FR3000543B1 - Systeme de capteur comportant un dispositif de couverture - Google Patents
Systeme de capteur comportant un dispositif de couvertureInfo
- Publication number
- FR3000543B1 FR3000543B1 FR1363137A FR1363137A FR3000543B1 FR 3000543 B1 FR3000543 B1 FR 3000543B1 FR 1363137 A FR1363137 A FR 1363137A FR 1363137 A FR1363137 A FR 1363137A FR 3000543 B1 FR3000543 B1 FR 3000543B1
- Authority
- FR
- France
- Prior art keywords
- sensor system
- cover device
- cover
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210224424 DE102012224424A1 (de) | 2012-12-27 | 2012-12-27 | Sensorsystem und Abdeckvorrichtung für ein Sensorsystem |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3000543A1 FR3000543A1 (fr) | 2014-07-04 |
FR3000543B1 true FR3000543B1 (fr) | 2017-06-23 |
Family
ID=50683502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1363137A Expired - Fee Related FR3000543B1 (fr) | 2012-12-27 | 2013-12-20 | Systeme de capteur comportant un dispositif de couverture |
Country Status (5)
Country | Link |
---|---|
US (1) | US10775407B2 (fr) |
CN (1) | CN103900628B (fr) |
DE (1) | DE102012224424A1 (fr) |
FR (1) | FR3000543B1 (fr) |
IT (1) | ITMI20132149A1 (fr) |
Families Citing this family (40)
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DE102013206689A1 (de) * | 2013-04-15 | 2014-10-16 | Robert Bosch Gmbh | Sensor und Verfahren zum Herstellen eines Sensors |
CN104749390B (zh) * | 2013-12-31 | 2020-07-03 | 森萨塔科技(常州)有限公司 | 定位框架结构 |
DE102014222899B4 (de) * | 2014-11-10 | 2018-03-22 | Robert Bosch Gmbh | Sensorgehäuse |
US9560737B2 (en) | 2015-03-04 | 2017-01-31 | International Business Machines Corporation | Electronic package with heat transfer element(s) |
DE102015207857A1 (de) * | 2015-04-29 | 2016-11-03 | Robert Bosch Gmbh | Thermoelektrische Vorrichtung sowie Herstellungsverfahren derselben |
US9496230B1 (en) * | 2015-04-30 | 2016-11-15 | International Business Machines Corporation | Light sensitive switch for semiconductor package tamper detection |
US10426037B2 (en) | 2015-07-15 | 2019-09-24 | International Business Machines Corporation | Circuitized structure with 3-dimensional configuration |
DE102015218068A1 (de) * | 2015-09-21 | 2017-03-23 | Robert Bosch Gmbh | Bodenkontaktiervorrichtung und Verfahren zum Aussenden eines Signals |
US9578764B1 (en) | 2015-09-25 | 2017-02-21 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) |
US9591776B1 (en) | 2015-09-25 | 2017-03-07 | International Business Machines Corporation | Enclosure with inner tamper-respondent sensor(s) |
US10098235B2 (en) | 2015-09-25 | 2018-10-09 | International Business Machines Corporation | Tamper-respondent assemblies with region(s) of increased susceptibility to damage |
US10175064B2 (en) | 2015-09-25 | 2019-01-08 | International Business Machines Corporation | Circuit boards and electronic packages with embedded tamper-respondent sensor |
US9911012B2 (en) | 2015-09-25 | 2018-03-06 | International Business Machines Corporation | Overlapping, discrete tamper-respondent sensors |
US10172239B2 (en) | 2015-09-25 | 2019-01-01 | International Business Machines Corporation | Tamper-respondent sensors with formed flexible layer(s) |
US9924591B2 (en) | 2015-09-25 | 2018-03-20 | International Business Machines Corporation | Tamper-respondent assemblies |
US9894749B2 (en) | 2015-09-25 | 2018-02-13 | International Business Machines Corporation | Tamper-respondent assemblies with bond protection |
US10143090B2 (en) | 2015-10-19 | 2018-11-27 | International Business Machines Corporation | Circuit layouts of tamper-respondent sensors |
US9978231B2 (en) | 2015-10-21 | 2018-05-22 | International Business Machines Corporation | Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s) |
US9913389B2 (en) | 2015-12-01 | 2018-03-06 | International Business Corporation Corporation | Tamper-respondent assembly with vent structure |
US9555606B1 (en) | 2015-12-09 | 2017-01-31 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US10327343B2 (en) | 2015-12-09 | 2019-06-18 | International Business Machines Corporation | Applying pressure to adhesive using CTE mismatch between components |
US9554477B1 (en) | 2015-12-18 | 2017-01-24 | International Business Machines Corporation | Tamper-respondent assemblies with enclosure-to-board protection |
US9916744B2 (en) | 2016-02-25 | 2018-03-13 | International Business Machines Corporation | Multi-layer stack with embedded tamper-detect protection |
US9904811B2 (en) | 2016-04-27 | 2018-02-27 | International Business Machines Corporation | Tamper-proof electronic packages with two-phase dielectric fluid |
US9881880B2 (en) | 2016-05-13 | 2018-01-30 | International Business Machines Corporation | Tamper-proof electronic packages with stressed glass component substrate(s) |
US9913370B2 (en) | 2016-05-13 | 2018-03-06 | International Business Machines Corporation | Tamper-proof electronic packages formed with stressed glass |
DE102016209840A1 (de) * | 2016-06-03 | 2017-12-07 | Continental Teves Ag & Co. Ohg | Sensor, Verfahren und Sensoranordnung |
US9858776B1 (en) | 2016-06-28 | 2018-01-02 | International Business Machines Corporation | Tamper-respondent assembly with nonlinearity monitoring |
US10321589B2 (en) | 2016-09-19 | 2019-06-11 | International Business Machines Corporation | Tamper-respondent assembly with sensor connection adapter |
US10271424B2 (en) | 2016-09-26 | 2019-04-23 | International Business Machines Corporation | Tamper-respondent assemblies with in situ vent structure(s) |
US10299372B2 (en) | 2016-09-26 | 2019-05-21 | International Business Machines Corporation | Vented tamper-respondent assemblies |
US9999124B2 (en) | 2016-11-02 | 2018-06-12 | International Business Machines Corporation | Tamper-respondent assemblies with trace regions of increased susceptibility to breaking |
NL2017885B1 (en) * | 2016-11-29 | 2018-06-11 | Sencio B V | Sensor package and method of manufacturing the same |
JP6857802B2 (ja) * | 2016-12-28 | 2021-04-14 | パナソニックIpマネジメント株式会社 | 換気扇 |
US10327329B2 (en) | 2017-02-13 | 2019-06-18 | International Business Machines Corporation | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor |
US10306753B1 (en) | 2018-02-22 | 2019-05-28 | International Business Machines Corporation | Enclosure-to-board interface with tamper-detect circuit(s) |
US11122682B2 (en) | 2018-04-04 | 2021-09-14 | International Business Machines Corporation | Tamper-respondent sensors with liquid crystal polymer layers |
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US11177210B2 (en) * | 2019-12-31 | 2021-11-16 | Nxp B.V. | Integrated circuit with non-functional structures |
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CA2829388C (fr) * | 2011-03-09 | 2018-09-25 | Flex Lighting Ii, Llc | Dispositif electroluminescent dote d'un profil de flux lumineux reglable |
EP2697155B1 (fr) * | 2011-04-14 | 2017-01-11 | Robert Bosch GmbH | Boîtier de mems ou boîtier de capteur muni d'un trou d'interconnexion électrique intra-capot et procédé pour celui-ci |
GB2500706A (en) * | 2012-03-30 | 2013-10-02 | Ibm | Concentrating solar photovoltaic-thermal hybrid systems |
GB201205738D0 (en) * | 2012-03-30 | 2012-05-16 | Ibm | Photovoltaic thermal hybrid solar receivers |
GB2500703A (en) * | 2012-03-30 | 2013-10-02 | Ibm | Cooling devices for photovoltaic modules |
-
2012
- 2012-12-27 DE DE201210224424 patent/DE102012224424A1/de not_active Withdrawn
-
2013
- 2013-12-19 US US14/135,244 patent/US10775407B2/en active Active
- 2013-12-20 IT ITMI20132149 patent/ITMI20132149A1/it unknown
- 2013-12-20 FR FR1363137A patent/FR3000543B1/fr not_active Expired - Fee Related
- 2013-12-26 CN CN201310736707.4A patent/CN103900628B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN103900628B (zh) | 2020-04-24 |
US10775407B2 (en) | 2020-09-15 |
FR3000543A1 (fr) | 2014-07-04 |
US20140184263A1 (en) | 2014-07-03 |
ITMI20132149A1 (it) | 2014-06-28 |
DE102012224424A1 (de) | 2014-07-17 |
CN103900628A (zh) | 2014-07-02 |
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