FR3009429B1 - Procede de fabrication d'un patin de liaison pour une liaison par thermo-compression et patin obtenu - Google Patents

Procede de fabrication d'un patin de liaison pour une liaison par thermo-compression et patin obtenu

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Publication number
FR3009429B1
FR3009429B1 FR1357653A FR1357653A FR3009429B1 FR 3009429 B1 FR3009429 B1 FR 3009429B1 FR 1357653 A FR1357653 A FR 1357653A FR 1357653 A FR1357653 A FR 1357653A FR 3009429 B1 FR3009429 B1 FR 3009429B1
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France
Prior art keywords
patin
skate
thermo
lining
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1357653A
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English (en)
Other versions
FR3009429A1 (fr
Inventor
Christoph Schelling
David Borowsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
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Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR3009429A1 publication Critical patent/FR3009429A1/fr
Application granted granted Critical
Publication of FR3009429B1 publication Critical patent/FR3009429B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/921—Connecting a surface with connectors of different types
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
FR1357653A 2012-08-01 2013-08-01 Procede de fabrication d'un patin de liaison pour une liaison par thermo-compression et patin obtenu Expired - Fee Related FR3009429B1 (fr)

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DE102014211643A1 (de) 2014-06-18 2015-12-24 Robert Bosch Gmbh Trägermodul für ein Halbleiterbauteil, Herstellungsverfahren für ein Trägermodul und Verfahren zum Befestigen eines Halbleiterbauteils an einem Trägermodul
WO2016022971A1 (fr) 2014-08-08 2016-02-11 The Board Of Trustees Of The Leland Stanford Junior University Protéines de fusion sirp alpha-anticorps
CN105355613B (zh) * 2015-10-27 2018-08-10 上海华虹宏力半导体制造有限公司 铝锗共晶键合的方法
DE102016112198A1 (de) * 2016-07-04 2018-01-04 Endress+Hauser Gmbh+Co. Kg Druckaufnehmer
US10056310B2 (en) * 2016-09-26 2018-08-21 International Business Machines Corporation Electrolytic seal
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US10995152B2 (en) 2016-10-26 2021-05-04 The Board Of Trustees Of The Leland Stanford Junior University Modified immunoglobulin hinge regions to reduce hemagglutination
WO2018165015A1 (fr) 2017-03-09 2018-09-13 The Board Of Trustees Of The Leland Stanford Junior University Traitement de tumeurs cérébrales pédiatriques avec ciblage de la voie cd47
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US20140035167A1 (en) 2014-02-06
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FR3009429A1 (fr) 2015-02-06
DE102012213566A1 (de) 2014-02-06

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