X 1955-08-11

Publications (1)

Publication Number Publication Date
GB840544A true GB840544A (en) 1960-07-06

Family

ID=6763902

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24402/56A Expired GB840544A (en) 1955-08-11 1956-08-09 Improvements in or relating to methods of forming conducting elements on insulating supports

Country Status (1)

Country Link
GB (1) GB840544A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261769A (en) * 1961-09-05 1966-07-19 Philips Corp Method of forming metallic liners by electrodeposition in apertured printed circuit boards
US3409521A (en) * 1965-04-22 1968-11-05 Pennsalt Chemicals Corp Method of manufacturing centrifuge discs by electrochemical machining
US4014773A (en) * 1974-07-31 1977-03-29 Daiichi Denshi Kogyo Kabushiki Kaisha Apparatus for electrolytic treatment
US4358349A (en) 1979-05-24 1982-11-09 Matsushita Electric Works, Ltd. Method of forming electrical wiring path on insulative substrate
US5032234A (en) * 1988-12-20 1991-07-16 Minolta Camera Kabushiki Kaisha Process for plating a printed circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3261769A (en) * 1961-09-05 1966-07-19 Philips Corp Method of forming metallic liners by electrodeposition in apertured printed circuit boards
US3409521A (en) * 1965-04-22 1968-11-05 Pennsalt Chemicals Corp Method of manufacturing centrifuge discs by electrochemical machining
US4014773A (en) * 1974-07-31 1977-03-29 Daiichi Denshi Kogyo Kabushiki Kaisha Apparatus for electrolytic treatment
US4358349A (en) 1979-05-24 1982-11-09 Matsushita Electric Works, Ltd. Method of forming electrical wiring path on insulative substrate
US5032234A (en) * 1988-12-20 1991-07-16 Minolta Camera Kabushiki Kaisha Process for plating a printed circuit board

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