FR3036530B1 - Procede de realisation de cellules memoires du type a programmation unique comportant des condensateurs mos et circuit integre correspondant - Google Patents

Procede de realisation de cellules memoires du type a programmation unique comportant des condensateurs mos et circuit integre correspondant Download PDF

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Publication number
FR3036530B1
FR3036530B1 FR1554457A FR1554457A FR3036530B1 FR 3036530 B1 FR3036530 B1 FR 3036530B1 FR 1554457 A FR1554457 A FR 1554457A FR 1554457 A FR1554457 A FR 1554457A FR 3036530 B1 FR3036530 B1 FR 3036530B1
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Prior art keywords
integrated circuit
memory cells
mos capacitors
programming memory
corresponding integrated
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Expired - Fee Related
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FR1554457A
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FR3036530A1 (fr
Inventor
Stephane Denorme
Philippe Candelier
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STMicroelectronics SA
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STMicroelectronics SA
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Priority to FR1554457A priority Critical patent/FR3036530B1/fr
Priority to CN201520951130.3U priority patent/CN205140992U/zh
Priority to US14/952,662 priority patent/US9589968B2/en
Priority to CN201510831353.0A priority patent/CN106169474B/zh
Publication of FR3036530A1 publication Critical patent/FR3036530A1/fr
Priority to US15/413,497 priority patent/US9881928B2/en
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Publication of FR3036530B1 publication Critical patent/FR3036530B1/fr
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FR1554457A 2015-05-19 2015-05-19 Procede de realisation de cellules memoires du type a programmation unique comportant des condensateurs mos et circuit integre correspondant Expired - Fee Related FR3036530B1 (fr)

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US14/952,662 US9589968B2 (en) 2015-05-19 2015-11-25 Method for producing one-time-programmable memory cells and corresponding integrated circuit
CN201510831353.0A CN106169474B (zh) 2015-05-19 2015-11-25 用于制造包括mos电容器的一次性可编程类型的存储器单元的方法以及对应的集成电路
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FR3036530B1 (fr) * 2015-05-19 2018-03-02 Stmicroelectronics Sa Procede de realisation de cellules memoires du type a programmation unique comportant des condensateurs mos et circuit integre correspondant
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US10818592B1 (en) * 2019-04-29 2020-10-27 Nanya Technology Corporation Semiconductor memory device including decoupling capacitor array arranged overlying one-time programmable device

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US8748258B2 (en) * 2011-12-12 2014-06-10 International Business Machines Corporation Method and structure for forming on-chip high quality capacitors with ETSOI transistors
US8927422B2 (en) * 2012-06-18 2015-01-06 International Business Machines Corporation Raised silicide contact
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US9761595B2 (en) * 2013-02-21 2017-09-12 Infineon Technologies Ag One-time programming device and a semiconductor device
US9281074B2 (en) * 2013-05-16 2016-03-08 Ememory Technology Inc. One time programmable memory cell capable of reducing leakage current and preventing slow bit response
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US20160343720A1 (en) 2016-11-24
US9589968B2 (en) 2017-03-07
CN106169474A (zh) 2016-11-30
CN106169474B (zh) 2019-10-11
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