FR2980727B1 - Composition de fondant amine, acide carboxylique et procede de soudage - Google Patents

Composition de fondant amine, acide carboxylique et procede de soudage

Info

Publication number
FR2980727B1
FR2980727B1 FR1259147A FR1259147A FR2980727B1 FR 2980727 B1 FR2980727 B1 FR 2980727B1 FR 1259147 A FR1259147 A FR 1259147A FR 1259147 A FR1259147 A FR 1259147A FR 2980727 B1 FR2980727 B1 FR 2980727B1
Authority
FR
France
Prior art keywords
founder
amine
composition
carboxylic acid
welding process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1259147A
Other languages
English (en)
Other versions
FR2980727A1 (fr
Inventor
Kim Sang Ho
Mark R Winkle
Avin V Dhoble
Michael K Gallagher
Xiang-Qian Liu
Asghar A Peera
Glenn Robinson
Ian Tomlinson
David D Fleming
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Original Assignee
Angus Chemical Co
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Angus Chemical Co, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Angus Chemical Co
Publication of FR2980727A1 publication Critical patent/FR2980727A1/fr
Application granted granted Critical
Publication of FR2980727B1 publication Critical patent/FR2980727B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C211/00—Compounds containing amino groups bound to a carbon skeleton
    • C07C211/01—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms
    • C07C211/02—Compounds containing amino groups bound to a carbon skeleton having amino groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
    • C07C211/09—Diamines
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
    • C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
    • C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C215/04—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated
    • C07C215/06—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic
    • C07C215/10—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being saturated and acyclic with one amino group and at least two hydroxy groups bound to the carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
    • C07C215/02—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C215/22—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being unsaturated
    • C07C215/28—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being unsaturated and containing six-membered aromatic rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR1259147A 2011-09-30 2012-09-28 Composition de fondant amine, acide carboxylique et procede de soudage Expired - Fee Related FR2980727B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/250,184 US8430294B2 (en) 2011-09-30 2011-09-30 Amine, carboxylic acid flux composition and method of soldering

Publications (2)

Publication Number Publication Date
FR2980727A1 FR2980727A1 (fr) 2013-04-05
FR2980727B1 true FR2980727B1 (fr) 2014-05-09

Family

ID=47827358

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1259147A Expired - Fee Related FR2980727B1 (fr) 2011-09-30 2012-09-28 Composition de fondant amine, acide carboxylique et procede de soudage

Country Status (7)

Country Link
US (1) US8430294B2 (fr)
JP (1) JP6071377B2 (fr)
KR (1) KR101992639B1 (fr)
CN (1) CN103056559B (fr)
DE (1) DE102012019260A1 (fr)
FR (1) FR2980727B1 (fr)
TW (1) TWI450879B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8434667B2 (en) * 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Polyamine, carboxylic acid flux composition and method of soldering
EP2886244A1 (fr) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Procédé de fixation d'un composant sur un substrat
US20180318968A1 (en) * 2017-05-08 2018-11-08 International Business Machines Corporation Solder for Limiting Substrate Damage Due to Discrete Failure
JP6583391B2 (ja) * 2017-11-14 2019-10-02 千住金属工業株式会社 フラックス、やに入りはんだおよびフラックスコートペレット

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Also Published As

Publication number Publication date
JP6071377B2 (ja) 2017-02-01
CN103056559A (zh) 2013-04-24
CN103056559B (zh) 2016-01-06
TWI450879B (zh) 2014-09-01
JP2013078798A (ja) 2013-05-02
KR101992639B1 (ko) 2019-06-25
KR20130035946A (ko) 2013-04-09
DE102012019260A1 (de) 2013-04-04
FR2980727A1 (fr) 2013-04-05
US20130082093A1 (en) 2013-04-04
US8430294B2 (en) 2013-04-30
TW201319019A (zh) 2013-05-16

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Legal Events

Date Code Title Description
TQ Partial transmission of property

Owner name: DOW GLOBAL TECHNOLOGIES LLC, US

Effective date: 20150210

Owner name: ROHM AND HAAS ELECTRONIC MATERIALS LLC, US

Effective date: 20150210

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

ST Notification of lapse

Effective date: 20210506