FR3123076B1 - Electrolyte et procédé d'électrodéposition de cuivre et de graphène - Google Patents

Electrolyte et procédé d'électrodéposition de cuivre et de graphène Download PDF

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Publication number
FR3123076B1
FR3123076B1 FR2105208A FR2105208A FR3123076B1 FR 3123076 B1 FR3123076 B1 FR 3123076B1 FR 2105208 A FR2105208 A FR 2105208A FR 2105208 A FR2105208 A FR 2105208A FR 3123076 B1 FR3123076 B1 FR 3123076B1
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FR
France
Prior art keywords
graphene
electrolyte
copper
electrodeposition
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2105208A
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English (en)
Other versions
FR3123076A1 (fr
Inventor
Vincent Mevellec
Céline Pascale Doussot
Louis Caillard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aveni SA
Original Assignee
Aveni SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aveni SA filed Critical Aveni SA
Priority to FR2105208A priority Critical patent/FR3123076B1/fr
Priority to TW111118623A priority patent/TW202307279A/zh
Priority to PCT/EP2022/063623 priority patent/WO2022243462A1/fr
Publication of FR3123076A1 publication Critical patent/FR3123076A1/fr
Application granted granted Critical
Publication of FR3123076B1 publication Critical patent/FR3123076B1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Electrolyte et procédé d'électrodéposition de cuivre et de graphène La présente invention a pour objet une composition d’électrolyte pour le dépôt de cuivre dopé au graphène sur des substrats semi-conducteurs. Cet électrolyte a un pH de 7,0 à 11,0, et comprend des ions cuivre en une concentration allant de 0.1 mM à 2000 mM, au moins une amine présente en une concentration comprise entre 0.5 mM et 5000 mM, de 0,1 g/L à 10 g/L de graphène ou d’oxyde de graphène, et un solvant.
FR2105208A 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène Active FR3123076B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR2105208A FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène
TW111118623A TW202307279A (zh) 2021-05-19 2022-05-19 用於銅跟石墨烯電沉積之電解質及方法
PCT/EP2022/063623 WO2022243462A1 (fr) 2021-05-19 2022-05-19 Électrolyte et procédé d'électrodéposition de cuivre et de graphène

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2105208 2021-05-19
FR2105208A FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène

Publications (2)

Publication Number Publication Date
FR3123076A1 FR3123076A1 (fr) 2022-11-25
FR3123076B1 true FR3123076B1 (fr) 2023-10-27

Family

ID=77821810

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2105208A Active FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène

Country Status (3)

Country Link
FR (1) FR3123076B1 (fr)
TW (1) TW202307279A (fr)
WO (1) WO2022243462A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2890983B1 (fr) 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
US8895651B2 (en) * 2010-02-16 2014-11-25 Basf Se Composition for printing a seed layer and process for producing conductor tracks
WO2012015013A1 (fr) 2010-07-29 2012-02-02 旭化成株式会社 Dispositif de réception de télévision, et dispositif de source lumineuse de surface
CN105483764B (zh) * 2015-12-04 2019-02-22 广东嘉元科技股份有限公司 一种电解铜箔添加剂
KR102622683B1 (ko) * 2015-12-15 2024-01-10 솔브레인 주식회사 구리 도금용 조성물 및 이를 이용한 구리 배선의 형성 방법
CN110629259B (zh) * 2019-11-04 2021-08-10 惠州市荣安达化工有限公司 一种含有石墨烯的pcb铜复合电镀液
CN111394756A (zh) * 2020-01-22 2020-07-10 全球能源互联网研究院有限公司 一种电接触材料的复合镀层及其制备方法

Also Published As

Publication number Publication date
WO2022243462A1 (fr) 2022-11-24
FR3123076A1 (fr) 2022-11-25
TW202307279A (zh) 2023-02-16

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