FR3123076B1 - Electrolyte et procédé d'électrodéposition de cuivre et de graphène - Google Patents

Electrolyte et procédé d'électrodéposition de cuivre et de graphène Download PDF

Info

Publication number
FR3123076B1
FR3123076B1 FR2105208A FR2105208A FR3123076B1 FR 3123076 B1 FR3123076 B1 FR 3123076B1 FR 2105208 A FR2105208 A FR 2105208A FR 2105208 A FR2105208 A FR 2105208A FR 3123076 B1 FR3123076 B1 FR 3123076B1
Authority
FR
France
Prior art keywords
graphene
electrolyte
copper
electrodeposition
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2105208A
Other languages
English (en)
Other versions
FR3123076A1 (fr
Inventor
Vincent Mevellec
Céline Pascale Doussot
Louis Caillard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aveni SA
Original Assignee
Aveni SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aveni SA filed Critical Aveni SA
Priority to FR2105208A priority Critical patent/FR3123076B1/fr
Priority to TW111118623A priority patent/TW202307279A/zh
Priority to PCT/EP2022/063623 priority patent/WO2022243462A1/fr
Publication of FR3123076A1 publication Critical patent/FR3123076A1/fr
Application granted granted Critical
Publication of FR3123076B1 publication Critical patent/FR3123076B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Electrolyte et procédé d'électrodéposition de cuivre et de graphène La présente invention a pour objet une composition d’électrolyte pour le dépôt de cuivre dopé au graphène sur des substrats semi-conducteurs. Cet électrolyte a un pH de 7,0 à 11,0, et comprend des ions cuivre en une concentration allant de 0.1 mM à 2000 mM, au moins une amine présente en une concentration comprise entre 0.5 mM et 5000 mM, de 0,1 g/L à 10 g/L de graphène ou d’oxyde de graphène, et un solvant.
FR2105208A 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène Active FR3123076B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR2105208A FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène
TW111118623A TW202307279A (zh) 2021-05-19 2022-05-19 用於銅跟石墨烯電沉積之電解質及方法
PCT/EP2022/063623 WO2022243462A1 (fr) 2021-05-19 2022-05-19 Électrolyte et procédé d'électrodéposition de cuivre et de graphène

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2105208 2021-05-19
FR2105208A FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène

Publications (2)

Publication Number Publication Date
FR3123076A1 FR3123076A1 (fr) 2022-11-25
FR3123076B1 true FR3123076B1 (fr) 2023-10-27

Family

ID=77821810

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2105208A Active FR3123076B1 (fr) 2021-05-19 2021-05-19 Electrolyte et procédé d'électrodéposition de cuivre et de graphène

Country Status (3)

Country Link
FR (1) FR3123076B1 (fr)
TW (1) TW202307279A (fr)
WO (1) WO2022243462A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2890983B1 (fr) 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
US8895651B2 (en) * 2010-02-16 2014-11-25 Basf Se Composition for printing a seed layer and process for producing conductor tracks
JP5062603B2 (ja) 2010-07-29 2012-10-31 旭化成株式会社 テレビ受信装置及び面光源装置
CN105483764B (zh) * 2015-12-04 2019-02-22 广东嘉元科技股份有限公司 一种电解铜箔添加剂
KR102622683B1 (ko) * 2015-12-15 2024-01-10 솔브레인 주식회사 구리 도금용 조성물 및 이를 이용한 구리 배선의 형성 방법
CN110629259B (zh) * 2019-11-04 2021-08-10 惠州市荣安达化工有限公司 一种含有石墨烯的pcb铜复合电镀液
CN111394756A (zh) * 2020-01-22 2020-07-10 全球能源互联网研究院有限公司 一种电接触材料的复合镀层及其制备方法

Also Published As

Publication number Publication date
TW202307279A (zh) 2023-02-16
FR3123076A1 (fr) 2022-11-25
WO2022243462A1 (fr) 2022-11-24

Similar Documents

Publication Publication Date Title
CN101319318B (zh) 无电镀金浴、无电镀金方法及电子部件
TW200642081A (en) Thin film transistor and process thereof
AR064338A1 (es) Un metodo para recubrir un sustrato metalico y sustrato metalico recubierto obtenido
TW200741870A (en) Method and compositions for direct copper plating and filling to form interconnects in the fabrication of semiconductor devices
TW200916591A (en) Steel for mechanical structure excelling in machinability and process for producing the same
US20200392637A1 (en) Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy
TW200715380A (en) Process for lateral disjonting of a semiconductor wafer and opto-electronic element
TW200730669A (en) Electroplating composition intended for coating a surface of a substrate with a metal
RU2371516C2 (ru) Гидроксисульфатная обработка поверхности
EP3359710B1 (fr) Procédé de dépôt d'indium ou d'alliage d'indium
KR102579984B1 (ko) 전기 구리 도금욕 및 전기 구리 도금 피막
FR3123076B1 (fr) Electrolyte et procédé d'électrodéposition de cuivre et de graphène
JP2006322037A (ja) 金めっき液
TW374227B (en) Method for manufacturing a metal-oxide semiconductor transistor of a metal gate
JP2597931B2 (ja) 高速度工具鋼のチタンコーティング被膜の除去剤
CN106011802B (zh) 化学镀镍浴以及用该化学镀镍浴进行的化学镀法
BE1028711A1 (fr) Composition détergente pour l'élimination des biofilms sur des installations industrielles
TW200629483A (en) Semiconductor storage device and method for manufacturing the same
TWI577831B (zh) 表面處理溶液
BR112022024804A2 (pt) Processo para a preparação de moldes de lítio metálico e liga de lítio
CN1914359A (zh) 封孔处理剂、封孔处理方法、及用该处理剂处理的印刷基板
JP7011484B2 (ja) 電気銅めっき浴および電気銅めっき皮膜
TW200303939A (en) Nickel electroplating solution
FR3105262B1 (fr) Procédé et installation de traitement d’une pièce en métal ferreux
KR100521894B1 (ko) 판형상 부재의 반송장치

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20221125

PLFP Fee payment

Year of fee payment: 3