FR3025353B1 - Memoire non volatile composite a effacement par page ou par mot - Google Patents
Memoire non volatile composite a effacement par page ou par motInfo
- Publication number
- FR3025353B1 FR3025353B1 FR1458239A FR1458239A FR3025353B1 FR 3025353 B1 FR3025353 B1 FR 3025353B1 FR 1458239 A FR1458239 A FR 1458239A FR 1458239 A FR1458239 A FR 1458239A FR 3025353 B1 FR3025353 B1 FR 3025353B1
- Authority
- FR
- France
- Prior art keywords
- erase
- word
- page
- composite memory
- volatile composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/20—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B41/23—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B41/27—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Non-Volatile Memory (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1458239A FR3025353B1 (fr) | 2014-09-03 | 2014-09-03 | Memoire non volatile composite a effacement par page ou par mot |
US14/795,742 US9460798B2 (en) | 2014-09-03 | 2015-07-09 | Page or word-erasable composite non-volatile memory |
CN201510459611.7A CN105390154B (zh) | 2014-09-03 | 2015-07-30 | 页或字可擦除复合非易失性存储器 |
CN201520565163.4U CN204991153U (zh) | 2014-09-03 | 2015-07-30 | 存储器单元和非易失性存储器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1458239A FR3025353B1 (fr) | 2014-09-03 | 2014-09-03 | Memoire non volatile composite a effacement par page ou par mot |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3025353A1 FR3025353A1 (fr) | 2016-03-04 |
FR3025353B1 true FR3025353B1 (fr) | 2016-09-09 |
Family
ID=51688349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1458239A Expired - Fee Related FR3025353B1 (fr) | 2014-09-03 | 2014-09-03 | Memoire non volatile composite a effacement par page ou par mot |
Country Status (3)
Country | Link |
---|---|
US (1) | US9460798B2 (fr) |
CN (2) | CN204991153U (fr) |
FR (1) | FR3025353B1 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3025353B1 (fr) * | 2014-09-03 | 2016-09-09 | Stmicroelectronics Rousset | Memoire non volatile composite a effacement par page ou par mot |
TWI607445B (zh) * | 2016-03-28 | 2017-12-01 | 卡比科技有限公司 | 非揮發性記憶體裝置及其運作方法 |
US10478893B1 (en) | 2017-01-13 | 2019-11-19 | General Electric Company | Additive manufacturing using a selective recoater |
CN107393925A (zh) * | 2017-08-09 | 2017-11-24 | 上海华虹宏力半导体制造有限公司 | 闪存及闪存的制备方法 |
FR3070537A1 (fr) * | 2017-08-28 | 2019-03-01 | Stmicroelectronics (Rousset) Sas | Memoire non-volatile a encombrement restreint |
US10847225B2 (en) * | 2018-06-20 | 2020-11-24 | Microchip Technology Incorporated | Split-gate flash memory cell with improved read performance |
CN112786602B (zh) * | 2019-11-06 | 2022-08-26 | 成都锐成芯微科技股份有限公司 | 单层多晶硅非易失性存储单元及其存储器 |
CN111192616B (zh) * | 2020-04-14 | 2020-10-02 | 深圳市芯天下技术有限公司 | Nor flash芯片及在其擦除过程中消除过擦除的方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5182725A (en) | 1987-11-20 | 1993-01-26 | Mitsubishi Denki Kabushiki Kaisha | Nonvolatile semiconductor memory device with reduced variation in source potential of floating gate type memory transistor and operating method therefor |
US6433382B1 (en) | 1995-04-06 | 2002-08-13 | Motorola, Inc. | Split-gate vertically oriented EEPROM device and process |
TW546778B (en) | 2001-04-20 | 2003-08-11 | Koninkl Philips Electronics Nv | Two-transistor flash cell |
FR2844090A1 (fr) | 2002-08-27 | 2004-03-05 | St Microelectronics Sa | Cellule memoire pour registre non volatile a lecture rapide |
US6788576B2 (en) * | 2002-10-28 | 2004-09-07 | Tower Semiconductor Ltd. | Complementary non-volatile memory cell |
US6894339B2 (en) | 2003-01-02 | 2005-05-17 | Actrans System Inc. | Flash memory with trench select gate and fabrication process |
US7358134B2 (en) | 2003-09-15 | 2008-04-15 | Powerchip Semiconductor Corp. | Split gate flash memory cell and manufacturing method thereof |
US7126188B2 (en) | 2004-05-27 | 2006-10-24 | Skymedi Corporation | Vertical split gate memory cell and manufacturing method thereof |
US8139408B2 (en) | 2006-09-05 | 2012-03-20 | Semiconductor Components Industries, L.L.C. | Scalable electrically eraseable and programmable memory |
US7696044B2 (en) | 2006-09-19 | 2010-04-13 | Sandisk Corporation | Method of making an array of non-volatile memory cells with floating gates formed of spacers in substrate trenches |
US7723774B2 (en) | 2007-07-10 | 2010-05-25 | Silicon Storage Technology, Inc. | Non-diffusion junction split-gate nonvolatile memory cells and arrays, methods of programming, erasing, and reading thereof, and methods of manufacture |
US7800159B2 (en) | 2007-10-24 | 2010-09-21 | Silicon Storage Technology, Inc. | Array of contactless non-volatile memory cells |
US8072811B2 (en) | 2008-05-07 | 2011-12-06 | Aplus Flash Technology, Inc, | NAND based NMOS NOR flash memory cell, a NAND based NMOS NOR flash memory array, and a method of forming a NAND based NMOS NOR flash memory array |
KR20100115612A (ko) | 2009-04-20 | 2010-10-28 | 삼성전자주식회사 | 프로그램 디스터브를 줄일 수 있는 비휘발성 반도체 메모리 장치 및 이 장치의 프로그램 방법 |
US20110199830A1 (en) * | 2010-02-12 | 2011-08-18 | Peter Wung Lee | Flotox-based, bit-alterable, combo flash and eeprom memory |
US8958245B2 (en) | 2010-06-17 | 2015-02-17 | Ememory Technology Inc. | Logic-based multiple time programming memory cell compatible with generic CMOS processes |
KR101187641B1 (ko) * | 2011-03-04 | 2012-10-08 | 에스케이하이닉스 주식회사 | 비휘발성 메모리 장치, 그 제조 방법, 및 그 동작 방법 |
WO2013079020A1 (fr) * | 2011-12-02 | 2013-06-06 | Tsinghua University | Structure matricielle de mémoire flash non-ou, mémoire flash non volatile mélangée, et système de mémoire comprenant ces mémoires |
US8901634B2 (en) * | 2012-03-05 | 2014-12-02 | Stmicroelectronics (Rousset) Sas | Nonvolatile memory cells with a vertical selection gate of variable depth |
FR2987696B1 (fr) | 2012-03-05 | 2014-11-21 | St Microelectronics Rousset | Procede de lecture ecriture de cellules memoire non volatiles |
JP5972700B2 (ja) | 2012-07-31 | 2016-08-17 | ルネサスエレクトロニクス株式会社 | メモリ装置 |
US20140198583A1 (en) | 2013-01-17 | 2014-07-17 | Infineon Technologies Ag | Method and System for Reducing the Size of Nonvolatile Memories |
TW201508753A (zh) | 2013-08-29 | 2015-03-01 | Chrong-Jung Lin | 記憶體元件、記憶體陣列與其操作方法 |
FR3021803B1 (fr) * | 2014-05-28 | 2017-10-13 | Stmicroelectronics Rousset | Cellules memoire jumelles accessibles individuellement en lecture |
FR3021804B1 (fr) * | 2014-05-28 | 2017-09-01 | Stmicroelectronics Rousset | Cellule memoire non volatile duale comprenant un transistor d'effacement |
FR3025353B1 (fr) * | 2014-09-03 | 2016-09-09 | Stmicroelectronics Rousset | Memoire non volatile composite a effacement par page ou par mot |
-
2014
- 2014-09-03 FR FR1458239A patent/FR3025353B1/fr not_active Expired - Fee Related
-
2015
- 2015-07-09 US US14/795,742 patent/US9460798B2/en active Active
- 2015-07-30 CN CN201520565163.4U patent/CN204991153U/zh not_active Withdrawn - After Issue
- 2015-07-30 CN CN201510459611.7A patent/CN105390154B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
FR3025353A1 (fr) | 2016-03-04 |
US9460798B2 (en) | 2016-10-04 |
CN105390154B (zh) | 2019-05-07 |
US20160064089A1 (en) | 2016-03-03 |
CN105390154A (zh) | 2016-03-09 |
CN204991153U (zh) | 2016-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20160304 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |
|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20210506 |