TW200714699A - Process and composition for electrochemical mechanical polishing - Google Patents

Process and composition for electrochemical mechanical polishing

Info

Publication number
TW200714699A
TW200714699A TW095137957A TW95137957A TW200714699A TW 200714699 A TW200714699 A TW 200714699A TW 095137957 A TW095137957 A TW 095137957A TW 95137957 A TW95137957 A TW 95137957A TW 200714699 A TW200714699 A TW 200714699A
Authority
TW
Taiwan
Prior art keywords
composition
conductive material
material layer
substrate
mechanical polishing
Prior art date
Application number
TW095137957A
Other languages
Chinese (zh)
Inventor
Feng Q Liu
tian-bao Du
Alain Duboust
Wei-Yung Hsu
Jun-Zi Zhao
Junzi Zhao
Robert A Ewald
Yuan A Tian
You Wang
Zhihong Wang
Jie Diao
Daxin Mao
Stan D Tsai
Lakshmanan Karuppiah
Liang Yuh Chen
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/251,630 external-priority patent/US20060249394A1/en
Priority claimed from US11/312,823 external-priority patent/US7390429B2/en
Priority claimed from US11/356,352 external-priority patent/US20060169597A1/en
Priority claimed from US11/389,867 external-priority patent/US20060249395A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200714699A publication Critical patent/TW200714699A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding

Abstract

Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
TW095137957A 2005-10-14 2006-10-14 Process and composition for electrochemical mechanical polishing TW200714699A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US11/251,630 US20060249394A1 (en) 2005-05-05 2005-10-14 Process and composition for electrochemical mechanical polishing
US72900905P 2005-10-21 2005-10-21
US11/312,823 US7390429B2 (en) 2003-06-06 2005-12-19 Method and composition for electrochemical mechanical polishing processing
US11/356,352 US20060169597A1 (en) 2001-03-14 2006-02-15 Method and composition for polishing a substrate
US11/389,867 US20060249395A1 (en) 2005-05-05 2006-03-27 Process and composition for electrochemical mechanical polishing

Publications (1)

Publication Number Publication Date
TW200714699A true TW200714699A (en) 2007-04-16

Family

ID=37963117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137957A TW200714699A (en) 2005-10-14 2006-10-14 Process and composition for electrochemical mechanical polishing

Country Status (2)

Country Link
TW (1) TW200714699A (en)
WO (1) WO2007047454A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411705B (en) * 2007-11-27 2013-10-11 Mec Co Ltd Etchant
TWI470046B (en) * 2011-07-28 2015-01-21
TWI568842B (en) * 2014-08-19 2017-02-01 富士軟片平面解決方案有限責任公司 Reduction in large particle counts in polishing slurries

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
TW486514B (en) * 1999-06-16 2002-05-11 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
US6551935B1 (en) * 2000-08-31 2003-04-22 Micron Technology, Inc. Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
JP3807295B2 (en) * 2001-11-30 2006-08-09 ソニー株式会社 Polishing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411705B (en) * 2007-11-27 2013-10-11 Mec Co Ltd Etchant
TWI470046B (en) * 2011-07-28 2015-01-21
TWI568842B (en) * 2014-08-19 2017-02-01 富士軟片平面解決方案有限責任公司 Reduction in large particle counts in polishing slurries
US9914852B2 (en) 2014-08-19 2018-03-13 Fujifilm Planar Solutions, LLC Reduction in large particle counts in polishing slurries
US10167415B2 (en) 2014-08-19 2019-01-01 Fujifilm Planar Solutions, LLC Reduction in large particle counts in polishing slurries

Also Published As

Publication number Publication date
WO2007047454A2 (en) 2007-04-26
WO2007047454A3 (en) 2008-01-17

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